{ "licence": "CC BY 4.0 — https://creativecommons.org/licenses/by/4.0/", "attribution": "China Semiconductor Tracker, Takshashila Institution (https://fabs-china.pranaykotas.com)", "exported": "2026-10-11", "facilities": [ { "id": "smic-lingang", "name_en": "SMIC Shanghai (Lingang)", "name_zh": "中芯临港", "name_pinyin": "Zhōngxīn Língǎng", "company_en": "SMIC", "company_zh": "中芯国际集成电路制造有限公司", "company_pinyin": "Zhōngxīn Guójì Jíchéng Diànlù Zhìzào Yǒuxiàn Gōngsī", "partners": "Shanghai Municipal Government", "location": { "city": "Shanghai", "province": "Shanghai Municipality", "lat": 30.885, "lon": 121.921 }, "type": "Fab", "category": "JV", "capability": "12-inch (300mm) wafer foundry, 28nm and above (per SMIC filings: 28纳米及以上)", "investment": { "total_usd_million": 8870, "total_rmb_100m": 500, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": true, "date_added": "2020-12-18", "list": "US Commerce BIS" }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "capacity": { "basis": "planned", "wafers_per_month": 100000, "wafer_size": "300mm", "as_of": "2021-09", "note": "planned full build per JV framework agreement; not installed; no installed figure disclosed" }, "narrative": { "significance": "SMIC's largest single fab commitment — a $8.87B (reported domestically as over ¥50 billion total investment), 100,000 wafer/month 28nm-and-below joint venture with the Shanghai municipal government in the Lingang Special Area, formally incorporated as Zhongxin Dongfang Integrated Circuit Manufacturing Co. (中芯东方集成电路制造有限公司).", "what_it_makes": "12-inch (300mm) wafers at 28nm and more mature process nodes for foundry customers.", "why_it_matters": "Part of SMIC's 2020-2022 wave of four mega-fab JVs (Shanghai, Beijing, Tianjin, Shenzhen) aimed at building mature-node capacity for domestic demand, launched in the same window SMIC itself was added to the US Entity List. This entry covers the operational Phase 1 (20,000 wafers/month, running since late 2024) specifically — the site's actively-under-construction Phase 2 expansion is tracked as its own entry, `smic-lingang-phase2`, so this one's 'Operational' status isn't read as covering the whole site." }, "milestones": [ { "date": "2021-09-03", "event": "SMIC signs cooperation agreement with the Shanghai Lingang Management Committee for a $8.87 billion, 100,000 wafer/month 12-inch fab; registered capital $5.5 billion, SMIC holding no less than 51%" }, { "date": "2021-11-12", "event": "Joint venture formally incorporated as Zhongxin Dongfang Integrated Circuit Manufacturing Co. (中芯东方集成电路制造有限公司)" }, { "date": "2024-12-01", "event": "Phase 1 (20,000 wafers/month) reaches production" }, { "date": "2026-07-08", "event": "China Construction Eighth Engineering Bureau (中建八局) wins the Phase 2 general contract for the Fab9-P3 building and Fab9-P4 foundation works in the project's northern district" } ], "complexity": { "technology_difficulty": 3, "foreign_dependence": 4, "capital_intensity": 5 }, "dates": { "announced": "2021-09-03", "approved": "2021-11-12", "construction_start": null, "original_expected_completion": null, "date_completion": "2024-12-01" }, "sources": [ { "url": "https://www.tomshardware.com/news/smic-to-build-chinas-largest-fab", "title": "SMIC to Build China's Largest Fab For $8.87 Billion", "date": "2021-09-06" }, { "url": "https://www.scmp.com/tech/tech-war/article/3147472/chinas-top-chip-maker-smic-build-us9-billion-factory-shanghai-amid", "title": "China's top chip maker SMIC plans US$9 billion plant in Shanghai", "date": "2021-09-06" }, { "url": "https://en.wikipedia.org/wiki/Semiconductor_Manufacturing_International_Corporation", "title": "Semiconductor Manufacturing International Corporation (Wikipedia) — Entity List addition, 18 Dec 2020", "date": "2026-09-28" }, { "url": "https://finance.sina.com.cn/roll/2026-05-20/doc-inhypxkf1660944.shtml", "title": "从'沙子到芯片'的完整产业生态，上海临港'东方芯港'全产业链集群已然成型 (Sina Finance)", "date": "2026-05-20" }, { "url": "https://finance.sina.com.cn/money/bond/2026-06-30/doc-inifehiu4887824.shtml", "title": "上海临港新片区芯港集成晶圆制造项目正式开工 (Sina Finance)", "date": "2026-06-30" }, { "url": "https://static.cninfo.com.cn/finalpage/2021-09-03/1210968149.PDF", "title": "中芯国际关于自愿披露签订合作框架协议的公告 (临港)", "date": "2021-09-03" } ] }, { "id": "smic-beijing", "name_en": "SMIC Beijing (Jingcheng)", "name_zh": "中芯京城", "name_pinyin": "Zhōngxīn Jīngchéng", "company_en": "SMIC", "company_zh": "中芯国际集成电路制造有限公司", "company_pinyin": "Zhōngxīn Guójì Jíchéng Diànlù Zhìzào Yǒuxiàn Gōngsī", "partners": "Beijing E-Town International Investment & Development", "location": { "city": "Beijing", "province": "Beijing Municipality", "lat": 39.795, "lon": 116.507 }, "type": "Fab", "category": "JV", "capability": "12-inch (300mm) wafer foundry, 28nm and above", "investment": { "total_usd_million": 7600, "total_rmb_100m": 497, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": true, "date_added": "2020-12-18", "list": "US Commerce BIS" }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "capacity": { "basis": "planned", "wafers_per_month": 100000, "wafer_size": "300mm", "as_of": "2020-08", "note": "planned phase-1 target per framework agreement; not installed" }, "narrative": { "significance": "SMIC's Beijing expansion JV (中芯京城, 54.04% SMIC-owned), targeting 100,000 wafers/month of 12-inch, 28nm-and-above capacity in the Beijing Economic-Technological Development Area.", "what_it_makes": "12-inch (300mm) wafers at 28nm and more mature nodes for foundry customers.", "why_it_matters": "Reported investment figures vary slightly by source — $7.6 billion (Yicai) and $7.7 billion / RMB 49.7 billion (CnTechPost) — likely the same commitment described at slightly different points or currency conversions; both are given here since no source explicitly reconciles them. Phase 1 was already in use by late 2023; a separate Phase 2 land deal (early 2026) was reported at a total project investment of no less than ¥50 billion (¥40 billion in fixed-asset investment), targeting an annual output value of at least ¥6 billion once fully ramped." }, "milestones": [ { "date": "2021-02-23", "event": "Development of the $7.6-7.7 billion Beijing fab (SMIC Jingcheng) begins; first phase targeted for completion by 2024" }, { "date": "2023-11-01", "event": "Phase 1 confirmed in use, per Beijing E-Town Investment Holding disclosure" }, { "date": "2025-01-01", "event": "Tongzhou district officials commit to fully completing Phase 2's main structure, with equipment installation underway" } ], "complexity": { "technology_difficulty": 3, "foreign_dependence": 4, "capital_intensity": 5 }, "dates": { "announced": "2021-02-23", "approved": null, "construction_start": "2021-02-23", "original_expected_completion": "2024-12-31", "date_completion": "2023-11-01" }, "sources": [ { "url": "https://www.yicaiglobal.com/news/chinese-chipmaker-smic-to-build-usd76-billion-beijing-plant", "title": "Chinese Chipmaker SMIC to Build USD7.6 Billion Beijing Plant", "date": "2021-02-23" }, { "url": "https://cntechpost.com/2021/02/23/smic-builds-7-7-billion-fab-in-beijing-expected-to-be-completed-by-2024/", "title": "SMIC builds $7.7 billion fab in Beijing, first phase expected to be completed by 2024", "date": "2021-02-23" }, { "url": "https://www.cls.cn/detail/1946491", "title": "中芯国际扩产迎新进展！中芯京城二期工业用地成交 拟建项目总投资不低于500亿元 (Cailianshe)", "date": "2026-09-28" }, { "url": "https://www.uufund.com/News/Detail/NW202502183322504624", "title": "中芯国际位于北京的晶圆厂项目——中芯京城二期", "date": "2026-09-28" }, { "url": "https://static.cninfo.com.cn/finalpage/2020-08-01/1208115192.PDF", "title": "中芯国际 关于签订合作框架协议的公告 (北京亦庄)", "date": "2020-08-01" } ] }, { "id": "smic-tianjin", "name_en": "SMIC Tianjin (Xiqing)", "name_zh": "中芯西青", "name_pinyin": "Zhōngxīn Xīqīng", "company_en": "SMIC", "company_zh": "中芯国际集成电路制造有限公司", "company_pinyin": "Zhōngxīn Guójì Jíchéng Diànlù Zhìzào Yǒuxiàn Gōngsī", "partners": "Tianjin Xiqing District Government", "location": { "city": "Tianjin", "province": "Tianjin Municipality", "lat": 39.14, "lon": 117.01 }, "type": "Fab", "category": "State-Backed", "capability": "12-inch (300mm) wafer foundry, 0.18 micron to 28nm", "investment": { "total_usd_million": 7500, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": true, "date_added": "2020-12-18", "list": "US Commerce BIS" }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "capacity": { "basis": "planned", "wafers_per_month": 100000, "wafer_size": "300mm", "as_of": "2022-08", "note": "planned per framework agreement (28–180nm); not installed" }, "narrative": { "significance": "SMIC's fourth major mature-node fab of this expansion wave (中芯西青, 100% SMIC-owned), located in Tianjin's Xiqing Development Area.", "what_it_makes": "12-inch (300mm) wafers spanning 0.18 micron to 28nm process nodes.", "why_it_matters": "Extends SMIC's mature-node capacity — the segment least affected by advanced-lithography export controls — into a fourth Chinese municipality. Domestic trade coverage in early 2025 described all four of SMIC's 2020-2022-era mega-fab JVs (Lingang, Jingcheng, Xiqing, Shenzhen) as having begun reaching production in stages ('陆续达产') by that point, with Xiqing's full-capacity ramp (达产) targeted for end of 2027." }, "milestones": [ { "date": "2022-08-26", "event": "SMIC signs framework agreement to invest $7.5 billion in a new 12-inch fab in Tianjin's Xiqing district, initial registered capital $5 billion" }, { "date": "2022-09-01", "event": "Construction begins on the Tianjin Xiqing fab" }, { "date": "2023-01-01", "event": "Earliest reported production start for the Xiqing fab, per Chinese industry trade coverage" }, { "date": "2027-12-31", "event": "Target date for the Xiqing fab to reach full planned capacity (100,000 wafers/month)" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 3, "capital_intensity": 5 }, "dates": { "announced": "2022-08-26", "approved": "2022-08-26", "construction_start": "2022-09-01", "original_expected_completion": "2027-12-31", "date_completion": "2023-01-01" }, "sources": [ { "url": "https://www.scmp.com/tech/big-tech/article/3190397/chinese-chip-maker-smic-boosts-expansion-us75-billion-investment-new", "title": "Chinese chip maker SMIC boosts expansion with US$7.5 billion investment in new Tianjin plant amid concerns of US sanctions", "date": "2022-08-26" }, { "url": "https://www.scmp.com/tech/big-tech/article/3194135/chinas-biggest-chip-maker-smic-pushes-ahead-construction-new-tianjin", "title": "China's biggest chip maker SMIC pushes ahead with construction of new Tianjin plant despite Covid-19 lockdowns", "date": "2022-09-01" }, { "url": "https://www.eefocus.com/article/525303.html", "title": "中芯国际75亿美元项目落地，解读背后的西青'芯'速度 (EEFocus)", "date": "2026-09-28" }, { "url": "https://finance.sina.com.cn/roll/2025-01-06/doc-inecztfx8865924.shtml", "title": "国内四条12英寸晶圆生产线投产！ (Sina Finance)", "date": "2025-01-06" }, { "url": "https://static.cninfo.com.cn/finalpage/2022-08-27/1214426555.PDF", "title": "中芯国际关于签订合作框架协议的公告 (天津西青)", "date": "2022-08-27" } ] }, { "id": "smic-shenzhen", "name_en": "SMIC Shenzhen", "name_zh": "中芯深圳", "name_pinyin": "Zhōngxīn Shēnzhèn", "company_en": "SMIC", "company_zh": "中芯国际集成电路制造有限公司", "company_pinyin": "Zhōngxīn Guójì Jíchéng Diànlù Zhìzào Yǒuxiàn Gōngsī", "partners": "Shenzhen Municipal Government", "location": { "city": "Shenzhen", "province": "Guangdong", "lat": 22.543, "lon": 114.058 }, "type": "Fab", "category": "JV", "capability": "12-inch (300mm) wafer foundry, 28nm — plus the site's older 8-inch (200mm) line (operational since Dec 2014, 0.35µm–90nm, ~55,000 wafers/month planning basis)", "investment": { "total_usd_million": 2350, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": true, "date_added": "2020-12-18", "list": "US Commerce BIS" }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [ { "year": 2015, "node": "110nm (0.11µm, 8-inch line; commercial production end-2014)" }, { "year": 2017, "node": "55nm (first Shenzhen 12-inch/300mm line, ~3,000 wpm)" } ], "capacity": { "basis": "planned", "wafers_per_month": 40000, "wafer_size": "300mm", "as_of": "2021-03", "note": "planned (framework agreement target for the 28nm-and-above 12-inch expansion); not installed" }, "narrative": { "significance": "SMIC's smallest of the four 2020-2022 mega-fab JVs (中芯深圳, 55.05% SMIC-owned), a $2.35 billion 28nm foundry with the Shenzhen municipal government.", "what_it_makes": "12-inch (300mm) wafers at the 28nm node.", "why_it_matters": "28nm is the workhorse node for automotive, IoT, and power-management chips — the segment of demand China's fabs can serve without needing export-controlled EUV lithography. Chinese industry trade coverage confirms the fab entered production by the end of 2022, on schedule against its original target." }, "milestones": [ { "date": "2008-03-20", "event": "SMIC Shenzhen entity registered (registered capital $2.415B) — predecessor of the 8-inch line at 坪山" }, { "date": "2014-12-01", "event": "8-inch (200mm) line enters production, 0.35µm–90nm" }, { "date": "2021-03-18", "event": "SMIC and the Shenzhen municipal government announce a $2.35 billion joint venture for a new 28nm foundry" }, { "date": "2022-12-01", "event": "Fab enters production, targeting an eventual ~40,000 wafers/month" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 3, "capital_intensity": 3 }, "dates": { "announced": "2021-03-18", "approved": "2021-03-18", "construction_start": null, "original_expected_completion": "2022-12-31", "date_completion": "2022-12-01" }, "sources": [ { "url": "https://www.icsmart.cn/48815/", "title": "中芯国际深圳扩产项目方案公示：月产能达4万片12英寸晶圆 (芯智讯)", "date": "2026-09-28" }, { "url": "https://www.esmchina.com/news/8874.html", "title": "2022年深圳发力12吋半导体产线，中芯国际和华润微产线项目如期推进 (国际电子商情)", "date": "2022-01-01" }, { "url": "https://www.scmp.com/tech/big-tech/article/3125908/smic-joins-shenzhen-government-us235-billion-chip-foundry-28-nm-node", "title": "SMIC joins Shenzhen government in US$2.35 billion chip foundry as China pushes for self-sufficiency in semiconductors", "date": "2021-03-19" }, { "url": "https://www.taipeitimes.com/News/biz/archives/2021/03/19/2003754086", "title": "China's SMIC gets Shenzhen funds for US$2.4bn fab", "date": "2021-03-19" }, { "url": "https://www.sec.gov/Archives/edgar/data/1267482/000114420416095923/v437675_20f.htm", "title": "SMIC Form 20-F for fiscal year 2015", "date": "2016-04-25" }, { "url": "https://www.sec.gov/Archives/edgar/data/1267482/000155837019003539/smi-20181231x20f.htm", "title": "SMIC Form 20-F for fiscal year 2018 (fab table and per-fab capacity 2016–2018)", "date": "2019-04-30" }, { "url": "https://static.cninfo.com.cn/finalpage/2021-03-18/1209403281.PDF", "title": "中芯国际：关于自愿披露签订合作框架协议的公告 (深圳)", "date": "2021-03-18" } ] }, { "id": "huahong-wuxi-fab9", "name_en": "Hua Hong Wuxi (Fab9, Phase II)", "name_zh": "华虹无锡二期（Fab 9）", "name_pinyin": "Huáhóng Wúxī Èrqī", "company_en": "Hua Hong Semiconductor", "company_zh": "华虹半导体", "company_pinyin": "Huáhóng Bàndǎotǐ", "partners": ["China Integrated Circuit Industry Investment Fund (Big Fund)", "Wuxi entity (unnamed in source)"], "location": { "city": "Wuxi", "province": "Jiangsu", "lat": 31.57, "lon": 120.3 }, "type": "Fab", "category": "State-Backed", "capability": "12-inch (300mm) wafer foundry, specialty/mature nodes (65nm, 55nm, 40nm)", "investment": { "total_usd_million": 6700, "source": "Big Fund II" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "capacity": { "basis": "planned", "wafers_per_month": 83000, "wafer_size": "300mm", "as_of": "2026-09", "note": "planned full capacity; all tools for 83K moved in by end-Jun 2026, target reached by end Q3 2026. Actual Dec 2025 single-month input was >40,000" }, "narrative": { "significance": "Hua Hong's second 12-inch fab in Wuxi, financed with the largest single Big Fund-backed deal since the October 2022 US export control tightening — $4.02B new equity (Hua Hong Group, the Big Fund, and a Wuxi entity) plus $2.68B in debt. Began risk production at end-2024 and passed 40,000 wafers of single-month input in December 2025, per Hua Hong's 2025 annual report; tools for the full 83,000 wafers/month design capacity were moved in by end of June 2026, with that capacity targeted for the end of Q3 2026.", "what_it_makes": "12-inch (300mm) wafers at mature specialty nodes (65nm, 55nm, 40nm) — power management, automotive, and analog chips, not leading-edge logic.", "why_it_matters": "Illustrates China's mature-node strategy: rather than chase export-controlled advanced lithography, state capital doubles down on nodes where China already has working equipment access. Hua Hong announced a THIRD Wuxi phase in September 2026 — a separate US$6.95 billion project (Hua Hong group's own share about $2.127 billion), with construction having started in March 2026 — now tracked as its own entry, `huahong-wuxi-phase3`, signaling this is an open-ended expansion programme rather than a one-off Phase 2 project." }, "milestones": [ { "date": "2023-01-11", "event": "Hua Hong Semiconductor, the Big Fund, and a Wuxi entity sign agreement for a $6.7 billion second 12-inch Wuxi fab (Fab9)" }, { "date": "2023-06-01", "event": "Construction of Fab9 begins" }, { "date": "2023-09-01", "event": "Fab9's main building topped out roughly 100 days ahead of schedule" }, { "date": "2024-12-01", "event": "Hua Hong Manufacturing (Wuxi) Fab9 enters risk production (designed for 83,000 wafers/month at full build)" }, { "date": "2026-03-01", "event": "Construction begins on a separate Wuxi Phase 3 project (US$6.95 billion total)" }, { "date": "2026-06-30", "event": "Fab9 process-equipment move-in completed; full-capacity ramp targeted for end of Q3 2026" }, { "date": "2026-09-01", "event": "Hua Hong Semiconductor formally announces the Wuxi Phase 3 joint venture: US$6.95 billion total (US$4.17B equity, US$2.78B debt), group share about US$2.127 billion, 55,000 wafers/month" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 2, "capital_intensity": 4 }, "dates": { "announced": "2023-01-11", "approved": "2023-01-11", "construction_start": "2023-06-01", "original_expected_completion": null, "date_completion": "2024-12-01" }, "sources": [ { "url": "https://www.scmp.com/tech/tech-trends/article/3207368/hua-hong-semiconductor-gets-state-backing-us67-billion-wafer-fab-china-continues-its-pivot-mature", "title": "Hua Hong Semiconductor gets state backing for US$6.7 billion wafer fab as China continues its pivot to mature chip nodes", "date": "2023-01-11" }, { "url": "https://www.huahonggrace.com/html/about_fab_wuxi_manufacturing.php", "title": "Hua Hong Semiconductor Manufacturing (Wuxi) Co., Ltd. — company page", "date": "2026-09-28" }, { "url": "https://www.icsmart.cn/81568/", "title": "华虹无锡二期项目首批设备顺利搬入，明年一季度量产 (芯智讯)", "date": "2026-09-28" }, { "url": "https://www.esmchina.com/news/14554.html", "title": "华虹宏力21亿美元增资无锡三期：月产5.5万片12英寸产线落地 (国际电子商情)", "date": "2026-09-01" }, { "url": "https://static.cninfo.com.cn/finalpage/2026-08-27/1225514149.PDF", "title": "华虹宏力半导体有限公司2026年半年度报告", "date": "2026-08-27" }, { "url": "https://static.cninfo.com.cn/finalpage/2026-03-27/1225039291.PDF", "title": "华虹半导体有限公司2025年年度报告", "date": "2026-03-27" } ] }, { "id": "ymtc-wuhan", "name_en": "YMTC Wuhan", "name_zh": "长江存储", "name_pinyin": "Chángjiāng Cúnchǔ", "company_en": "Yangtze Memory Technologies Co. (YMTC)", "company_zh": "长江存储科技有限责任公司", "company_pinyin": "Chángjiāng Cúnchǔ Kējì Yǒuxiàn Zérèn Gōngsī", "partners": ["Hubei provincial government", "China Integrated Circuit Industry Investment Fund (Big Fund)"], "location": { "city": "Wuhan", "province": "Hubei", "lat": 30.49, "lon": 114.41 }, "type": "Memory", "category": "State-Backed", "capability": "3D NAND flash memory, XTacking architecture", "investment": { "total_usd_million": 24000, "source": "Big Fund I" }, "status": "Operational", "entity_list": { "status": true, "date_added": "2022-12-15", "list": "US Commerce BIS" }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [ { "year": 2017, "node": "32-layer 3D NAND" }, { "year": 2020, "node": "128-layer 3D NAND (Xtacking 2.0)" } ], "capacity": { "basis": "installed", "wafers_per_month": 150000, "wafer_size": "300mm", "as_of": "2026-07", "note": "two Wuhan fabs combined, installed; Fab 3 ramping 2H 2026, full-load total >170,000" }, "narrative": { "significance": "China's only advanced 3D NAND producer at national/global scale — founded by Tsinghua Unigroup with $24B in state-linked investment, YMTC reached 128-layer 3D NAND with its own Xtacking architecture before being added to the US Entity List. Filed for a STAR Market IPO in August 2026, with sources disagreeing sharply on valuation — Caixin reported a potential valuation of at least ¥1 trillion ($148B), while other reporting cited a lower $23.6-44.2B range; this tracker states both rather than picking one.", "what_it_makes": "3D NAND flash memory chips using XTacking wafer-bonding architecture, plus packaged memory chips and SSDs.", "why_it_matters": "The clearest case of a Chinese chipmaker reaching a genuinely globally competitive memory technology (Xtacking) before US export controls specifically targeted it. BIS cited YMTC's NAND supply to Huawei, and YMTC's earlier addition to BIS's Unverified List without cooperating on an end-use check within the required window, as grounds for the December 2022 Entity List action — this was distinct from the 2023 Huawei Mate 60 Pro teardown, whose memory chips were later identified as SK Hynix parts, not YMTC's. Combined NAND capacity across YMTC's lines was reported around 300,000 wafers/month in 2026." }, "milestones": [ { "date": "2016-07-26", "event": "YMTC founded by Tsinghua Unigroup with Hubei provincial and Big Fund backing, $24 billion planned investment" }, { "date": "2020-04-01", "event": "YMTC introduces 128-layer 3D NAND using Xtacking 2.0 architecture" }, { "date": "2022-12-15", "event": "Added to the US Commerce Department's Entity List" }, { "date": "2025-09-05", "event": "Third-fab JV company 长存三期（武汉）集成电路有限责任公司 registered with ¥20.72 billion capital — YMTC 50.19%, an Hubei/Wuhan state-vehicle consortium 49.81%" }, { "date": "2026-04-14", "event": "Fab 3 building reported complete with over 50% of equipment domestic (including bonding/stacking tools); planned capacity ~100,000 wafers/month, mass production targeted for H2 2026 and a reported ramp toward ~50,000/month in 2027 (Reuters)" }, { "date": "2026-08-20", "event": "Completes pre-IPO regulatory tutoring, clearing a procedural hurdle toward a Shanghai STAR Market listing" }, { "date": "2026-08-24", "event": "STAR Market accepts YMTC's formal IPO application (acceptance alone does not guarantee listing approval); plans to raise approximately ¥33 billion by issuing 1.98-2.43 billion shares" } ], "complexity": { "technology_difficulty": 4, "foreign_dependence": 4, "capital_intensity": 5 }, "dates": { "announced": "2016-07-26", "approved": "2016-07-26", "construction_start": null, "original_expected_completion": null, "date_completion": null }, "sources": [ { "url": "https://en.wikipedia.org/wiki/Yangtze_Memory_Technologies", "title": "Yangtze Memory Technologies (Wikipedia)", "date": "2026-09-28" }, { "url": "https://www.digitimes.com/news/a20221216VL204/us-china-chip-ban-ymtc.html", "title": "US adds 36 Chinese entities into Entity List, including YMTC", "date": "2022-12-16" }, { "url": "https://asia.nikkei.com/spotlight/most-read-in-2023/huawei-mate-60-pro-teardown-reveals-47-chinese-parts-in-phone", "title": "Huawei Mate 60 Pro teardown reveals 47% Chinese parts in phone (confirms SK Hynix, not YMTC, supplied the phone's memory)", "date": "2023-09-01" }, { "url": "https://www.tomshardware.com/tech-industry/semiconductors/ymtc-moves-ahead-with-third-fab-in-wuhan-despite-us-sanctions", "title": "YMTC moves ahead with third chipmaking fab in Wuhan despite U.S. sanctions", "date": "2026-09-28" }, { "url": "https://www.caixinglobal.com/2026-08-20/ymtc-moves-closer-to-shanghai-ipo-102476082.html", "title": "YMTC Moves Closer to Shanghai IPO (Caixin Global)", "date": "2026-08-20" }, { "url": "https://cn.technode.com/post/2026-08-24/ymtc-shanghai-ipo-33-billion/", "title": "长江存储IPO申请获受理，拟募资330亿元 (TechNode China)", "date": "2026-08-24" }, { "url": "http://static.sse.com.cn/stock/disclosure/announcement/c/202608/002251_20260821_7075.pdf", "title": "长江存储控股股份有限公司 首次公开发行股票并在科创板上市招股说明书 (Shanghai Stock Exchange filing, ¥631.8亿 2025 revenue; ¥470.4亿 Q1-2026)", "date": "2026-08-21" }, { "url": "https://m.cls.cn/detail/2144445", "title": "长江存储三期落地：注册资本207.2亿元，长控与湖北长晟合资 (财联社)", "date": "2025-09-14" }, { "url": "https://technews.tw/2026/07/14/chinas-two-memory-chip-giants-are-spending-heavily-to-expand-production/", "title": "中國記憶體雙雄大撒幣擴產，長鑫存儲年底產能直逼美光", "date": "2026-07-14" } ] }, { "id": "cxmt-hefei", "name_en": "CXMT Hefei", "name_zh": "长鑫存储", "name_pinyin": "Chángxīn Cúnchǔ", "company_en": "ChangXin Memory Technologies (CXMT)", "company_zh": "长鑫存储技术有限公司", "company_pinyin": "Chángxīn Cúnchǔ Jìshù Yǒuxiàn Gōngsī", "partners": ["Hefei State-Owned Assets Supervision and Administration Commission", "China Integrated Circuit Industry Investment Fund (Big Fund)"], "location": { "city": "Hefei", "province": "Anhui", "lat": 31.85, "lon": 117.27 }, "type": "Memory", "category": "State-Backed", "capability": "DRAM, 12-inch (300mm) wafers", "investment": { "total_usd_million": 7200, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": true, "date_added": "2025-01-07", "list": "US DoD 1260H List (Chinese Military Companies)" }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [ { "year": 2020, "node": "19nm-class DRAM" }, { "year": 2025, "node": "DDR5-capable node (exact process width not disclosed)" } ], "capacity": { "basis": "installed", "wafers_per_month": 150000, "wafer_size": "300mm", "as_of": "2025-01", "note": "sum of two Hefei fabs: Fab 1 100,000 (19nm DDR4) + Fab 2 50,000 (17nm DDR5); press, not company-disclosed" }, "narrative": { "significance": "China's leading DRAM maker (long known as Innotron/Hefei Chang Xin before its current name), majority state-controlled via Hefei SASAC and the Big Fund, now the world's fourth-largest DRAM producer by capacity. Went public on the Shanghai STAR Market on 27 July 2026 — China's largest A-share IPO of the year — with total proceeds of ¥66.607 billion at ¥8.66/share; its H1 2026 interim report showed revenue of roughly ¥150.31 billion (+873.6% YoY), placing it fourth in China and fourth globally in DRAM by volume and value.", "what_it_makes": "DRAM chips on 12-inch (300mm) wafers, now including DDR5-capable products.", "why_it_matters": "DRAM has been China's slower memory story relative to YMTC's NAND — CXMT's rise to fourth-largest globally marks a real capability jump, arriving alongside a January 2025 US Department of Defense listing as a Chinese military-linked entity under Section 1260H — a designation legally distinct from the Commerce Department's Entity List: 1260H does not itself restrict exports, but a subsequent statutory provision (FY2024 NDAA Section 805) bars US Department of Defense contracting with listed entities effective mid-2026. A June 2026 Pentagon update revised the 1260H list further; this tracker has not independently verified CXMT's exact status in that later revision, so the January 2025 addition is recorded as the confirmed fact. Domestic capacity reporting put CXMT above 300,000 wafers/month (DRAM equivalent) in early 2026, targeting roughly 350,000/month by year-end across Hefei, a Shanghai line, and Beijing — nearing contemporaneous estimates of Micron's own monthly capacity — with a second Beijing DRAM fab reportedly in planning as of August 2026." }, "milestones": [ { "date": "2016-05-01", "event": "Founded as Innotron Memory / Hefei Chang Xin" }, { "date": "2017-01-01", "event": "$7.2 billion investment announced for a 125,000 wafer/month 12-inch DRAM fab" }, { "date": "2025-01-07", "event": "Added to the US Department of Defense's Section 1260H list of Chinese military-linked companies (Federal Register notice)" }, { "date": "2026-06-12", "event": "STAR Market IPO registration approved; the listing then raises total proceeds of ¥66.607 billion (net ¥66.31 billion, including ~¥36.8 billion of over-subscription) at ¥8.66/share — China's largest A-share IPO of 2026 — with shares up 471% on the first day of listing, 2026-07-27" }, { "date": "2026-08-01", "event": "Reported to be planning a second DRAM fab in Beijing" }, { "date": "2026-09-18", "event": "Reuters, via Chinese reprints, reports CXMT is preparing to enter NAND flash with an R&D pilot line inside the planned Beijing fab" }, { "date": "2026-09-20", "event": "Fifth-generation (G5) DRAM platform declared in production — ~12nm-class half-pitch on ArF immersion multi-patterning — followed by an October 2026 statement that G5/LPDDR6 are in mass production" } ], "complexity": { "technology_difficulty": 4, "foreign_dependence": 4, "capital_intensity": 5 }, "dates": { "announced": "2017-01-01", "approved": null, "construction_start": null, "original_expected_completion": null, "date_completion": null }, "sources": [ { "url": "https://en.wikipedia.org/wiki/ChangXin_Memory_Technologies", "title": "ChangXin Memory Technologies (Wikipedia)", "date": "2026-09-28" }, { "url": "https://static.sse.com.cn/stock/disclosure/announcement/c/202605/002170_20260517_MGLN.pdf", "title": "长鑫科技集团股份有限公司 CXMT Corporation 首次公开发行股票并在科创板上市公告 (Shanghai Stock Exchange filing)", "date": "2026-05-17" }, { "url": "https://www.21jingji.com/article/20260625/herald/2ae96cf459babea7b4794efa8e88e91f.html", "title": "长鑫科技深度报告：从零起步，10年追赶，剑指全球第三！ (21世纪经济报道)", "date": "2026-06-25" }, { "url": "https://www.eet-china.com/news/202608044585.html", "title": "最新消息：长鑫存储拟在北京建设第二座DRAM工厂！ (电子工程专辑)", "date": "2026-08-04" }, { "url": "http://static.cninfo.com.cn/finalpage/2026-08-29/1225529543.PDF", "title": "长鑫科技集团股份有限公司 2026年半年度报告 (H1 2026 revenue ¥1503.1亿, +873.6% YoY)", "date": "2026-08-29" }, { "url": "https://www.guancha.cn/CaiJing/2026_09_18_901187.shtml", "title": "路透：长鑫存储筹备进入NAND市场，北京新厂内设研发试验线 (观察者网编译)", "date": "2026-09-18" }, { "url": "https://technews.tw/?p=1326637", "title": "中國長鑫存儲 DDR5 良率達 80%，還力拚 2025 年少量生產 HBM2", "date": "2025-01-03" } ] }, { "id": "nexchip-hefei", "name_en": "Nexchip Hefei", "name_zh": "晶合集成", "name_pinyin": "Jīnghé Jíchéng", "company_en": "Nexchip Semiconductor Corporation", "company_zh": "晶合集成电路股份有限公司", "company_pinyin": "Jīnghé Jíchéng Diànlù Gǔfèn Yǒuxiàn Gōngsī", "partners": ["Powerchip Semiconductor Manufacturing Corporation (Taiwan)", "Hefei City Construction and Investment Holding Group"], "location": { "city": "Hefei", "province": "Anhui", "lat": 31.82, "lon": 117.23 }, "type": "Fab", "category": "JV", "capability": "12-inch (300mm) wafer foundry, display driver ICs and CIS", "investment": { "total_rmb_100m": null, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [ { "year": 2017, "node": "110nm DDIC (A1 fab production start)" }, { "year": 2020, "node": "150nm/110nm/90nm all in volume (90nm = 53% of 2020 revenue)" }, { "year": 2022, "node": "55nm DDIC (mass production start)" }, { "year": 2025, "node": "40nm high-voltage OLED DDIC (mass production)" } ], "capacity": { "basis": "installed", "wafers_per_month": 137900, "wafer_size": "300mm", "as_of": "2025-12", "note": "designed capacity; actual output 139.0K (100.8% utilisation). Phase IV (55,000/month, 40/28nm) not included" }, "narrative": { "significance": "Mainland China's third-largest foundry by revenue after SMIC and Hua Hong — a Taiwan (Powerchip)-mainland joint venture, a structure now rare given cross-strait tensions. Analyst consensus as of April 2026 projected ¥1.11 billion net profit for the full year (+57.7% YoY), continuing 2025's roughly 24% growth.", "what_it_makes": "Display driver ICs (DDIC) and CMOS image sensors (CIS) on 12-inch wafers — a foundry niche distinct from SMIC/Hua Hong's broader logic focus.", "why_it_matters": "Shows Taiwanese foundry know-how transferring into a mainland-listed, mainland-controlled entity through a JV structure, ahead of any Taiwan-specific tracker this project might build later. This entry covers existing operational capacity; the January 2026 fourth-phase expansion (¥35.5 billion, a new 55,000 wafer/month line) is tracked as its own entry, `nexchip-phase4`, since it is actively under construction rather than operational." }, "milestones": [ { "date": "2015-05-01", "event": "Founded as a joint venture between PSMC (Powerchip) and Hefei City Construction and Investment Holding Group" }, { "date": "2026-01-01", "event": "Launches Phase 4: ¥35.5 billion investment in a new 55,000 wafer/month 12-inch line, full capacity targeted end of 2028" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 2, "capital_intensity": 3 }, "dates": { "announced": "2015-05-01", "approved": null, "construction_start": null, "original_expected_completion": null, "date_completion": null }, "sources": [ { "url": "https://en.wikipedia.org/wiki/Nexchip", "title": "Nexchip (Wikipedia)", "date": "2026-09-28" }, { "url": "https://caifuhao.eastmoney.com/news/20260423174626657731640", "title": "晶合集成2026一季报深度解析 (东方财富)", "date": "2026-04-23" }, { "url": "https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0630/2026063000123.pdf", "title": "Nexchip Semiconductor Corporation — H Share Global Offering Prospectus", "date": "2026-06-30" }, { "url": "https://static.cninfo.com.cn/finalpage/2023-04-26/1216593341.PDF", "title": "合肥晶合集成电路股份有限公司首次公开发行股票并在科创板上市招股说明书", "date": "2023-04-26" } ] }, { "id": "jhicc-jinjiang", "name_en": "JHICC (Fujian Jinhua)", "name_zh": "晋华集成电路", "name_pinyin": "Jìnhuá Jíchéng Diànlù", "company_en": "Fujian Jinhua Integrated Circuit Co., Ltd. (JHICC)", "company_zh": "福建省晋华集成电路有限公司", "company_pinyin": "Fújiàn Shěng Jìnhuá Jíchéng Diànlù Yǒuxiàn Gōngsī", "partners": "Fujian Province Electronic Information Group", "location": { "city": "Jinjiang", "province": "Fujian", "lat": 24.82, "lon": 118.58 }, "type": "Memory", "category": "State-Backed", "capability": "DRAM, 12-inch (300mm) wafers", "investment": { "total_rmb_100m": 370, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": true, "date_added": "2018-10-30", "list": "US Commerce BIS" }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [ { "year": 2025, "node": "25nm DDR4 8Gb (in shipping product; teardown date, not mass-prod start)" } ], "capacity": { "basis": "installed", "wafers_per_month": 50000, "wafer_size": "300mm", "as_of": "2026-07", "note": "installed (current), per 財訊快報 via TechNews; site plan expandable to 100,000" }, "narrative": { "significance": "The starkest case of a US export-control action landing directly on a named facility: added to the Entity List in October 2018 amid a Micron trade-secret theft dispute involving JHICC and Taiwan's UMC, just as its DRAM line was nearing production.", "what_it_makes": "DRAM chips on 12-inch (300mm) wafers, planned capacity of 60,000 wafers/month.", "why_it_matters": "Widely reported as crippled by the 2018 ban in the years immediately after — a criminal case against JHICC and UMC followed, later resolved without a conviction against JHICC. 2026 Chinese-language industry coverage reconciles the earlier conflicting reports: the fab survived and stabilized at roughly 40,000 wafers/month with an expansion toward 60,000/month underway in 2026, but the five-year setback cost it competitive position — domestic rankings place it around 5th among Chinese memory makers, and coverage describes it as having fallen out of the global DRAM core supply chain entirely. Survival without competitiveness is the more precise read than either the original 'crippled' framing or an assumption of a clean recovery." }, "milestones": [ { "date": "2018-10-30", "event": "Added to the US Commerce Department's Entity List amid Micron trade-secret allegations" }, { "date": "2018-11-01", "event": "US Attorney's Office files criminal complaint against JHICC and UMC for conspiracy to steal Micron trade secrets" }, { "date": "2026-01-01", "event": "Capacity expansion toward 60,000 wafers/month underway, per 2026 domestic industry coverage" } ], "complexity": { "technology_difficulty": 3, "foreign_dependence": 5, "capital_intensity": 4 }, "dates": { "announced": null, "approved": null, "construction_start": null, "original_expected_completion": "2018-09-30", "date_completion": null }, "sources": [ { "url": "https://www.commerce.gov/news/press-releases/2018/10/addition-fujian-jinhua-integrated-circuit-company-ltd-jinhua-entity-list", "title": "Addition of Fujian Jinhua Integrated Circuit Company, Ltd (Jinhua) to the Entity List — US Department of Commerce", "date": "2018-10-30" }, { "url": "https://zhuanlan.zhihu.com/p/2056339740492878403", "title": "370亿建厂，量产前夜被美国'锁死'：福建晋华的血泪十年，给国产芯片留下了什么？ (Zhihu)", "date": "2026-09-28" }, { "url": "https://en.wikipedia.org/wiki/Fujian_Jinhua_Integrated_Circuit", "title": "Fujian Jinhua Integrated Circuit (Wikipedia)", "date": "2026-09-28" }, { "url": "https://technews.tw/2026/07/14/china-huawei-jhicc-dram/", "title": "華為跨足 DRAM 製造！借力福建晉華技術，攜昇維旭、地方政府拚供應鏈自主", "date": "2026-07-14" }, { "url": "https://techinsights.com/ko/node/60764", "title": "JHICC CA4S8G16V 25nm 8Gb DDR4 DRAM Array Process Analysis", "date": "2025-11-25" } ] }, { "id": "sien-qingdao", "name_en": "SiEn Qingdao", "name_zh": "芯恩（青岛）集成电路", "name_pinyin": "Xīn'ēn (Qīngdǎo) Jíchéng Diànlù", "company_en": "SiEn (Qingdao) Integrated Circuit Co., Ltd.", "company_zh": "芯恩（青岛）集成电路有限公司", "company_pinyin": "Xīn'ēn (Qīngdǎo) Jíchéng Diànlù Yǒuxiàn Gōngsī", "partners": "Qingdao West Coast New Area government", "location": { "city": "Qingdao", "province": "Shandong", "lat": 35.96, "lon": 120.2 }, "type": "Fab", "category": "State-Backed", "capability": "8-inch (200mm) and 12-inch (300mm) wafer fab, IDM model, 28-40nm logic/foundry, analog/power, RF", "investment": { "total_rmb_100m": 218, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": true, "date_added": "2024-12-02", "list": "US Commerce BIS" }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "China's first 'CIDM' (collaborative IDM) project — pooling IC-design firms, end-application companies, and the manufacturer as joint investors — founded by Richard Chang (Zhang Rujing), who also founded SMIC. Domestic reporting in 2026 describes Zhang as having since departed the company he founded, citing difficulty retaining talent — a leadership change this tracker has not independently corroborated beyond that single report. By 2026, reported capacity stood at roughly 60,000 wafers/month (8-inch line) and 40,000 wafers/month (12-inch line), with an annual output value around ¥4.6 billion at full capacity. SiEn was added to the US Commerce Department's Entity List on December 2, 2024, as part of the 140-entity semiconductor package — one of only a handful of wafer fabs directly listed in that round.", "what_it_makes": "Logic/foundry, analog/power, and RF/wireless chips at 28nm and 40nm on both 200mm and 300mm wafers.", "why_it_matters": "A structurally different ownership model (collaborative IDM, not a pure foundry or a single-owner state fab) from every other entry in this tracker, and notable for its founder's direct SMIC lineage. In September 2026 it opened a separate 'Industry Innovation Center' — five R&D buildings on a 30,154 sq m site, explicitly a research/innovation facility rather than a new wafer production line — framed domestically as a shift from 'scale manufacturing to innovation creation.'" }, "milestones": [ { "date": "2018-04-01", "event": "SiEn (Qingdao) established in the Qingdao West Coast New Area (Huangdao)" }, { "date": "2021-01-01", "event": "Production commences on the first-phase lines" }, { "date": "2026-09-21", "event": "Breaks ground on the SiEn Industry Innovation Center, a five-building R&D complex (not a new fab line) in the Qingdao Free Trade Zone IC industrial park" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 3, "capital_intensity": 3 }, "dates": { "announced": "2018-04-01", "approved": null, "construction_start": "2018-04-01", "original_expected_completion": null, "date_completion": "2021-01-01" }, "sources": [ { "url": "https://jw.ijiwei.com/n/857735", "title": "Chinese IC company Sien IDM receives new funding in Qingdao City", "date": "2026-09-28" }, { "url": "https://www.fabulousmap.com/pages/sien-qingdao-integrated-circuits-fab.html", "title": "SiEn (Qingdao) Integrated Circuits - Phase 1 fab profile", "date": "2026-09-28" }, { "url": "http://news.10jqka.com.cn/20260923/c680230057.shtml", "title": "芯恩落子青岛'芯'项目！ (同花顺)", "date": "2026-09-23" }, { "url": "https://www.ednchina.com/technews/13316.html", "title": "张汝京离开自己创办的青岛芯恩，慨叹人才难得 (EDN电子技术设计)", "date": "2026-09-28" } ] }, { "id": "jcet-jiangyin", "name_en": "JCET Jiangyin", "name_zh": "长电科技", "name_pinyin": "Chángdiàn Kējì", "company_en": "JCET Group", "company_zh": "江苏长电科技股份有限公司", "company_pinyin": "Jiāngsū Chángdiàn Kējì Gǔfèn Yǒuxiàn Gōngsī", "partners": "China Resources (Holdings), via Panshi Runqi", "location": { "city": "Jiangyin", "province": "Jiangsu", "lat": 31.91, "lon": 120.26 }, "type": "Assembly & Packaging", "category": "State-Backed", "capability": "OSAT (assembly, test, and advanced packaging) — flip-chip, SiP, and chiplet-based heterogeneous integration; high-volume 4nm-class chiplet packaging demonstrated", "investment": { "total_rmb_100m": null, "source": "Not disclosed" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "packaging_trajectory": [ { "year": 2013, "technology": "company-wide: Bumping (8-12in), WLCSP, FCBGA/FCLGA flip-chip in volume" }, { "year": 2016, "technology": "Jiangyin (JCET Advanced Packaging): Bumping and WLCSP at global scale" }, { "year": 2023, "technology": "company-wide: XDFOI chiplet (2.5D/3D fan-out) stable volume; 4nm MCM ship" } ], "narrative": { "significance": "China's largest OSAT (Outsourced Semiconductor Assembly and Test) company and the world's third-largest — founded in 1972, and controlled since November 2024 by China Resources (Holdings), which holds a 22.53% stake through its subsidiary Panshi Runqi and controls a board majority. Not found on the US Entity List in the sources checked for this tracker, despite advanced packaging increasingly being discussed as a future export-control target. H1 2026 non-GAAP net profit grew 84.7% year-on-year as advanced-packaging orders accelerated.", "what_it_makes": "Chip assembly, test, and advanced packaging services — not a fab, but the step between a finished wafer and a sellable chip. Demonstrated high-volume packaging of 4nm-class chips using chiplet technology.", "why_it_matters": "Advanced packaging (chiplets, heterogeneous integration) is one of the segments China's Big Fund III and its OSAT majors are explicitly pivoting toward, since it offers a path to competitive chip performance without needing export-controlled leading-edge lithography. By 2026 the company says its entire production line has moved upmarket to five top-tier processes: XDFOI multi-dimensional heterogeneous integration, 1.5-micron ultra-fine hybrid bonding, 3D logic folding, HBM (high-bandwidth memory) packaging, and CPO (co-packaged optics)." }, "milestones": [ { "date": "2015-08-01", "event": "Acquires Singapore's STATS ChipPAC, becoming one of the world's top-three OSAT firms by revenue" }, { "date": "2026-07-01", "event": "Reports H1 2026 non-GAAP net profit up 84.7% year-on-year, crediting advanced-packaging (chiplet, HBM, CPO) order growth" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 2, "capital_intensity": 3 }, "dates": { "announced": null, "approved": null, "construction_start": null, "original_expected_completion": null, "date_completion": null }, "sources": [ { "url": "https://notice.10jqka.com.cn/api/pdf/d281fd73f5d2a04f_1761741341/2025%E5%B9%B4%E5%BA%A6%E6%B1%9F%E8%8B%8F%E9%95%BF%E7%94%B5%E7%A7%91%E6%8A%80%E8%82%A1%E4%BB%BD%E6%9C%89%E9%99%90%E5%85%AC%E5%8F%B8%E4%BF%A1%E7%94%A8%E8%AF%84%E7%BA%A7%E6%8A%A5%E5%91%8A(%E5%88%9D%E7%A8%BF).pdf", "title": "2025年度江苏长电科技股份有限公司信用评级报告 (中诚信国际)", "date": "2025-08-20" }, { "url": "https://jw.ijiwei.com/n/871800", "title": "China's leading OSAT company JCET Group achieves high-volume packaging of 4-nanometer chips by leveraging Chiplet technology", "date": "2026-09-28" }, { "url": "https://www.cls.cn/detail/2460145", "title": "A股封测龙头长电科技上半年盈利增速远超收入 头部厂商扩产提速|财报解读 (财联社)", "date": "2026-08-21" }, { "url": "https://www.jcetglobal.com/uploads/68ce55da2b334730.pdf", "title": "江苏长电科技股份有限公司2013年度非公开发行A股股票募集资金使用的可行性分析报告", "date": "2013-11-27" }, { "url": "https://jcetglobal.com/uploads/5f4c3f12aeaec0eb.pdf", "title": "江苏长电科技股份有限公司2017年度非公开发行A股股票募集资金使用可行性分析报告（二次修订稿）", "date": "2018-03-13" }, { "url": "https://laoyaoba.com/html/share/news/844604?source=h5", "title": "Chinese leading packaging company JCET starts mass production of its unique XDFOI Chiplet series", "date": "2023-01-09" } ] }, { "id": "tongfu-nantong", "name_en": "Tongfu Microelectronics Nantong", "name_zh": "通富微电", "name_pinyin": "Tōngfù Wēidiàn", "company_en": "Tongfu Microelectronics Co., Ltd.", "company_zh": "通富微电子股份有限公司", "company_pinyin": "Tōngfù Wēidiànzǐ Gǔfèn Yǒuxiàn Gōngsī", "partners": ["Nantong Huada Microelectronics Group", "China Integrated Circuit Industry Investment Fund (Big Fund)"], "location": { "city": "Nantong", "province": "Jiangsu", "lat": 32.03, "lon": 120.89 }, "type": "Assembly & Packaging", "category": "State-Backed", "capability": "OSAT — Nantong sites: FC/SiP high-performance packaging and 8/12-inch wafer-level packaging (company-wide: chiplet, HBM)", "investment": { "total_usd_million": 371, "source": "Big Fund I" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "packaging_trajectory": [ { "year": 2025, "technology": "Nantong Sutong plant: FC/SiP HPC packaging line (2022 issue) built out" }, { "year": 2026, "technology": "Nantong Chongchuan HQ: 8/12in wafer-level (Cu pillar, bump, WLCSP), as of" } ], "capacity": { "basis": "installed", "units_per_month": 116700000, "as_of": "2025", "note": "theoretical capacity of the HPC/communications packaging business run by 南通通富 (Sutong plant): ~14亿块/yr / 12 = ~116.7M units/month; 2025 utilisation 78.88%. Not total Nantong capacity" }, "narrative": { "significance": "Traces to the state-owned Nantong Transistor Factory; its largest shareholder is the state-linked Nantong Huada Microelectronics Group (18.80% as of June 2026). The Big Fund, which once held as much as 21.72%, has been selling down since 2020 and held 5.00% by June 2026. In 2016, Tongfu and the Big Fund jointly paid $371 million for 85% stakes in AMD's Suzhou and Penang assembly and test facilities — a rare case of a Chinese OSAT firm acquiring a Western chipmaker's own packaging plants outright. H1 2026 revenue reached ¥16 billion (+23% YoY) with net profit up 317% YoY to ¥1.72 billion; Q2 2026 net profit alone was ¥1.39 billion, up 346.9% year-on-year.", "what_it_makes": "At Nantong: flip-chip (FC) and system-in-package (SiP) packaging for high-performance computing and communications chips at the Sutong plant, and 8/12-inch wafer-level packaging (copper pillar, solder bump, WLCSP) at the Chongchuan headquarters. Tongfu's most advanced work, 7nm/5nm FCBGA and chiplet integration for AMD, is done at its Suzhou and Penang subsidiaries (TF-AMD), not in Nantong, according to the company's 2026 prospectus.", "why_it_matters": "One of two mainland Chinese firms in the world's top five OSAT companies by revenue (JCET is the other) — reporting describes Tongfu as one of three Chinese firms that have begun HBM packaging, a capability central to AI-accelerator supply chains. Tongfu also handles over 80% of AMD's global CPU/GPU packaging and test orders, with AMD alone accounting for about 52.3% of Tongfu's total revenue. That dependence cuts both ways: it is the clearest evidence of a Chinese OSAT firm embedded deep in the global AI-memory supply chain, and a concentration risk if AMD diversifies." }, "milestones": [ { "date": "2016-01-01", "event": "Tongfu and the Big Fund jointly acquire 85% equity stakes in AMD's Suzhou and Penang assembly and test facilities for $371 million" }, { "date": "2026-07-01", "event": "Reports H1 2026 revenue of ¥16 billion (+23% YoY) and net profit of ¥1.72 billion (+317% YoY), crediting HBM and AMD-related advanced packaging volume" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 2, "capital_intensity": 3 }, "dates": { "announced": "2016-01-01", "approved": null, "construction_start": null, "original_expected_completion": null, "date_completion": null }, "sources": [ { "url": "https://paper.cnstock.com/html/2026-02/25/content_2182125.htm", "title": "通富微电石明达：让中国半导体拥有与世界对话的底气 (上海证券报)", "date": "2026-02-25" }, { "url": "https://en.tfme.com/news/378.html", "title": "Tongfu Microelectronics Chairman's Letter of Gratitude to All Sectors for Completing the Acquisition of 85% Equity in Two AMD Packaging and Testing Facilities", "date": "2026-09-28" }, { "url": "https://finance.eastmoney.com/a/202608283858419867.html", "title": "通富微电：上半年归母净利润17.2亿元，同比上升316.8% (东方财富)", "date": "2026-08-28" }, { "url": "https://www.sina.cn/news/detail/5317759326225537.html", "title": "通富微电获42.2亿定增 (新浪财经) — AMD/Samsung HBM supply-chain detail", "date": "2026-09-28" }, { "url": "https://pdf.dfcfw.com/pdf/H2_AN202607031826702614_1.pdf", "title": "通富微电子股份有限公司2026年度向特定对象发行A股股票募集说明书（注册稿）", "date": "2026-07-03" }, { "url": "https://finance.eastmoney.com/a/202606253783309916.html", "title": "从11.72%到5%，大基金逐步退出通富微电，股价不跌反涨创出历史新高 (东方财富)", "date": "2026-06-25" } ] }, { "id": "huatian-tianshui", "name_en": "Huatian Technology Tianshui", "name_zh": "华天科技", "name_pinyin": "Huátiān Kējì", "company_en": "Tianshui Huatian Technology Co., Ltd.", "company_zh": "天水华天科技股份有限公司", "company_pinyin": "Tiānshuǐ Huátiān Kējì Gǔfèn Yǒuxiàn Gōngsī", "partners": "Tianshui Huatian Electronic Group (天水华天电子集团)", "location": { "city": "Tianshui", "province": "Gansu", "lat": 34.58, "lon": 105.72 }, "type": "Assembly & Packaging", "category": "State-Backed", "capability": "OSAT — Tianshui base: mainly leadframe packaging, plus MCM/MCP multi-chip lines (wafer-level work is at Kunshan/Jiangsu)", "investment": { "total_rmb_100m": null, "source": "Not disclosed" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "packaging_trajectory": [ { "year": 2024, "technology": "Tianshui: MCM/MCP multi-chip packaging expansion completed (18亿只/yr design)" } ], "capacity": { "basis": "installed", "units_per_month": 150000000, "as_of": "2024-12", "note": "design capacity ADDED by the Tianshui MCM(MCP) project only (18亿只/yr / 12 = 150M units/month), completed end-2024; not total Tianshui site output" }, "narrative": { "significance": "One of China's three major OSAT firms alongside JCET and Tongfu, founded December 2003 with roots in a state-owned enterprise; its largest shareholder, Tianshui Huatian Electronic Group (天水华天电子集团), held 22.34% as of September 2025. Earnings accelerated sharply in 2026: H1 net profit came in at ¥813 million (+259% year-on-year) on revenue of ¥10.51 billion, which the company credited to advanced-packaging mix shift and M&A integration.", "what_it_makes": "The Tianshui base mainly packages leadframe products (driver ICs, power management, Bluetooth, MCU, NOR flash), with a multi-chip (MCM/MCP) expansion completed at end-2024. Huatian's company-wide portfolio is broader (SiP, flip-chip, TSV, bumping, fan-out, wafer/panel-level packaging, 2.5D/3D), but its wafer-level and TSV work is done at its Kunshan and Jiangsu sites, not Tianshui, according to an April 2026 investor-relations record.", "why_it_matters": "Based in Gansu province — a notable geographic outlier among China's semiconductor firms, most of which cluster in the Yangtze River Delta (Jiangsu/Shanghai) or Pearl River Delta (Guangdong) regions. Its 2026 earnings jump, alongside JCET's and Tongfu's, points to a sector-wide advanced-packaging upcycle among China's three major OSATs rather than a single-company story." }, "milestones": [ { "date": "2003-12-25", "event": "Founded as Tianshui Huatian Technology Co., Ltd." }, { "date": "2026-07-13", "event": "Guides H1 2026 net profit to ¥750-850 million, up 231-275% year-on-year" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 2, "capital_intensity": 3 }, "dates": { "announced": "2003-12-25", "approved": null, "construction_start": null, "original_expected_completion": null, "date_completion": null }, "sources": [ { "url": "https://static.cninfo.com.cn/finalpage/2025-10-17/1224717168.PDF", "title": "天水华天科技股份有限公司关于本次交易停牌前一个交易日前十大股东和前十大流通股股东持股情况的公告", "date": "2025-10-17" }, { "url": "https://www.cls.cn/detail/2424676", "title": "华天科技：预计上半年净利润同比增长231%-275% (财联社)", "date": "2026-07-13" }, { "url": "https://disc.static.szse.cn/disc/disk02/finalpage/2021-01-20/d4372f6e-3c04-4075-9365-12d6227050bb.PDF", "title": "天水华天科技股份有限公司非公开发行A股股票募集资金运用的可行性报告", "date": "2021-01-20" }, { "url": "https://static.cninfo.com.cn/finalpage/2025-04-01/1222975803.PDF", "title": "天风证券关于天水华天科技股份有限公司2024年度募集资金存放与使用情况的核查意见", "date": "2025-04-01" }, { "url": "https://wap.stockstar.com/detail/RB2026041000028467", "title": "华天科技：4月10日接受机构调研，中粮资本参与", "date": "2026-04-10" }, { "url": "https://stock.10jqka.com.cn/20260821/c679173788.shtml", "title": "华天科技:上半年净利润同比增长259% 存储器封装等业务规模扩大 (同花顺/财闻)", "date": "2026-08-21" } ] }, { "id": "samsung-xian", "name_en": "Samsung Xi'an", "name_zh": "三星（中国）半导体有限公司", "name_pinyin": "Sānxīng (Zhōngguó) Bàndǎotǐ Yǒuxiàn Gōngsī", "company_en": "Samsung Electronics", "company_zh": "三星电子", "company_pinyin": "Sānxīng Diànzǐ", "partners": [], "location": { "city": "Xi'an", "province": "Shaanxi", "lat": 34.27, "lon": 108.95 }, "type": "Memory", "category": "Foreign-Invested", "capability": "3D NAND flash memory, 12-inch (300mm) wafers", "investment": { "total_rmb_100m": null, "total_usd_million": null, "source": "Foreign" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [ { "year": 2026, "node": "236-layer 3D NAND (V8)" } ], "narrative": { "significance": "Samsung's largest NAND flash site outside South Korea and a major share of its total NAND output (domestic Korean reporting put it around 40%) — the single biggest reminder that 'China's semiconductor sector' includes large-scale foreign-owned manufacturing on Chinese soil, not only domestic Chinese firms. Samsung reported a 67.5% year-on-year increase in Xi'an investment in its 2025 business report.", "what_it_makes": "3D NAND flash memory wafers; the fab has progressed from 128-layer (V6, now phased out) to 236-layer (V8, in mass production as of early 2026), with 286-layer V9 production targeted for later in 2026.", "why_it_matters": "A test case for how far US export controls reach into foreign multinationals' own China operations: Samsung ships significantly more semiconductor product to China than to the US by value, and continues to operate and upgrade Xi'an under an annual US tool-export licensing regime (replacing an earlier open-ended waiver) rather than a blanket ban." }, "milestones": [ { "date": "2026-03-01", "event": "Reported to be advancing Xi'an to 236-layer (V8) NAND in mass production" }, { "date": "2026-05-01", "event": "Reported to begin cleanroom build-out for V9 NAND infrastructure following the V8 ramp and V6 phase-out" } ], "complexity": { "technology_difficulty": 4, "foreign_dependence": 2, "capital_intensity": 5 }, "dates": { "announced": null, "approved": null, "construction_start": null, "original_expected_completion": null, "date_completion": null }, "sources": [ { "url": "https://www.trendforce.com/news/2026/03/30/news-samsung-reportedly-advances-xian-to-236-layer-nand-sk-hynix-eyes-dalian-upgrade-amid-tight-supply/", "title": "Samsung Reportedly Advances Xi'an to 236-Layer NAND; SK hynix Eyes Dalian Upgrade Amid Tight Supply (TrendForce)", "date": "2026-03-30" }, { "url": "https://www.trendforce.com/news/2026/03/27/news-memory-giants-china-investments-soar-in-2025-samsung-xian-up-67-5-sk-hynix-wuxi-dalian-hit-trillion-won/", "title": "Memory Giants' China Investments Soar in 2025: Samsung Xi'an Up 67.5%, SK hynix Wuxi, Dalian Hit Trillion-Won (TrendForce)", "date": "2026-03-27" }, { "url": "https://www.techtimes.com/articles/324568/20260815/samsung-shipped-127b-more-chips-china-us-h1-xi-fab-annual-us-license-deadline-looms.htm", "title": "Samsung Shipped $12.7B More Chips to China Than US in H1; Xi'an Fab Annual US License Deadline Looms (Tech Times)", "date": "2026-08-15" } ] }, { "id": "sk-hynix-wuxi", "name_en": "SK Hynix Wuxi", "name_zh": "SK海力士半导体（中国）有限公司", "name_pinyin": "SK Hǎilìshì Bàndǎotǐ (Zhōngguó) Yǒuxiàn Gōngsī", "company_en": "SK Hynix", "company_zh": "SK海力士", "company_pinyin": "SK Hǎilìshì", "partners": [], "location": { "city": "Wuxi", "province": "Jiangsu", "lat": 31.6, "lon": 120.33 }, "type": "Memory", "category": "Foreign-Invested", "capability": "DRAM, 12-inch (300mm) wafers", "investment": { "total_rmb_100m": null, "total_usd_million": null, "source": "Foreign" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [ { "year": 2026, "node": "1a-class DRAM" } ], "narrative": { "significance": "SK Hynix's largest DRAM site outside South Korea, reported to account for roughly 30-40% of the company's total DRAM production — on the same scale of significance as Samsung's Xi'an NAND operation, and likewise a reminder that foreign multinationals, not only domestic Chinese firms, make up a large share of chip manufacturing physically located in China. 2025 investment was reported at 581.1 billion KRW, up 102% year-on-year.", "what_it_makes": "DRAM on 12-inch (300mm) wafers; completed conversion to the 1a (4th-generation 10nm-class) process, with roughly 200,000 wafers/month of capacity reported and expansion toward 360,000 wafers/month targeted by the first half of 2030.", "why_it_matters": "Like Samsung Xi'an, operates under the same annual US tool-export licensing regime rather than a blanket restriction — both South Korean memory majors were granted 2026 licenses for chipmaking tool shipments to their China plants, replacing the earlier Validated End-User (VEU) waiver system." }, "milestones": [ { "date": "2026-01-16", "event": "Reported to have completed the 1a DRAM process conversion at the Wuxi fab" } ], "complexity": { "technology_difficulty": 4, "foreign_dependence": 2, "capital_intensity": 5 }, "dates": { "announced": null, "approved": null, "construction_start": null, "original_expected_completion": null, "date_completion": null }, "sources": [ { "url": "https://www.digitimes.com/news/a20260116VL202/sk-hynix-dram-plant-production-euv.html", "title": "SK Hynix reportedly completes 1a DRAM upgrade at Wuxi plant in China (Digitimes)", "date": "2026-01-16" }, { "url": "https://www.trendforce.com/news/2026/06/05/news-sk-hynix-reportedly-to-double-dram-capacity-to-1m-monthly-wafers-by-2030-speeds-yongin-expansion/", "title": "SK hynix Reportedly to Double DRAM Capacity to 1M Monthly Wafers by 2030, Speeds Yongin Expansion (TrendForce)", "date": "2026-06-05" }, { "url": "https://www.tomshardware.com/tech-industry/us-grants-samsung-and-sk-hynix-2026-licenses-for-chipmaking-tool-shipments-to-china", "title": "U.S. grants Samsung and SK hynix 2026 licenses for chipmaking tool shipments to China (Tom's Hardware)", "date": "2026-09-28" } ] }, { "id": "sk-hynix-dalian", "name_en": "SK Hynix Dalian (former Intel fab)", "name_zh": "SK海力士半导体（大连）有限公司", "name_pinyin": "SK Hǎilìshì Bàndǎotǐ (Dàlián) Yǒuxiàn Gōngsī", "company_en": "SK Hynix", "company_zh": "SK海力士", "company_pinyin": "SK Hǎilìshì", "partners": [], "location": { "city": "Dalian", "province": "Liaoning", "lat": 38.91, "lon": 121.61 }, "type": "Memory", "category": "Foreign-Invested", "capability": "NAND flash memory, 12-inch (300mm) wafers", "investment": { "total_rmb_100m": null, "total_usd_million": null, "source": "Foreign" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [ { "year": 2018, "node": "96-layer 3D NAND (Fab 68 phase 2 start; planned main product)" }, { "year": 2023, "node": "144-layer 3D NAND (capable by 2023)" } ], "capacity": { "basis": "installed", "wafers_per_month": 100000, "wafer_size": "300mm", "as_of": "2026-08", "note": "Plant 1 installed; Plant 2 (bldg complete) to add ~50,000/month from 1H 2027" }, "narrative": { "significance": "Originally built and operated by Intel as its only fab in China, producing NAND flash — Intel agreed in 2020-2021 to sell its NAND/SSD business, including this fab, to SK Hynix in stages; the entity was formally renamed to reflect full SK Hynix ownership (effective September 1). It is tracked here as a distinct entry from SK Hynix's own Wuxi DRAM fab since it is a different site, product (NAND vs DRAM), and acquisition history.", "what_it_makes": "NAND flash memory on 12-inch (300mm) wafers.", "why_it_matters": "A rare case in this tracker of a facility changing foreign owners entirely (Intel to SK Hynix) while remaining a foreign-invested operation in China throughout — distinct from the far more common story of a facility being added to, or dropped from, a US control list." }, "milestones": [ { "date": "2021-01-01", "event": "Intel completes the first phase of selling its NAND/SSD business and Dalian fab to SK Hynix (deal announced 2020)" }, { "date": "2026-09-01", "event": "Entity formally renamed to reflect full SK Hynix ownership, ending Intel's fab presence in China" } ], "complexity": { "technology_difficulty": 3, "foreign_dependence": 2, "capital_intensity": 4 }, "dates": { "announced": null, "approved": null, "construction_start": null, "original_expected_completion": null, "date_completion": null }, "sources": [ { "url": "https://www.tomshardware.com/tech-industry/intel-dalian-plant-now-officially-sk-hynix", "title": "Intel's old NAND plant in China is now officially registered as SK hynix after US imposes new sanctions that limit fab upgrades in China (Tom's Hardware)", "date": "2026-09-28" }, { "url": "https://finance.technews.tw/2018/09/25/intel-nand-flash/", "title": "英特爾中國大連第 2 期 NAND Flash 工廠投產，將生產 96 層堆疊產品", "date": "2018-09-25" }, { "url": "https://storagenewsletter.com/?p=265209", "title": "SK hynix Will not Sell Chinese 3D NAND Flash Memory Factory Acquired by Intel", "date": "2023-07-25" }, { "url": "https://www.trendforce.com/news/2026/08/12/news-sk-hynix-reportedly-restarts-dalian-fab-2-targets-1h27-mass-production-and-50-china-nand-capacity-boost/", "title": "[News] SK hynix Reportedly Restarts Dalian Fab 2, Targets 1H27 Mass Production and 50% China NAND Capacity Boost", "date": "2026-08-12" } ] }, { "id": "intel-chengdu", "name_en": "Intel Chengdu", "name_zh": "英特尔产品（成都）有限公司", "name_pinyin": "Yīngtè'ěr Chǎnpǐn (Chéngdū) Yǒuxiàn Gōngsī", "company_en": "Intel Corporation", "company_zh": "英特尔", "company_pinyin": "Yīngtè'ěr", "partners": [], "location": { "city": "Chengdu", "province": "Sichuan", "lat": 30.57, "lon": 104.07 }, "type": "Assembly & Packaging", "category": "Foreign-Invested", "capability": "Chip assembly and test (ATP) — not a wafer fab", "investment": { "total_rmb_100m": null, "total_usd_million": 600, "source": "Foreign" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "packaging_trajectory": [ { "year": 2005, "technology": "Assembly & test (client CPUs) begins operation" }, { "year": 2016, "technology": "Intel Advanced Test Technology in mass production (planned H2 2016)" }, { "year": 2024, "technology": "Server-chip packaging & test added (announced; US$300M capital increase)" }, { "year": 2026, "technology": "Wafer pre-processing + advanced packaging + test (stated, as of)" } ], "narrative": { "significance": "Intel's remaining manufacturing presence in China, after fully divesting its only China wafer fab (the Dalian NAND plant) to SK Hynix. Chengdu is an assembly-and-test (ATP) site, not a fab — it packages and tests chips rather than fabricating wafers. Intel had invested $600 million in the site by December 2014, when it announced a further $1.6 billion over 15 years; in 2024 it added $300 million in registered capital to expand server-chip packaging and test.", "what_it_makes": "Chip assembly and test services for Intel products — the step between finished wafers and sellable packaged chips, not wafer fabrication.", "why_it_matters": "With Dalian fully transferred to SK Hynix, Chengdu's ATP operation is the clearest marker of what 'Intel in China' now means: assembly and test only, no fab. Included here to avoid the common misconception (prompted by Intel's historical Dalian fab) that Intel still operates a wafer fab in China." }, "milestones": [ { "date": "2026-09-01", "event": "Becomes Intel's sole remaining manufacturing site in China once the Dalian fab's transfer to SK Hynix is finalized" } ], "complexity": { "technology_difficulty": 1, "foreign_dependence": 2, "capital_intensity": 2 }, "dates": { "announced": null, "approved": null, "construction_start": null, "original_expected_completion": null, "date_completion": null }, "sources": [ { "url": "https://www.tomshardware.com/tech-industry/intel-dalian-plant-now-officially-sk-hynix", "title": "Intel's old NAND plant in China is now officially registered as SK hynix after US imposes new sanctions that limit fab upgrades in China (Tom's Hardware)", "date": "2026-09-28" }, { "url": "https://www.infoworld.com/article/2236166/intel-to-invest-16-billion-in-china-plant-to-push-mobile-chip-development.html", "title": "Intel to invest $1.6 billion in China plant to push mobile chip development", "date": "2014-12-04" }, { "url": "https://www.yicai.com/news/102330103.html", "title": "世界500强企业宣布扩容成都封装测试基地", "date": "2024-10-28" }, { "url": "https://www.mrjjxw.com/articles/2026-07-21/4487128.html", "title": "英特尔中国区董事长王稚聪：正依托成都工厂建设先进制造人工智能实践中心", "date": "2026-07-21" }, { "url": "https://www.ithome.com/0/805/679.htm", "title": "英特尔成都封装测试基地扩容 (IT之家)", "date": "2024-10-28" } ] }, { "id": "tsmc-nanjing", "name_en": "TSMC Nanjing", "name_zh": "台积电（南京）有限公司", "name_pinyin": "Táijīdiàn (Nánjīng) Yǒuxiàn Gōngsī", "company_en": "Taiwan Semiconductor Manufacturing Company (TSMC)", "company_zh": "台湾积体电路制造股份有限公司", "company_pinyin": "Táiwān Jītǐ Diànlù Zhìzào Gǔfèn Yǒuxiàn Gōngsī", "partners": [], "location": { "city": "Nanjing", "province": "Jiangsu", "lat": 32.11, "lon": 118.6 }, "type": "Fab", "category": "Foreign-Invested", "capability": "12-inch (300mm) wafer foundry, 16nm and other mature nodes", "investment": { "total_rmb_100m": null, "total_usd_million": null, "source": "Foreign" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [ { "year": 2018, "node": "16nm FinFET (Fab 16 opening/mass-production ceremony 31 Oct 2018)" }, { "year": 2022, "node": "28nm (new capacity opening from 2H 2022)" } ], "narrative": { "significance": "TSMC's only 12-inch (300mm) fab in mainland China, producing 16nm and other mature-node chips — reported to contribute roughly 2.4% of TSMC's overall revenue per its 2024 annual report. Received a US annual export license (not individual per-shipment licenses) for chipmaking tool imports in early 2026, part of a broader shift from one-off vendor licensing to annual review for allied-country fabs operating in China.", "what_it_makes": "12-inch (300mm) wafers at 16nm and other mature process nodes — intentionally kept well behind TSMC's leading-edge Taiwan/Arizona/Japan nodes.", "why_it_matters": "The clearest example in this tracker of a foreign advanced-foundry leader operating a deliberately mature-node-only fab in China — TSMC has kept Nanjing's technology multiple generations behind its frontier nodes elsewhere, widely read as a deliberate choice to maintain a China manufacturing presence without exposing leading-edge process technology to export-control or diversion risk." }, "milestones": [ { "date": "2026-01-01", "event": "US Commerce Department grants TSMC Nanjing an annual export license for US-origin chipmaking tools, replacing individual per-shipment vendor licenses" } ], "complexity": { "technology_difficulty": 3, "foreign_dependence": 2, "capital_intensity": 4 }, "dates": { "announced": null, "approved": null, "construction_start": null, "original_expected_completion": null, "date_completion": null }, "sources": [ { "url": "https://www.cnbc.com/2026/01/01/us-grants-tsmc-licence-to-import-us-chipmaking-tools-into-china.html", "title": "U.S. grants TSMC annual licence to import U.S. chipmaking tools into China (CNBC)", "date": "2026-01-01" }, { "url": "https://www.scmp.com/tech/big-tech/article/3338380/us-grants-tsmc-annual-licence-import-american-chipmaking-tools-china", "title": "US grants TSMC annual licence to import American chipmaking tools into China (SCMP)", "date": "2026-01-01" }, { "url": "https://www.chinaflashmarket.com/a/163771", "title": "台积电南京12吋晶圆厂量产，2020年月产能达2万片", "date": "2018-11-01" }, { "url": "https://www.ithome.com/0/662/580.htm", "title": "台积电回应\"南京厂扩产暂停\"传闻：按计划进行", "date": "2022-12-21" } ] }, { "id": "tsmc-shanghai", "name_en": "TSMC Shanghai", "name_zh": "台积电（上海）有限公司", "name_pinyin": "Táijīdiàn (Shànghǎi) Yǒuxiàn Gōngsī", "company_en": "Taiwan Semiconductor Manufacturing Company (TSMC)", "company_zh": "台湾积体电路制造股份有限公司", "company_pinyin": "Táiwān Jītǐ Diànlù Zhìzào Gǔfèn Yǒuxiàn Gōngsī", "partners": [], "location": { "city": "Shanghai", "province": "Shanghai Municipality", "lat": 31.03, "lon": 121.22 }, "type": "Fab", "category": "Foreign-Invested", "capability": "8-inch (200mm) wafer foundry — TSMC Fab 10, Songjiang; legacy/mature nodes ~0.25µm–0.13/0.11µm class (no FinFET)", "investment": { "total_rmb_100m": null, "total_usd_million": 1300, "source": "Foreign" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "TSMC's original mainland China manufacturing site — Fab 10, a greenfield 200mm fab in the Songjiang Industrial Zone that began trial production on 1 August 2004 (build cost ~$1.3B per the Wikipedia fab-list; ~74,000 wafers/month planning figure), serving legacy-node analog/sensor/mixed-signal demand and still listed on TSMC's official fab-capacity disclosure in 2025 as one of two overseas 8-inch fabs. Node/wafer specifics are now confirmed against the Wikipedia dump cross-check; current capacity figures are not verified.", "what_it_makes": "0.25µm–0.11µm-class 200mm foundry wafers — analog, sensor and mixed-signal legacy work, multiple generations behind TSMC's frontier nodes.", "why_it_matters": "Alongside Nanjing, establishes that TSMC's mainland footprint is deliberately confined to mature/legacy process technology. Not affected by TSMC's Aug 2025 6-inch-exit/8-inch-consolidation plan (which targets Taiwan fabs Fab 5/2, with no verified closure of Fab 10 as of late 2026); it operates under the same annual US tool-export license granted to Nanjing in January 2026." }, "milestones": [ { "date": "2004-08-01", "event": "Fab 10 (Songjiang) trial production begins — TSMC's first mainland fab" }, { "date": "2026-01-01", "event": "Granted US annual export licence for chipmaking tools to China (shared regime with Nanjing)" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 2, "capital_intensity": 3 }, "dates": { "announced": "2003-08-01", "approved": null, "construction_start": "2003-08-01", "original_expected_completion": null, "date_completion": "2004-08-01" }, "sources": [ { "url": "https://www.cnbc.com/2026-01-01/us-grants-tsmc-licence-to-import-us-chipmaking-tools-into-china.html", "title": "U.S. grants TSMC annual licence to import U.S. chipmaking tools into China (CNBC) — notes TSMC 'also has a chipmaking plant in Shanghai'", "date": "2026-01-01" }, { "url": "https://www.digitimes.com/news/a20040806PR202.html", "title": "TSMC Shanghai begins trial production at 8-inch Fab 10 (DigiTimes)", "date": "2004-08-06" }, { "url": "https://www.tsmc.com/english/dedicatedFoundry/manufacturing/fab_capacity", "title": "TSMC Fab Capacity disclosure — 'TSMC China Company Limited' listed as overseas 8-inch fab", "date": "2025-12-31" } ] }, { "id": "umc-xiamen", "name_en": "UMC Xiamen (United Semiconductor)", "name_zh": "联芯集成电路制造（厦门）有限公司", "name_pinyin": "Liánxīn Jíchéng Diànlù Zhìzào (Xiàmén) Yǒuxiàn Gōngsī", "company_en": "United Microelectronics Corporation (UMC)", "company_zh": "联华电子", "company_pinyin": "Liánhuá Diànzǐ", "partners": [], "location": { "city": "Xiamen", "province": "Fujian", "lat": 24.48, "lon": 118.09 }, "type": "Fab", "category": "Foreign-Invested", "capability": "12-inch (300mm) wafer foundry, mature/legacy nodes", "investment": { "total_rmb_100m": 35, "total_usd_million": null, "source": "Foreign" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "Southern China's first 12-inch foundry fab, a UMC joint-venture entity branded United Semiconductor; began volume production in 2016.", "what_it_makes": "12-inch (300mm) wafers at mature/legacy process nodes for foundry customers.", "why_it_matters": "A second Taiwanese foundry major (alongside TSMC) with an operating mainland China fab, reinforcing that cross-strait manufacturing links persist in mature-node foundry work even as the leading-edge relationship (TSMC's most advanced nodes, UMC's own frontier R&D) stays firmly based in Taiwan." }, "milestones": [ { "date": "2016-01-01", "event": "Begins volume production as southern China's first 12-inch foundry fab" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 2, "capital_intensity": 3 }, "dates": { "announced": null, "approved": null, "construction_start": null, "original_expected_completion": null, "date_completion": "2016-01-01" }, "sources": [ { "url": "https://cleanroomtechnology.com/umc-opens-new-12-inch-wafer-fab-in-china", "title": "UMC opens new 12-inch wafer fab in China (Cleanroom Technology)", "date": "2026-09-28" }, { "url": "https://www.eetimes.com/umc-agrees-12-fab-joint-venture-china/", "title": "UMC Agrees to 12\" Fab Joint Venture in China (EE Times)", "date": "2026-09-28" }, { "url": "https://www.digitimes.com/news/a20200212VL201.html", "title": "UMC to pour CNY3.5 billion into China 12-inch fab operation (Digitimes)", "date": "2020-02-12" } ] }, { "id": "cxmt-shanghai", "name_en": "CXMT Shanghai (Pudong DRAM 'Super Factory')", "name_zh": "长鑫存储上海基地", "name_pinyin": "Chángxīn Cúnchǔ Shànghǎi Jīdì", "company_en": "ChangXin Memory Technologies (CXMT)", "company_zh": "长鑫存储技术有限公司", "company_pinyin": "Chángxīn Cúnchǔ Jìshù Yǒuxiàn Gōngsī", "partners": [], "location": { "city": "Shanghai", "province": "Shanghai Municipality", "lat": 31.21, "lon": 121.65 }, "type": "Memory", "category": "State-Backed", "capability": "12-inch (300mm) DRAM wafer fab — DDR5, LPDDR5X, and HBM3", "investment": { "total_rmb_100m": 345, "source": "Local Govt" }, "status": "Under Construction", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "A genuinely new DRAM mega-fab, separate from CXMT's Hefei headquarters site, entering substantive construction in March 2026 — this tracker did not capture it in an earlier pass, and it is one of the single largest individual under-construction projects in this entire dataset. Planned monthly capacity of 400,000-600,000 wafers would be 2-3x CXMT's existing Hefei output.", "what_it_makes": "High-end DDR5 and LPDDR5X DRAM, plus a dedicated HBM3 line (50,000 wafers/month of the planned total) aimed at AI compute, server, and automotive-grade demand.", "why_it_matters": "If completed on the stated schedule, this single fab would roughly double CXMT's total DRAM capacity and push the company further up the global DRAM ranking — concrete evidence that the 'many fabs under construction' reality in China is larger than a facility-by-facility reading of status fields that lag real-time news can capture without active, repeated rechecking." }, "milestones": [ { "date": "2026-03-01", "event": "Project enters substantive construction progress" }, { "date": "2026-09-28", "event": "CXMT announces it will deploy ¥18 billion of IPO over-subscription proceeds toward DRAM R&D and a Phase 2 back-end (wafer test) base, part of a combined ¥34.9 billion in related investment" } ], "complexity": { "technology_difficulty": 4, "foreign_dependence": 3, "capital_intensity": 5 }, "dates": { "announced": "2026-03-01", "approved": null, "construction_start": "2026-03-01", "original_expected_completion": "2028-12-31", "date_completion": null }, "sources": [ { "url": "https://www.toutiao.com/article/7602594871840490030/", "title": "长鑫存储上海新厂2027年投产，将填补哪些高端DRAM空白？ (今日头条)", "date": "2026-09-28" }, { "url": "https://www.esmchina.com/news/14639.html", "title": "长鑫存储宣布349亿元重大项目投资 (国际电子商情)", "date": "2026-09-28" }, { "url": "https://news.qq.com/rain/a/20260929A035RG00", "title": "超募368亿！长鑫180亿加码DRAM研发与测试！ (腾讯新闻)", "date": "2026-09-29" } ] }, { "id": "xian-chipyear-era", "name_en": "Chipyear Era Xi'an (8-inch Power Semiconductor Line)", "name_zh": "陕西电子芯业时代科技有限公司", "name_pinyin": "Shǎnxī Diànzǐ Xīnyè Shídài Kējì Yǒuxiàn Gōngsī", "company_en": "Shaanxi Electronics Chipyear Era Technology Co., Ltd.", "company_zh": "陕西电子芯业时代科技有限公司", "company_pinyin": "Shǎnxī Diànzǐ Xīnyè Shídài Kējì Yǒuxiàn Gōngsī", "partners": "Shaanxi provincial government", "location": { "city": "Xi'an", "province": "Shaanxi", "lat": 34.3, "lon": 108.9 }, "type": "Fab", "category": "State-Backed", "capability": "8-inch (200mm) power semiconductor fab — IGBT, silicon carbide (SiC) chips", "investment": { "total_rmb_100m": 45, "source": "Local Govt" }, "status": "Under Construction", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "Northwest China's first 8-inch specialty-process semiconductor line — another facility this tracker missed in its first passes, illustrating that under-construction projects outside the handful of best-covered hubs (Shanghai, Beijing, Shenzhen) are easy to miss without deliberately searching provincial and industry-trade coverage rather than only the most prominent national outlets.", "what_it_makes": "Industrial-grade and automotive-grade power semiconductors — IGBTs and silicon carbide (SiC) chips — for EVs, renewable energy storage, and AI data center power systems, not logic or memory.", "why_it_matters": "A reminder that China's fab build-out is not only about advanced logic and memory — mature-node power semiconductors for the EV and renewable-energy supply chains are a large, separate wave of construction with their own set of projects, mostly outside the export-control narrative entirely." }, "milestones": [ { "date": "2025-12-01", "event": "Phase 1 (¥3.2 billion, 50,000 wafers/month design capacity) completes and enters production" }, { "date": "2026-09-01", "event": "Phase 2 construction preparation begins, formal start targeted for Q3 2026, (the 8-inch line's total investment is ¥4.5 billion per Shaanxi SASAC, ¥3.2 billion of it spent in Phase 1; a larger ¥19 billion plan appears only in secondary coverage)" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 2, "capital_intensity": 4 }, "dates": { "announced": null, "approved": null, "construction_start": "2025-01-01", "original_expected_completion": null, "date_completion": "2025-12-01" }, "sources": [ { "url": "https://www.peopleapp.com/column/30052407887-500007548337", "title": "陕西西安 锻造“芯光同辉”产业新引擎 (人民日报)", "date": "2026-06-16" }, { "url": "https://finance.sina.com.cn/roll/2026-06-09/doc-iniauzkt5103109.shtml", "title": "陕西芯业时代8英寸芯片生产线项目预计Q3启动二期建设 (新浪财经)", "date": "2026-06-09" }, { "url": "https://m.jiemian.com/article/13804571.html", "title": "西北首条8英寸高性能特色工艺半导体生产线投产 (界面新闻, reprinting Shaanxi SASAC; publish date not shown, date below is access date)", "date": "2026-10-11" } ] }, { "id": "smic-lingang-phase2", "name_en": "SMIC Shanghai (Lingang) Phase 2", "name_zh": "中芯临港二期", "name_pinyin": "Zhōngxīn Língǎng Èrqī", "company_en": "SMIC", "company_zh": "中芯国际集成电路制造有限公司", "company_pinyin": "Zhōngxīn Guójì Jíchéng Diànlù Zhìzào Yǒuxiàn Gōngsī", "partners": "Shanghai Municipal Government", "location": { "city": "Shanghai", "province": "Shanghai Municipality", "lat": 30.885, "lon": 121.921 }, "type": "Fab", "category": "JV", "capability": "12-inch (300mm) wafer foundry, 28nm and below — second-phase expansion of the Lingang site", "investment": { "total_rmb_100m": null, "source": "Local Govt" }, "status": "Under Construction", "entity_list": { "status": true, "date_added": "2020-12-18", "list": "US Commerce BIS" }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "Tracked as a separate entry from `smic-lingang` (which covers the operational Phase 1, 20,000 wafers/month) because Phase 2 is a distinct, actively-under-construction expansion with its own timeline — collapsing both into a single 'Operational' status would have hidden the fact that this site is still a live construction project, not a finished one.", "what_it_makes": "Additional 12-inch (300mm) wafer capacity at 28nm and below, once complete.", "why_it_matters": "One of several cases in this tracker where a facility's original phase is producing chips today while a large, separately-timed expansion is simultaneously under construction at the same site — a pattern that a single facility-level status field tends to obscure unless each phase gets its own entry." }, "milestones": [ { "date": "2026-07-08", "event": "China Construction Eighth Engineering Bureau wins the general contract for the Fab9-P3 building and Fab9-P4 foundation works" }, { "date": "2026-09-01", "event": "Construction of Phase 2 reported as formally starting, targeting delivery by end of 2027" } ], "complexity": { "technology_difficulty": 3, "foreign_dependence": 4, "capital_intensity": 5 }, "dates": { "announced": null, "approved": null, "construction_start": "2026-09-01", "original_expected_completion": "2027-12-31", "date_completion": null }, "sources": [ { "url": "https://finance.sina.com.cn/roll/2026-06-30/doc-inifehiu4887824.shtml", "title": "上海临港新片区芯港集成晶圆制造项目正式开工 (新浪财经)", "date": "2026-06-30" }, { "url": "https://www.guancha.cn/economy/2026_07_03_822486.shtml", "title": "我国多个半导体项目集中落地，投资额超1000亿，覆盖三大方向 (观察者网)", "date": "2026-07-03" } ] }, { "id": "nexchip-phase4", "name_en": "Nexchip Hefei Phase 4", "name_zh": "晶合集成四期", "name_pinyin": "Jīnghé Jíchéng Sìqī", "company_en": "Nexchip Semiconductor Corporation", "company_zh": "晶合集成电路股份有限公司", "company_pinyin": "Jīnghé Jíchéng Diànlù Gǔfèn Yǒuxiàn Gōngsī", "partners": ["Powerchip Semiconductor Manufacturing Corporation (Taiwan)", "Hefei City Construction and Investment Holding Group"], "location": { "city": "Hefei", "province": "Anhui", "lat": 31.82, "lon": 117.23 }, "type": "Fab", "category": "JV", "capability": "12-inch (300mm) wafer foundry — fourth-phase expansion", "investment": { "total_rmb_100m": 355, "source": "Local Govt" }, "status": "Under Construction", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "Tracked separately from the main `nexchip-hefei` entry (which covers existing operational capacity) because this fourth phase is a distinct, large, separately-financed expansion — ¥35.5 billion for a new 55,000 wafer/month line — launched in January 2026.", "what_it_makes": "Additional 12-inch (300mm) wafer foundry capacity once complete.", "why_it_matters": "Full capacity is targeted for end of 2028, a multi-year construction horizon typical of the current wave of China fab expansions — a reminder that 'under construction' projects in this sector often run 2-3 years from groundbreaking to full ramp, not months." }, "milestones": [ { "date": "2026-01-01", "event": "Phase 4 launched: ¥35.5 billion investment in a new 55,000 wafer/month 12-inch line" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 2, "capital_intensity": 4 }, "dates": { "announced": "2026-01-01", "approved": null, "construction_start": "2026-01-01", "original_expected_completion": "2028-12-31", "date_completion": null }, "sources": [ { "url": "https://www.esmchina.com/marketnews/56518.html", "title": "半导体扩产：晶合355亿四期项目开建、华虹官宣82亿收购 (国际电子商情)", "date": "2026-09-28" } ] }, { "id": "huahong-wuxi-phase3", "name_en": "Hua Hong Wuxi Phase 3", "name_zh": "华虹无锡三期", "name_pinyin": "Huáhóng Wúxī Sānqī", "company_en": "Hua Hong Semiconductor", "company_zh": "华虹半导体", "company_pinyin": "Huáhóng Bàndǎotǐ", "partners": [], "location": { "city": "Wuxi", "province": "Jiangsu", "lat": 31.57, "lon": 120.3 }, "type": "Fab", "category": "State-Backed", "capability": "12-inch (300mm) wafer foundry — third Wuxi phase", "investment": { "total_usd_million": 6950, "source": "Local Govt" }, "status": "Under Construction", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "capacity": { "basis": "planned", "wafers_per_month": 55000, "wafer_size": "300mm", "as_of": "2027-12", "note": "planned; line to be built and in production by Dec 2027 (company target)" }, "narrative": { "significance": "Tracked separately from `huahong-wuxi-fab9` (Fab9/Phase II, now operational) because this third phase (Fab 9B) is a distinct, separately-announced US$6.95 billion investment (of which Hua Hong group's share is about $2.127 billion) with construction having started in March 2026 — Hua Hong's expansion in Wuxi is an open-ended, multi-phase programme rather than a single project.", "what_it_makes": "Additional 12-inch (300mm) wafer capacity at mature specialty nodes, once complete.", "why_it_matters": "Alongside Nexchip Phase 4 and SMIC Lingang Phase 2, this is one of several concurrent 'next phase' projects at sites this tracker had already marked Operational based on an earlier phase — the clearest illustration of why a single facility-level status field needs per-phase entries to stay accurate." }, "milestones": [ { "date": "2026-03-01", "event": "Construction begins on a third Wuxi phase" }, { "date": "2026-09-01", "event": "Hua Hong Semiconductor formally announces the Wuxi Phase 3 joint venture: US$6.95 billion total (US$4.17B equity, US$2.78B debt), group share about US$2.127 billion, 55,000 wafers/month" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 2, "capital_intensity": 4 }, "dates": { "announced": "2026-09-01", "approved": null, "construction_start": "2026-03-01", "original_expected_completion": null, "date_completion": null }, "sources": [ { "url": "https://www.esmchina.com/news/14554.html", "title": "华虹宏力21亿美元增资无锡三期：月产5.5万片12英寸产线落地 (国际电子商情)", "date": "2026-09-01" }, { "url": "https://static.cninfo.com.cn/finalpage/2026-09-01/1225542762.PDF", "title": "华虹宏力：有关合营投资协议及合营股东协议的须予披露交易 (HKEX announcement)", "date": "2026-09-01" }, { "url": "https://static.cninfo.com.cn/finalpage/2026-09-04/1225548867.PDF", "title": "华虹宏力：(1)建议变更人民币股份发行所得款项用途；(2)建议对外投资无锡市合营企业III；及(3)股东特别大会通告 (HKEX circular)", "date": "2026-09-04" } ] }, { "id": "innoscience-suzhou", "name_en": "Innoscience Suzhou", "name_zh": "英诺赛科（苏州）科技股份有限公司", "name_pinyin": "Yīngnuò Sàikē (Sūzhōu) Kējì Gǔfèn Yǒuxiàn Gōngsī", "company_en": "Innoscience (Suzhou) Technology Holding Co., Ltd.", "company_zh": "英诺赛科（苏州）科技股份有限公司", "company_pinyin": "Yīngnuò Sàikē (Sūzhōu) Kējì Gǔfèn Yǒuxiàn Gōngsī", "partners": [], "location": { "city": "Suzhou", "province": "Jiangsu", "lat": 31.06, "lon": 120.64 }, "type": "Compound Semiconductor", "category": "Private", "capability": "8-inch (200mm) silicon-based gallium nitride (GaN) power semiconductor IDM — design, fab, and packaging in-house", "investment": { "total_rmb_100m": null, "source": "Private" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "Missed in this tracker's earlier passes despite being the world's first company to mass-produce 8-inch silicon-based GaN wafers and, by one 2023 estimate, holder of roughly 42.4% of the global GaN power semiconductor market — illustrating a gap in this tracker's own coverage: it has focused heavily on silicon logic and memory, and had zero entries of type 'Compound Semiconductor' until this one, despite that category existing in the schema since Phase 1. Founded December 17, 2015 by chairperson Luo Weiwei; listed on the Hong Kong Stock Exchange (02577.HK) on December 30, 2024.", "what_it_makes": "Gallium nitride (GaN) power semiconductors — not silicon — for AI data center power supplies, automotive (EV), and fast-charging applications. An IDM (integrated device manufacturer): Innoscience designs, fabricates, and packages its own chips rather than using a foundry.", "why_it_matters": "GaN is a materially different technology bet from the silicon-based story that dominates most of this tracker — it targets power efficiency (AI data center power delivery, EV inverters) rather than logic density or export-control-constrained lithography, and China's GaN leadership is comparatively undercovered relative to its advanced-logic and memory narratives despite Innoscience's genuine global market-share lead." }, "milestones": [ { "date": "2015-12-17", "event": "Founded in Suzhou (Wujiang District) by Luo Weiwei" }, { "date": "2024-12-30", "event": "Lists on the Hong Kong Stock Exchange (02577.HK)" }, { "date": "2026-08-29", "event": "Reports H1 2026 revenue of ¥834 million (+50.6% YoY) and a narrowed net loss of ¥309 million (-27.9% YoY), alongside reaching positive operating cash flow for the first time" }, { "date": "2026-12-31", "event": "Targeted completion of an 8-inch GaN capacity expansion from 13,000 to 20,000 wafers/month" } ], "complexity": { "technology_difficulty": 4, "foreign_dependence": 2, "capital_intensity": 4 }, "dates": { "announced": "2015-12-17", "approved": null, "construction_start": null, "original_expected_completion": null, "date_completion": null }, "sources": [ { "url": "https://en.wikipedia.org/wiki/Innoscience", "title": "Innoscience (Wikipedia)", "date": "2026-09-28" }, { "url": "https://news.qq.com/rain/a/20260829A00N2A00", "title": "英诺赛科发布中期业绩 销售收入同比增长50.6%至8.34亿元 实现经营净现金流转正里程碑 (腾讯新闻)", "date": "2026-08-29" }, { "url": "https://www.eet-china.com/news/202507143854.html", "title": "英诺赛科扩产：8英寸氮化镓晶圆产能年底将达到每月20000片 (电子工程专辑)", "date": "2026-09-28" } ] }, { "id": "cansemi-guangzhou", "name_en": "CanSemi (Guangzhou)", "name_zh": "粤芯半导体技术股份有限公司", "name_pinyin": "Yuèxīn Bàndǎotǐ", "company_en": "CanSemi Technology Inc.", "company_zh": "粤芯半导体技术股份有限公司", "company_pinyin": "Yuèxīn Bàndǎotǐ Jìshù Gǔfèn Yǒuxiàn Gōngsī", "partners": ["Guangzhou municipal and Huangpu district state vehicles", "Guangdong provincial funds"], "location": { "city": "Guangzhou", "province": "Guangdong", "lat": 23.29, "lon": 113.53 }, "type": "Fab", "category": "State-Backed", "capability": "12-inch (300mm) specialty analog/mixed-signal foundry, 180nm–55nm; PMIC, fingerprint, display driver, CIS, power, and silicon-photonics platforms", "investment": { "total_rmb_100m": null, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "Guangdong province's first and only scaled 12-inch wafer fab — the province that consumes an estimated ~40% of China's chips had no domestic 12-inch mass production before CanSemi. Phases 1–3 are in production at ~63,300 wafers/month realized versus 80,000 planned (end-2025), with a third fab (Phase 3, ¥16.25 billion) online since December 2024 and a ¥25.2 billion Phase 4 (third site, 480,000 wafers/year mixed-signal) started January 2026.", "what_it_makes": "Analog/power-management, fingerprint-sensor, display-driver, CIS and power chips on 12-inch wafers — plus, uniquely among mainland foundries, mass-production 12-inch silicon-photonics wafers (90nm platform feeding 400G/800G/1.6T optical modules).", "why_it_matters": "Its IPO cleared the ChiNext listing committee in June 2026 as the board's first pre-profit wafer-fab listing under Standard 3, with CSRC registration approved 28 August 2026 — a template for funding loss-making specialty fabs with public markets. Prospectus coverage shows revenues of ¥1.044/1.681/2.582 billion (2023-2025) against net losses of ¥1.917/2.253/2.346 billion, with earliest guided profitability in 2029 — how capital-hungry the model is." }, "milestones": [ { "date": "2019-09-01", "event": "Phase 1 enters production, ~18 months after groundbreaking" }, { "date": "2024-12-28", "event": "Phase 3 (second fab, ¥16.25 billion, +40,000 wafers/month) line activated" }, { "date": "2026-01-22", "event": "Phase 4 (¥25.2 billion, 480,000 wafers/year mixed-signal, nodes roadmap to 65-22nm) formally started" }, { "date": "2026-06-15", "event": "ChiNext IPO approved by listing committee — first pre-profit wafer fab on the board" }, { "date": "2026-08-28", "event": "CSRC registration approval received for the IPO (planned raise ¥7.5 billion)" } ], "complexity": { "technology_difficulty": 3, "foreign_dependence": 4, "capital_intensity": 5 }, "dates": { "announced": "2017-12-01", "approved": null, "construction_start": "2018-03-01", "original_expected_completion": null, "date_completion": "2019-09-01" }, "sources": [ { "url": "http://www.news.cn/tech/20260123/1b1c540bf37b4e73b95e8a15dba491df/c.html", "title": "总投资252亿元 粤芯半导体年产48万片晶圆生产线启动 (新华网)", "date": "2026-01-23" }, { "url": "http://www.zqrb.cn/gscy/qiyexinxi/2026-08-28/A1787914927566.html", "title": "粤芯半导体取得IPO注册批文 (证券日报)", "date": "2026-08-28" }, { "url": "https://www.esmchina.com/news/14267.html", "title": "粤芯半导体IPO过会 (国际电子商情)", "date": "2026-06-16" } ] }, { "id": "unitednova-shaoxing", "name_en": "United Nova Technology (Shaoxing)", "name_zh": "芯联集成电路制造股份有限公司", "name_pinyin": "Xīnlián Jíchéng Diànlù Zhìzào Gǔfèn Yǒuxiàn Gōngsī", "company_en": "United Nova Technology Co., Ltd. (STAR: 688469)", "company_zh": "芯联集成电路制造股份有限公司", "company_pinyin": "Xīnlián Jíchéng Diànlù Zhìzào Gǔfèn Yǒuxiàn Gōngsī", "partners": ["Shaoxing Yuecheng district fund", "SMIC Holdings", "China Development Bank policy capital"], "location": { "city": "Shaoxing", "province": "Zhejiang", "lat": 30.01, "lon": 120.59 }, "type": "Fab", "category": "State-Backed", "capability": "8-inch silicon power (IGBT/MOSFET), MEMS (largest Chinese MEMS wafer foundry), 6/8-inch SiC, and 12-inch mixed-signal/analog — automotive-grade focus", "investment": { "total_rmb_100m": null, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "Grew out of the 2018 SMIC–Shaoxing JV (中芯绍兴/中芯集成, renamed 芯联集成 on its 2022 STAR listing); today China's leading automotive power-semiconductor foundry — #1 Chinese SiC device maker by 2025 Yole ranking, in the global top-5 MEMS foundries — with 2025 output of 2.51 million 8-inch-equivalent wafers (+24.7%). Phase 3 (12-inch mixed-signal, ¥22.2 billion total, 100,000 wafers/month planned) is ramping from ~30,000/month; Phase 4 (¥20 billion, 50,000 wafers/month for 40/28nm MCU, 90/55nm BCD/DrMOS and 55nm silicon photonics) was announced June 2026.", "what_it_makes": "Car-grade IGBT/MOSFET and SiC MOSFET chips, MEMS sensors, analog/BCD and mixed-signal chips for EVs, industrial, renewables and AI-server power/optical I/O.", "why_it_matters": "Its 8-inch SiC line was China's first (engineering wafers April 2024, mass production confirmed August 2025) — SiC vehicle main-drive modules are the single highest-value target of China's power-semi push, and UnitedNova operates the scaled foundry slot for it. No controlling shareholder: largest holders Yuecheng Fund (local state) 13.74% and SMIC Holdings 11.85%." }, "milestones": [ { "date": "2018-12-01", "event": "Founded as the SMIC–Shaoxing joint venture (中芯绍兴)" }, { "date": "2024-04-01", "event": "China's first 8-inch SiC line produces engineering wafers" }, { "date": "2025-08-07", "event": "8-inch SiC confirmed in mass production; Phase 3 12-inch line at ~30,000 wafers/month of planned 100,000" }, { "date": "2026-06-11", "event": "¥20 billion Phase 4 JV announced — 50,000 wafers/month 12-inch for 40/28nm MCU, BCD/DrMOS and 55nm silicon photonics" } ], "complexity": { "technology_difficulty": 3, "foreign_dependence": 3, "capital_intensity": 5 }, "dates": { "announced": "2018-12-01", "approved": null, "construction_start": "2019-12-01", "original_expected_completion": null, "date_completion": null }, "sources": [ { "url": "https://www.cls.cn/detail/2397613", "title": "200亿！芯联集成拟扩产+布局光互连 (财联社)", "date": "2026-06-11" }, { "url": "http://money.finance.sina.com.cn/corp/view/vCB_AllBulletinDetail.php?id=12120051&stockid=688469", "title": "芯联集成2025年年度报告 (新浪财经公告)", "date": "2026-04-30" }, { "url": "https://www.mrjjxw.com/articles/2026-06-12/4424755.html", "title": "功率半导体代工龙头芯联集成启动200亿元四期项目 (每日经济新闻)", "date": "2026-06-12" } ] }, { "id": "jita-shanghai", "name_en": "GTA Semiconductor (Shanghai Lingang)", "name_zh": "上海积塔半导体有限公司", "name_pinyin": "Shànghǎi Jītǎ Bàndǎotǐ Yǒuxiàn Gōngsī", "company_en": "Shanghai Jita Integrated Technology Service Co., Ltd. (GTA Semi)", "company_zh": "上海积塔半导体有限公司", "company_pinyin": "Shànghǎi Jītǎ Bàndǎotǐ Yǒuxiàn Gōngsī", "partners": ["Huada Semiconductor (CEC)", "National Structural Fund", "SAIC, Inovance, Xiaomi funds, Shanghai state vehicles"], "location": { "city": "Shanghai", "province": "Shanghai Municipality", "lat": 30.91, "lon": 121.92 }, "type": "Fab", "category": "State-Backed", "capability": "Car-grade specialty foundry — 8-inch (IGBT, MOSFET, BCD, eNVM/MCU), 12-inch (90-40nm auto MCU/analog/PMIC, line activated 2023, ramping), 6-inch SiC, plus legacy 5/6-inch lines", "investment": { "total_rmb_100m": 359, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "CEC's (China Electronics Corporation) manufacturing anchor and China's flagship state-owned car-grade specialty foundry — a ¥35.9 billion Lingang complex (groundbreaking August 2018) merged with the legacy Shanghai Advanced (SAS) semiconductor plant, plus an ¥8 billion November 2021 strategic round featuring automaker (SAIC), industrial (Inovance) and Xiaomi supply-chain investors.", "what_it_makes": "Automotive/industrial MCU, BCD analog/PMIC, IGBT/MOSFET and sensor wafers; company capacity pages report 8-inch output above 1.3 million wafers/year, with the 12-inch line (planned ~500,000 wafers/year at full capacity) still marked under construction/ramping.", "why_it_matters": "One of the very few dedicated car-grade 12-inch lines in China and one of the few domestic SiC (6-inch) and FeRAM/eNVM capability holders — a key supply node if China's domestic car-MCU push continues; still private (named a national 'unicorn' in 2026); no verified IPO filing as of this pass." }, "milestones": [ { "date": "2018-08-01", "event": "¥35.9 billion Lingang specialty-process line breaks ground; merger with legacy Shanghai Advanced Semiconductor agreed" }, { "date": "2021-11-30", "event": "¥8 billion strategic financing completed, led by Huada Semiconductor (CEC)" }, { "date": "2023-06-28", "event": "12-inch line activated (tool line-out)" }, { "date": "2025-12-10", "event": "Wins 'Influential SiC Wafer Manufacturing Service' at the行家极光 awards" } ], "complexity": { "technology_difficulty": 3, "foreign_dependence": 3, "capital_intensity": 5 }, "dates": { "announced": "2017-01-01", "approved": "2018-08-01", "construction_start": "2018-08-01", "original_expected_completion": null, "date_completion": null }, "sources": [ { "url": "http://www.sasac.gov.cn/n2588025/n2588139/c15768428/content.html", "title": "上海临港崛起'东方芯港' (国务院国资委)", "date": "2020-10-26" }, { "url": "https://www.ne-time.cn/web/article/22790", "title": "积塔半导体获80亿元战略融资 (NE时代)", "date": "2021-11-30" }, { "url": "https://www.gtasemi.com.cn/news", "title": "积塔半导体官网新闻中心（含产能口径：8英寸>130万片/年，12英寸在建）", "date": "2026-10-01" } ] }, { "id": "hlmc-shanghai", "name_en": "HLMC (Shanghai Huali, Fab 5 & Fab 6)", "name_zh": "上海华力微电子有限公司 / 上海华力集成电路制造有限公司", "name_pinyin": "Shànghǎi Huálì Wēidiànzǐ", "company_en": "Hua Hong Semiconductor Group (HLMC)", "company_zh": "上海华力微电子有限公司（华虹五厂）；上海华力集成电路制造有限公司（华虹六厂）", "company_pinyin": "Shànghǎi Huálì Jíchéng Diànlù Zhìzào Yǒuxiàn Gōngsī", "partners": ["Hua Hong Group (Shanghai SASAC)", "Big Fund II", "Shanghai IC Industry Fund"], "location": { "city": "Shanghai", "province": "Shanghai Municipality", "lat": 31.2, "lon": 121.6 }, "type": "Fab", "category": "State-Backed", "capability": "Fab 5 (Zhangjiang): 12-inch, 65/55nm and 40nm logic/NOR/RF, 38,000 wafers/month. Fab 6 (Kangqiao): 12-inch, 28/22nm, capacity not sourced. Hua Hong's 2026 acquisition covers Fab 5 only", "investment": { "total_rmb_100m": null, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [ { "year": 2014, "node": "55nm (CIS phone products in volume, Fab 5)" }, { "year": 2017, "node": "55nm SONOS embedded memory in volume (Fab 5)" }, { "year": 2019, "node": "28nm HKC+ (mass production start; Fab 6 is the 28nm fab)" } ], "capacity": { "basis": "installed", "wafers_per_month": 38000, "wafer_size": "300mm", "as_of": "2026-05", "note": "Fab 5 (华力微, Zhangjiang) design capacity only; Fab 6 (华力集成) has no sourced figure" }, "narrative": { "significance": "Mainland China's first fully-automated 12-inch fab (Fab 5, first wafers April 2011, built under the 'Project 909' upgrade lineage) and one of very few domestic 28/22nm logic sites (Fab 6, wafers since October 2018). In September 2026 Fab 5 formally merged into the listed Hua Hong entity (688347/1347.HK) via an ¥8.268 billion share deal — resolving the group's long-standing IPO-era same-competition commitment; Fab 5 contributed ~¥5 billion revenue and >¥500 million net profit in 2024.", "what_it_makes": "12-inch foundry wafers at 65/55/40nm (Fab 5, incl. NOR/eNVM, RF, BSI plans) and 28/22nm (Fab 6, still outside the listed company under group ownership).", "why_it_matters": "Consolidates China's #2 foundry group's 12-inch base at ~a sixth of national 12-inch capacity, and keeps one of the few domestic 28nm logic lines — the node where export controls bite hardest — inside a state-owned structure. The follow-on ¥7.556 billion placement funds a ¥2.53 billion BSI and ¥562 million BCD program." }, "milestones": [ { "date": "2011-04-01", "event": "Fab 5 (Huali 1) first wafers — mainland's first automated 12-inch fab" }, { "date": "2018-10-01", "event": "Fab 6 (Huali 2, 28/22nm, Kangqiao) first wafers" }, { "date": "2025-08-17", "event": "Hua Hong announces acquisition of controlling stake in Huali Micro (Fab 5), fulfilling IPO commitment" }, { "date": "2026-09-11", "event": "Share transfer completed — Fab 5 becomes wholly within the listed Hua Hong company" } ], "complexity": { "technology_difficulty": 4, "foreign_dependence": 4, "capital_intensity": 5 }, "dates": { "announced": "2010-01-01", "approved": null, "construction_start": "2010-01-01", "original_expected_completion": null, "date_completion": "2011-04-01" }, "sources": [ { "url": "https://www.stcn.com/article/detail/3142230.html", "title": "停牌！A股芯片巨头，刚刚公告！ (证券时报)", "date": "2025-08-17" }, { "url": "http://www.jjckb.cn/20260210/f8ff9880eaa14bdea1cb27ef09ac1f89/c.html", "title": "华虹公司股东大会通过华力微收购全部议案 (经济参考报)", "date": "2026-02-10" }, { "url": "https://news.qq.com/rain/a/20260911A0GGGQ00", "title": "发行股份购买华力微完成过户，华虹整合12英寸产能 (腾讯新闻)", "date": "2026-09-11" }, { "url": "https://static.cninfo.com.cn/finalpage/2026-05-30/1225340255.PDF", "title": "华虹半导体有限公司发行股份购买资产并募集配套资金暨关联交易报告书（修订稿）", "date": "2026-05-30" }, { "url": "https://technews.tw/?p=447689", "title": "華力微繼中芯國際後宣布 2020 年量產 14 奈米，良率將是發展關鍵", "date": "2019-03-22" } ] }, { "id": "crmicro-chongqing", "name_en": "CR Micro Chongqing (Runxi 12-inch Power Line)", "name_zh": "润西微电子（重庆）有限公司", "name_pinyin": "Rùn Xī Wēidiànzǐ (Chóngqìng)", "company_en": "CR Microelectronics Ltd. (STAR: 688396)", "company_zh": "华润微电子有限公司", "company_pinyin": "Huárùn Wēi Diànzǐ Yǒuxiàn Gōngsī", "partners": ["Big Fund II", "Chongqing Xiyong industrial state vehicles"], "location": { "city": "Chongqing", "province": "Chongqing Municipality", "lat": 29.59, "lon": 106.33 }, "type": "Fab", "category": "State-Backed", "capability": "12-inch automotive-grade power semiconductors — SGT/SJ MOSFET, IGBT (G7 class), power management; 30,000 wafers/month design capacity", "investment": { "total_rmb_100m": 75.5, "source": "Big Fund II" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "Reported as China's first domestic automotive-grade 12-inch power-semiconductor fab, from China Resources' CR Micro — the country's largest IDM power-semi maker (MOSFET #1 domestically). Hit its 30,000 wafers/month output target in August 2025, roughly 18 months ahead of plan.", "what_it_makes": "12-inch power wafers: automotive/industrial MOSFETs and IGBTs feeding CR Micro's module business and EV/PV/storage customers.", "why_it_matters": "Evidence that China's power-semi migration to 12-inch wafers (the global industry's current cost frontier) is happening at scale and ahead of schedule; July 2026 reporting had CR Micro raising prices across categories ~15% amid 9-month order books — the 2026 power-semi shortage cycle in one company." }, "milestones": [ { "date": "2021-06-07", "event": "¥7.55 billion 12-inch power line (Runxi Micro) announced; registered capital ¥5 billion (CR 19%, Big Fund II and Chongqing Xiyong holders)" }, { "date": "2025-08-01", "event": "30,000 wafers/month output achieved, ~18 months ahead of schedule" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 3, "capital_intensity": 4 }, "dates": { "announced": "2021-06-07", "approved": "2021-06-07", "construction_start": "2021-11-01", "original_expected_completion": null, "date_completion": "2025-08-01" }, "sources": [ { "url": "https://stcn.com/article/detail/382164.html", "title": "华润微子公司拟投建12吋功率半导体晶圆生产线 预计投资75.5亿元 (证券时报)", "date": "2021-06-07" }, { "url": "https://www.eet-china.com/mp/a437365.html", "title": "30000片！华润微电子重庆12吋项目提前达成目标 (电子工程专辑)", "date": "2025-09-11" } ] }, { "id": "crmicro-shenzhen", "name_en": "CR Micro Shenzhen (Runpeng 12-inch Analog Line)", "name_zh": "润鹏半导体（深圳）有限公司", "name_pinyin": "Rùn Péng Bàndǎotǐ (Shēnzhèn)", "company_en": "CR Microelectronics Ltd. (STAR: 688396)", "company_zh": "华润微电子有限公司", "company_pinyin": "Huárùn Wēi Diànzǐ Yǒuxiàn Gōngsī", "partners": ["Shenzhen municipal investment vehicles (深重投)", "Big Fund"], "location": { "city": "Shenzhen", "province": "Guangdong", "lat": 22.7, "lon": 113.82 }, "type": "Fab", "category": "State-Backed", "capability": "12-inch analog/mixed-signal specialty (BCD, high-voltage, RF, Flash), ≥40nm-class; 40,000 wafers/month planned", "investment": { "total_rmb_100m": 220, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "Shenzhen's second 12-inch wafer fab (after SMIC Shenzhen), part of Guangdong's push to give the province a 'third pole' of chip manufacturing; ¥22 billion phase-1 total, with CR Micro contributing ¥2.475 billion cash into the ¥15 billion-capital Runpeng JV.", "what_it_makes": "12-inch analog/mixed-signal specialty wafers (power management, BCD, RF) for consumer, industrial and automotive customers.", "why_it_matters": "Line activated 31 December 2024 and was reported at ~15,000 wafers/month by Q1 2026, targeting full 40,000/month by 2027 — a real-time case study of how long (2-3 years) a greenfield specialty 12-inch line actually takes to ramp." }, "milestones": [ { "date": "2022-10-01", "event": "Runpeng 12-inch line breaks ground in Bao'an '湾区芯城' (¥22 billion phase 1)" }, { "date": "2024-12-31", "event": "Line activated (通线 ceremony)" }, { "date": "2026-04-01", "event": "Reported at ~15,000 wafers/month; 40,000/month targeted 2027" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 3, "capital_intensity": 4 }, "dates": { "announced": "2022-10-01", "approved": null, "construction_start": "2022-10-01", "original_expected_completion": "2027-12-31", "date_completion": "2024-12-31" }, "sources": [ { "url": "https://www.stcn.com/article/detail/1478384.html", "title": "深圳第二条12英寸项目通线投产（润鹏半导体，总投资220亿） (证券时报)", "date": "2025-01-03" }, { "url": "https://news.qq.com/rain/a/20260424A08NGB00", "title": "华润微2025年报解读：重庆满产、深圳1.5万片/月爬坡 (腾讯新闻)", "date": "2026-04-24" } ] }, { "id": "silan-xiamen", "name_en": "Silan Microelectronics Xiamen Cluster (Jike/Mingjia)", "name_zh": "厦门士兰集科微电子有限公司 / 厦门士兰明镓化合物半导体有限公司", "name_pinyin": "Shìmén Shìlán Jíkē / Míngjiā", "company_en": "Hangzhou Silan Microelectronics Co., Ltd. (600460.SH)", "company_zh": "杭州士兰微电子股份有限公司", "company_pinyin": "Hángzhōu Shìlán Wēidiànzǐ Gǔfèn Yǒuxiàn Gōngsī", "partners": ["Xiamen Semiconductor Investment Group (Haicang)", "Xiamen Xinyi Technology", "Big Fund"], "location": { "city": "Xiamen", "province": "Fujian", "lat": 24.49, "lon": 117.98 }, "type": "Fab", "category": "JV", "capability": "12-inch power/IGBT/MEMS line (士兰集科, 90nm, design 80,000 wafers/month across two phases) + 6-inch SiC/compound line (士兰明镓, 10,000 wafers/month)", "investment": { "total_rmb_100m": 150, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "The Xiamen campus of Silan — China's flagship private power-semi IDM — stacks a 12-inch silicon power fab (¥7 billion first line, in production since December 2020, 2025 output 637,400 wafers) alongside a 6-inch SiC line; two further lines are now in motion at the same campus: the ¥12 billion 8-inch SiC fab (士兰集宏) and ¥20 billion 12-inch high-end analog fab (士兰集华). Investment figure tracked here is the Jike 12-inch project total (¥7bn phase 1 + ¥5bn/¥2bn expansions ≈¥15bn of the ¥17bn two-line plan); the newer phases are covered in milestones.", "what_it_makes": "IGBT/MOSFET power chips for EV main drives, PV and industrial IPM modules; SiC devices; MEMS sensors.", "why_it_matters": "IPM modules exceeding 250 million units shipped in 2025 (+47%) show a Chinese IDM supplying white goods and cars from wafer up; the January 2026 dual event (集宏 8-inch SiC line-out ceremony + 集华 12-inch analog groundbreaking, reported as China's first fully self-IP 8-inch SiC power line) extends the same campus into the two most strategic specialty segments." }, "milestones": [ { "date": "2020-12-21", "event": "Jike 12-inch power line formally enters production (90nm, phase 1 40,000 wafers/month)" }, { "date": "2024-05-21", "event": "¥12 billion 8-inch SiC project (士兰集宏) signed with Xiamen city" }, { "date": "2025-10-18", "event": "¥20 billion 12-inch high-end analog project (士兰集华) signed (phase 1 ¥10 billion, 45,000 wafers/month planned)" }, { "date": "2026-01-04", "event": "集宏 8-inch SiC line-out ceremony (trial production since Nov 2025) + 集华 12-inch groundbreaking, same day" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 2, "capital_intensity": 4 }, "dates": { "announced": "2017-12-01", "approved": null, "construction_start": "2018-10-01", "original_expected_completion": null, "date_completion": "2020-12-21" }, "sources": [ { "url": "https://www.silan.com.cn/news/details/78.html", "title": "12吋芯片生产线今日正式投产 (士兰微官网)", "date": "2020-12-21" }, { "url": "https://www.silan.com.cn/index.php/news/details/286.html", "title": "双线里程碑：8英寸碳化硅通线暨12英寸高端模拟开工 (士兰微官网)", "date": "2026-01-05" }, { "url": "https://www.xm.gov.cn/xmyw/202510/t20251019_2960816.htm", "title": "总投资200亿士兰微新项目签约落地厦门 (厦门市政府)", "date": "2025-10-19" } ] }, { "id": "xmc-wuhan", "name_en": "XMC Wuhan (Wuhan Xinxin)", "name_zh": "武汉新芯集成电路股份有限公司", "name_pinyin": "Wǔhàn Xīnxīn Jíchéng Diànlù Gǔfèn Yǒuxiàn Gōngsī", "company_en": "Wuhan Xinxin Semiconductor Manufacturing Co. (XMC)", "company_zh": "武汉新芯集成电路股份有限公司", "company_pinyin": "Wǔhàn Xīnxīn Jíchéng Diànlù Gǔfèn Yǒuxiàn Gōngsī", "partners": ["长江存储科技控股 (CCSH/YMTC group, 68.19%)", "Wuhan Optics Valley state vehicles", "Big Fund"], "location": { "city": "Wuhan", "province": "Hubei", "lat": 30.45, "lon": 114.42 }, "type": "Memory", "category": "State-Backed", "capability": "12-inch specialty foundry — NOR flash (mainland's largest NOR fab), CIS/RF-SOI mixed-signal, and 3D integration (TSV, hybrid bonding, S-stacking/M-stacking wafer-level stacking)", "investment": { "total_rmb_100m": null, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": true, "date_added": "2024-12-02", "list": "US Commerce BIS" }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [ { "year": 2024, "node": "NOR flash at 55/65nm class in mass production; 45nm ramping" } ], "narrative": { "significance": "Founded 2006 (managed early on by SMIC) as mainland's second-constructed 12-inch fab, then the seed plant from which YMTC's 3D NAND business was spun out in 2016; the two remain siblings under CCSH Corporation (长控集团). XMC is the mainland's largest NOR flash fab (~41% of estimated domestic NOR fab demand in 2023) and the only scaled domestic supplier of wafer-level 3D integration services (TSV/hybrid bonding) — capacity across its two fabs was 531,100 wafers in 2023 and 2024 revenue was ¥4.258 billion (¥42.58亿) per industry coverage.", "what_it_makes": "NOR flash and MCU wafers, CIS and RF-SOI mixed-signal wafers, and 3D-integration (wafer-stacking/HBM-adjacent) foundry services; March 2024 reports describe an HBM development project (reported, not verified).", "why_it_matters": "Added to the US Entity List in the December 2, 2024 package alongside equipment makers — BIS named 'Wuhan Xinxin Semiconductor Manufacturing' explicitly. A STAR IPO (¥4.8 billion raise for Fab 3) was accepted September 2024 but formally withdrawn May 2026 the same day YMTC group began IPO tutoring, widely read as clearing the group listing path; its Fab 3 (reported ~¥28 billion project, 50,000 wafers/month) continues construction independent of the IPO, with first structural steel lifted April 2026." }, "milestones": [ { "date": "2018-08-01", "event": "Fab 2 expansion breaks ground (reported ¥13.57 billion)" }, { "date": "2024-09-30", "event": "STAR Market IPO accepted — ¥4.8 billion raise, ¥4.3 billion earmarked to Fab 3" }, { "date": "2024-12-02", "event": "Added to the US Commerce Department's Entity List (140-entity semiconductor round)" }, { "date": "2026-04-21", "event": "Fab 3 main structure first steel lift" }, { "date": "2026-05-19", "event": "IPO withdrawn/terminated by SSE at company request, the same day YMTC group filed IPO tutoring" } ], "complexity": { "technology_difficulty": 3, "foreign_dependence": 4, "capital_intensity": 4 }, "dates": { "announced": "2006-04-21", "approved": null, "construction_start": null, "original_expected_completion": null, "date_completion": null }, "sources": [ { "url": "https://www.stcn.com/ipo/detail/3282.html", "title": "武汉新芯科创板IPO审核终止 (证券时报)", "date": "2026-05-19" }, { "url": "https://www.semi.org.cn/site/semi/article/d481ae4b97de4a8c959f83e90a268d19.html", "title": "新芯三期项目首片钢结构吊装 (国家集成电路创新中心网站)", "date": "2026-04-21" }, { "url": "https://news.qq.com/rain/a/20241203A00IUI00", "title": "140家中国半导体企业被列入实体清单，附完整名单（Wuhan Xinxin listed） (芯智讯)", "date": "2024-12-03" }, { "url": "https://www.xmcwh.com/site/about-XMC", "title": "XMC公司简介（国内领先的特色工艺12英寸晶圆代工企业）", "date": "2026-10-01" } ] }, { "id": "swaysure-shenzhen", "name_en": "SwaySure (Shenzhen DRAM/Novel Memory Fab)", "name_zh": "深圳市昇维旭技术有限公司", "name_pinyin": "Shēnzhèn Shì Shēngwéixù Jìshù Yǒuxiàn Gōngsī", "company_en": "SwaySure Technology Co., Ltd.", "company_zh": "深圳市昇维旭技术有限公司", "company_pinyin": "Shēnzhèn Shì Shēngwéixù Jìshù Yǒuxiàn Gōngsī", "partners": "Shenzhen Industrial Investment Group (深重投, Shenzhen SASAC)", "location": { "city": "Shenzhen", "province": "Guangdong", "lat": 22.69, "lon": 114.05 }, "type": "Memory", "category": "State-Backed", "capability": "12-inch DRAM/novel memory fab, 28nm starting node, long-term plan reported at 140,000 wafers/month", "investment": { "total_rmb_100m": null, "source": "Local Govt" }, "status": "Under Construction", "entity_list": { "status": true, "date_added": "2024-12-02", "list": "US Commerce BIS" }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "Shenzhen-state-backed memory venture founded March 2022 (registered capital ¥5 billion), led by CEO Liu Xiaoqiang (ex-TSMC fab manager) and initially by CSO Sakamoto Yukio (ex-Elpida CEO); the widely quoted '¥300 billion ambition / 140,000 wafers/month' plan is aspirational and unverified. Its 'novel memory production line project' (新型存储器产线) heads Shenzhen's 2025 major-industrial-project list, and 2025-2026 municipal water-use notices for wet-etch/CMP indicate process equipment is operating at plant level.", "what_it_makes": "No verified product output yet; reported to target DRAM from 28nm-class nodes and new memory types.", "why_it_matters": "Added to the Entity List in the December 2, 2024 round; July 2026 reporting (via FT and reprints) describes it as one of the Huawei-linked 'Guanlan'-family Shenzhen sites and part of a government-SwaySure-Huawei triangle building 12-inch DRAM capacity — i.e., a key piece of China's most opaque memory push, with essentially no independently verified output." }, "milestones": [ { "date": "2022-03-01", "event": "Company founded, funded entirely by Shenzhen Industrial Investment Group" }, { "date": "2024-12-02", "event": "Added to the US Commerce Department's Entity List (SwaySure Technology Co., Ltd.)" }, { "date": "2025-09-01", "event": "Shenzhen lists its novel-memory line among top major industrial projects; process water permits confirm fab-level operations" }, { "date": "2026-07-12", "event": "Reports describe Huawei co-developing the 12-inch DRAM fab (140,000 wafers/month long-term plan, unverified)" } ], "complexity": { "technology_difficulty": 4, "foreign_dependence": 5, "capital_intensity": 5 }, "dates": { "announced": "2022-03-01", "approved": null, "construction_start": "2023-01-01", "original_expected_completion": null, "date_completion": null }, "sources": [ { "url": "https://www.swaysure.com/", "title": "昇维旭官网（深圳国资背景，存储芯片研发设计生产）", "date": "2026-10-10" }, { "url": "https://ee.ofweek.com/2024-12/ART-8440-2800-30652527.html", "title": "美国正式将140家中国半导体公司列入实体清单（含SwaySure/昇维旭全名单） (OFweek)", "date": "2024-12-03" }, { "url": "https://www.eet-china.com/mp/a141223.html", "title": "深圳又一座晶圆厂：昇维旭DRAM项目，原Elpida CEO坂本幸雄加盟 (电子工程专辑)", "date": "2022-06-23" } ] }, { "id": "yandong-beijing", "name_en": "Yandong Micro / Beidian Integration (Beijing Yizhuang)", "name_zh": "北京燕东微电子股份有限公司 / 北京电控集成电路制造有限公司", "name_pinyin": "Běijīng Yàndōng Wēidiànzǐ", "company_en": "Beijing Yandong Microelectronics (STAR: 688172)", "company_zh": "北京燕东微电子股份有限公司", "company_pinyin": "Běijīng Yàndōng Wēidiànzǐ Gǔfèn Yǒuxiàn Gōngsī", "partners": ["Beijing E-Town (亦庄国投)", "BOE", "Beijing municipal state funds"], "location": { "city": "Beijing", "province": "Beijing Municipality", "lat": 39.79, "lon": 116.52 }, "type": "Fab", "category": "State-Backed", "capability": "8-inch power/analog line (60,000+ wafers/month, IGBT/MOS/BCD/silicon-photonics) + 65nm 12-inch specialty line (¥7.5 billion, >20,000 wafers/month phase 1) + Beidian Integration 28nm 12-inch line under construction (¥33 billion, 50,000 wafers/month planned)", "investment": { "total_rmb_100m": 330, "source": "Local Govt" }, "status": "Under Construction", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "Beijing's flagship effort (under the '芯屏' strategy, pairing with BOE display demand) to backfill its weak manufacturing base: the Yandong listed company runs Beijing's first 8-inch volume line and a ¥7.5 billion 'domestic-toolset' 65nm 12-inch specialty line (first wafer April 2023, mass production end-2024); the bigger Beidian Integration (北电集成) 28nm 12-inch fab — ¥33 billion total, ¥20 billion capital — broke ground December 2024, topped out 2025, and took delivery of first equipment 10 December 2025, with company-targeted production start H2 2026.", "what_it_makes": "Power/analog/silicon-photonics wafers on 8-inch and 65nm 12-inch; planned 28nm DDIC/mixed-signal/MCU wafers on the Beidian line.", "why_it_matters": "One of the most domestic-equipment-heavy 300mm projects in China (NAURA is the headquartered-next-door tool supplier) — a live test of how far a Chinese fab can go on a partially domestic toolset at 28nm." }, "milestones": [ { "date": "2023-04-01", "event": "65nm 12-inch specialty line produces first wafer (SBD power device)" }, { "date": "2024-12-01", "event": "Beidian Integration ¥33 billion 28nm 12-inch line breaks ground in Yizhuang" }, { "date": "2025-12-10", "event": "First equipment move-in at the Beidian fab; company targets production in H2 2026" } ], "complexity": { "technology_difficulty": 3, "foreign_dependence": 2, "capital_intensity": 5 }, "dates": { "announced": "2021-10-01", "approved": null, "construction_start": "2024-12-01", "original_expected_completion": "2030-12-31", "date_completion": null }, "sources": [ { "url": "http://static.cninfo.com.cn/finalpage/2026-04-29/1225238474.PDF", "title": "北京燕东微电子股份有限公司2025年年度报告 (巨潮资讯)", "date": "2026-04-29" }, { "url": "https://www.ydme.com/news/158.html", "title": "北电集成28nm 12英寸生产线首批设备搬入 (燕东微官网)", "date": "2025-12-16" } ] }, { "id": "hunan-sanan-changsha", "name_en": "Hunan Sanan Semiconductor (Changsha SiC IDM)", "name_zh": "湖南三安半导体有限责任公司", "name_pinyin": "Húnán Sān'ān Bàndǎotǐ", "company_en": "Sanan Optoelectronics Co., Ltd. (600703.SH)", "company_zh": "三安光电股份有限公司", "company_pinyin": "Sān'ān Guāngdiàn Gǔfèn Yǒuxiàn Gōngsī", "partners": [], "location": { "city": "Changsha", "province": "Hunan", "lat": 28.22, "lon": 112.9 }, "type": "Compound Semiconductor", "category": "Private", "capability": "Full-chain SiC IDM (substrate→epi→device→module), 6-inch at 16,000 wafers/month + 8-inch SiC chip line (fully activated 2025-2026); GaN-on-Si 2,000 wafers/month", "investment": { "total_rmb_100m": 160, "source": "Private" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "China's first vertically integrated SiC production chain (first line lit June 2021) and the country's largest self-contained SiC IDM platform, at ¥16 billion planned; by the May 2026 shareholders meeting the 6-inch line was running 16,000 wafers/month at ~85% yield with high utilization, and the in-house 8-inch SiC chip line — line-out August 2025, built in under a year — was reported fully activated.", "what_it_makes": "6/8-inch SiC MOSFET/SBD devices and modules for EVs, PV and storage (customers include Sungrow and major OEMs), plus GaN-on-Si power wafers.", "why_it_matters": "Parent Sanan Optoelectronics posted its first annual loss for 2025 with SiC depreciation as a named drag while pushing for SiC profitability in 2026 — the clearest single-company view of China's painful SiC cost-down race. Governance flag: GM Lin Kechuang (also chairman of the ST JV 安意法) was reported detained May 2026 and released around October 2026." }, "milestones": [ { "date": "2021-06-23", "event": "First SiC line lit — billed as China's first vertically integrated SiC chain (plan 30,000 6-inch wafers/month)" }, { "date": "2022-11-01", "event": "¥3.8 billion multi-year supply agreement with an EV OEM (行家说 coverage)" }, { "date": "2025-08-27", "event": "Own 8-inch SiC chip line announced line-out (通线)" }, { "date": "2026-05-15", "event": "Annual meeting: 6-inch at 16,000 wafers/month, 8-inch line fully activated; SiC profitability targeted for 2026" } ], "complexity": { "technology_difficulty": 4, "foreign_dependence": 2, "capital_intensity": 4 }, "dates": { "announced": "2018-03-01", "approved": null, "construction_start": "2020-07-01", "original_expected_completion": null, "date_completion": "2021-06-23" }, "sources": [ { "url": "https://www.sanan-ic.com/news-18", "title": "湖南三安点亮中国首条碳化硅垂直整合生产线 (三安集成官网)", "date": "2021-06-23" }, { "url": "https://www.eet-china.com/mp/a433589.html", "title": "三安光电8英寸碳化硅芯片产线正式通线 (电子工程专辑)", "date": "2025-08-28" }, { "url": "https://stock.10jqka.com.cn/20260519/c676810688.shtml", "title": "三安光电股东大会：SiC产能、良率与盈利目标实录 (同花顺)", "date": "2026-05-19" } ] }, { "id": "anyiwa-chongqing", "name_en": "Anyi-Semic / ST-Sanan JV (Chongqing 8-inch SiC)", "name_zh": "安意法半导体有限公司", "name_pinyin": "Ānyìfǎ Bàndǎotǐ Yǒuxiàn Gōngsī", "company_en": "Anyiwa Semiconductor Co., Ltd. (STMicroelectronics–Sanan JV)", "company_zh": "安意法半导体有限公司", "company_pinyin": "Ānyìfǎ Bàndǎotǐ Yǒuxiàn Gōngsī", "partners": ["湖南三安半导体 (51%)", "STMicroelectronics China Investments (49%)"], "location": { "city": "Chongqing", "province": "Chongqing Municipality", "lat": 29.59, "lon": 106.33 }, "type": "Compound Semiconductor", "category": "JV", "capability": "8-inch automotive-grade SiC epitaxy + device (chip) fab, 480,000 wafers/year planned full capacity; output sold to ST; companion 8-inch substrate plant 重庆三安 (¥7 billion)", "investment": { "total_rmb_100m": 230, "source": "Foreign" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "STMicroelectronics' China-for-China twin of its Catania 200mm SiC strategy: an 8-inch automotive SiC device fab built in ~20 months (per ST's CEO), line activated 27 February 2025, and reported by March 2026 as China's first 8-inch automotive-grade SiC line to reach volume production (2,000 wafers/week). JV entity formed August 2023; total project investment ~¥23 billion (~$3.2B) plus ¥7 billion for the co-located Chongqing Sanan substrate plant (activated September 2024).", "what_it_makes": "8-inch car-grade SiC MOSFET epi and die, ST-branded, feeding Chinese EV makers' main-drive inverters.", "why_it_matters": "The clearest case of a Western IDM localizing advanced power-device manufacturing inside China for the Chinese market — a structural answer to 'de-risking' pressure — and Chongqing's anchor in its EV-supply-chain buildout around Changan." }, "milestones": [ { "date": "2023-08-01", "event": "JV company established in Chongqing Xiyong micro-electronics park" }, { "date": "2024-09-01", "event": "Companion Chongqing Sanan 8-inch substrate plant activated" }, { "date": "2025-02-27", "event": "8-inch SiC device line activated (通线 ceremony, Xinhua)" }, { "date": "2026-03-01", "event": "Volume production of the 2,000 wafers/week car-grade line reported (China first)" } ], "complexity": { "technology_difficulty": 4, "foreign_dependence": 3, "capital_intensity": 4 }, "dates": { "announced": "2023-06-01", "approved": "2023-08-01", "construction_start": "2023-08-01", "original_expected_completion": null, "date_completion": "2025-02-27" }, "sources": [ { "url": "https://www.yicai.com/news/102490839.html", "title": "安意法半导体重庆8英寸碳化硅项目正式通线 (第一财经)", "date": "2025-02-27" }, { "url": "https://stock.10jqka.com.cn/20260519/c676810688.shtml", "title": "三安光电：安意法现有产能2000片/周，部分产品完成验证进入风险量产 (同花顺转上海证券报)", "date": "2026-05-19" }, { "url": "https://www.eet-china.com/mp/a432943.html", "title": "重庆三安-意法半导体8英寸SiC进展盘点 (电子工程专辑)", "date": "2025-08-27" } ] }, { "id": "changfei-sic-wuhan", "name_en": "YOFC Advanced Semiconductor (Wuhan SiC IDM)", "name_zh": "长飞先进半导体（武汉）有限公司", "name_pinyin": "Chángfēi Xiānjìn Bàndǎotǐ (Wǔhàn)", "company_en": "YOFC Advanced Semiconductor", "company_zh": "安徽长飞先进半导体股份有限公司（武汉基地）", "company_pinyin": "Ānhuī Chángfēi Xiānjìn Bàndǎotǐ Gǔfèn Yǒuxiàn Gōngsī", "partners": ["长飞光纤 (equity-method JV holder, 22.9%)", "Optics Valley financial holding", "Chery's Xinche Zhilian fund"], "location": { "city": "Wuhan", "province": "Hubei", "lat": 30.47, "lon": 114.5 }, "type": "Compound Semiconductor", "category": "Private", "capability": "6-inch SiC IDM — full-line smart fab: 360,000 wafers/year + 360,000 epi + 61 million modules/year at phase-1 full ramp (with legacy Wuhu base: combined 420,000 wafers/year)", "investment": { "total_rmb_100m": 200, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "The big new 2025 entrant in Chinese SiC: a ¥20 billion Wuhan Optics Valley IDM base (contracted August 2023) that broke ground within two months and produced its first 6-inch automotive-grade SiC wafer on 28 May 2025 — 21 months, billed as China's largest SiC device fab, ~30% of domestic wafer capacity at full rate. First-product yield was reported at 97%; ramp to 3,500 wafers/month was the stated end-2025 target.", "what_it_makes": "SiC MOSFET wafers (fully automated plant, ~80 line operators on four-shift rotation) and power modules for EV main drives — plus the Wuhu base's 60,000 wafers/year.", "why_it_matters": "A telecom-fiber company's pivot (长飞光纤) into power semis via acquisition and greenfield scale — and after a >¥1 billion A+ round (February 2026, Jiangcheng Fund/Changjiang Industrial lead), management expects its SiC chips in customer vehicles from H2 2026 — the newest test of whether a late entrant can beat the SiC glut narrative." }, "milestones": [ { "date": "2023-08-01", "event": "Wuhan base project signed (total >¥20 billion, 498 mu)" }, { "date": "2025-05-28", "event": "First 6-inch SiC wafer off the line — fab in mass-production line-out (量产通线)" }, { "date": "2026-02-06", "event": ">¥1 billion A+ financing round completed; combined Wuhu+Wuhan capacity stated at 420,000 wafers/year" } ], "complexity": { "technology_difficulty": 4, "foreign_dependence": 2, "capital_intensity": 4 }, "dates": { "announced": "2023-08-01", "approved": null, "construction_start": "2023-09-01", "original_expected_completion": null, "date_completion": "2025-05-28" }, "sources": [ { "url": "https://finance.sina.com.cn/jjxw/2025-05-29/doc-ineyfuvw9501289.shtml", "title": "总投资200亿元！长飞先进碳化硅晶圆量产通线 (财联社/新浪财经)", "date": "2025-05-29" }, { "url": "https://www.hjssemi.com/topic/1770705669124", "title": "长飞先进：获得超10亿融资，SiC产能达42万片/年 (行家说三代半)", "date": "2026-04-23" } ] }, { "id": "sitri-shanghai", "name_en": "SITRI — Shanghai Industrial Technology Research Institute", "name_zh": "上海微技术工业研究院", "name_pinyin": "Shànghǎi Wēijìshù Gōngyè Yánjiūyuàn", "company_en": "Shanghai Industrial Technology Research Institute (SITRI)", "company_zh": "上海微技术工业研究院", "company_pinyin": "Shànghǎi Wēijìshù Gōngyè Yánjiūyuàn", "partners": ["Shanghai Municipal Commission of Science & Technology", "Jiading District Government", "Xinwei Group (CAS Shanghai Institutes affiliate)"], "location": { "city": "Shanghai", "province": "Shanghai Municipality", "lat": 31.33, "lon": 121.24 }, "type": "Research Fab", "category": "State-Backed", "capability": "China's first 8-inch 'More than Moore' R&D pilot line (online September 2017): MEMS/intelligent sensors, silicon photonics, biochips; ~5,000 sqm cleanroom, 14 standardized process modules, CMOS-compatible", "investment": { "total_rmb_100m": null, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "China's structural answer to imec — a full-flow 200mm pilot fab (not a lab cleanroom) de-risking the R&D→pilot→industrialization gap for MEMS, silicon photonics and biosensor chips; founded 2013 with the CAS Shanghai microsystems lineage, it has served 1,000+ customers and incubated 20+ companies with aggregate valuation above ¥15 billion, and was named a national 'little giant' 专精特新 platform in 2025.", "what_it_makes": "Engineering/pilot wafers: MEMS sensors, silicon-photonic chips (built under Shanghai's municipal SiPh major special project), biosensor chips; PDK-based tape-out services rather than commercial volume.", "why_it_matters": "Pilot lines like SITRI's are the missing middle layer that export controls cannot block as easily as frontier tools — the country's specialty-silicon innovation capacity increasingly runs through such platforms; it anchors Jiading's 'More than Moore' sensor cluster." }, "milestones": [ { "date": "2013-11-01", "event": "Founded by Shanghai Municipal Commission of STI, Jiading district and Xinwei Group" }, { "date": "2017-09-01", "event": "8-inch R&D pilot line online — China's first 'More than Moore' pilot fab" }, { "date": "2018-07-01", "event": "Silicon photonics pilot line (municipal major special project) completes, tape-out capability demonstrated" } ], "complexity": { "technology_difficulty": 3, "foreign_dependence": 3, "capital_intensity": 2 }, "dates": { "announced": "2013-11-01", "approved": null, "construction_start": null, "original_expected_completion": null, "date_completion": "2017-09-01" }, "sources": [ { "url": "https://www.sitri.com/gsjj", "title": "SITRI公司简介（国内首条8英寸'超越摩尔'研发中试线）", "date": "2026-10-01" }, { "url": "https://www.sh-italent.com/Article/201807/201807090022.shtml", "title": "硅光子市级重大专项获突破 首条研发中试线年内建成 (解放日报转载)", "date": "2018-07-09" } ] }, { "id": "xopt-xian", "name_en": "Xi'an Optoelectronics Pilot Institute (XOPT)", "name_zh": "陕西光电子先导院科技有限公司", "name_pinyin": "Shǎnxī Guāngdiànzǐ Xiāndǎoyuàn Kējì Yǒuxiàn Gōngsī", "company_en": "Shaanxi Pilot Institute of Optoelectronics", "company_zh": "陕西光电子先导院科技有限公司", "company_pinyin": "Shǎnxī Guāngdiànzǐ Xiāndǎoyuàn Kējì Yǒuxiàn Gōngsī", "partners": ["CAS Xi'an Institute of Optics and Precision Mechanics", "Shaanxi Provincial Department of Science & Technology", "Xi'an High-tech Zone"], "location": { "city": "Xi'an", "province": "Shaanxi", "lat": 34.22, "lon": 108.9 }, "type": "Research Fab", "category": "State-Backed", "capability": "Dual pilot lines: 8-inch silicon photonics (130nm IMEC SiPh kit, DUV litho, ~¥750 million platform) + 6-inch compound semiconductor (GaAs VCSEL); ~8,000 sqm cleanroom, ~200 tools", "investment": { "total_rmb_100m": 15, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "Northwest China's first silicon-photonics pilot line, activated 4 November 2025 (cumulative platform investment ~¥1.5 billion) and selected into MIIT's first national manufacturing-pilot-platform list; on 23 August 2026 it opened commercial tape-out and released production-grade process data (LPSIN400 SiN PDK) — the first public domestic SiPh PDK of its kind.", "what_it_makes": "Silicon-photonic chips (AI interconnect, LiDAR, optical computing) and GaAs VCSEL optoelectronics on pilot/MPW services; 6-inch compound line online since 2023 with 20+ PDKs and 80+ customers.", "why_it_matters": "Core of Shaanxi's 'Chasing Light' photonics program (409 firms, ¥41 billion output in 2025) — and an operator claim worth tracking: SiPh tape-out cycles '5x faster than overseas', because the alternative for Chinese designers was queuing at foreign pilot fabs." }, "milestones": [ { "date": "2015-01-01", "event": "Founded by CAS Xi'an Institute of Optics + provincial/high-tech-zone government" }, { "date": "2023-03-01", "event": "6-inch compound-semiconductor platform opens" }, { "date": "2025-11-04", "event": "8-inch silicon-photonics pilot line activated — first in northwest China" }, { "date": "2026-08-23", "event": "First public release of production-grade SiPh PDK; full commercial tape-out opens" } ], "complexity": { "technology_difficulty": 3, "foreign_dependence": 3, "capital_intensity": 2 }, "dates": { "announced": "2015-01-01", "approved": null, "construction_start": "2023-01-01", "original_expected_completion": null, "date_completion": "2025-11-04" }, "sources": [ { "url": "https://www.shaanxi.gov.cn/xw/sxyw/202511/t20251106_3582283.html", "title": "西北地区首条硅光中试线通线 (陕西省人民政府)", "date": "2025-11-06" }, { "url": "https://news.sciencenet.cn/htmlnews/2025/11/554576.shtm", "title": "破局'芯'困境！西北首条硅光中试线正式通线 (中国科学报)", "date": "2025-11-05" }, { "url": "https://xakj.xa.gov.cn/kjdt/mtbd/2092448302231523330.html", "title": "西北首条8英寸硅光中试平台核心工艺数据首次公开 (西安市科技局)", "date": "2026-08-26" } ] }, { "id": "noeic-wuhan", "name_en": "NOEIC — National Optoelectronics Information Innovation Center", "name_zh": "武汉光谷信息光电子创新中心有限公司（国家信息光电子创新中心）", "name_pinyin": "Guójiā Xìnxī Guāngdiànzǐ Chuàngxīn Zhōngxīn", "company_en": "National Optoelectronics Information Innovation Center (Wuhan)", "company_zh": "国家信息光电子创新中心", "company_pinyin": "Guójiā Xìnxī Guāngdiànzǐ Chuàngxīn Zhōngxīn", "partners": ["Accelink (光迅科技) lead", "CICT (中国信科, central SOE)", "Wuhan Optics Valley"], "location": { "city": "Wuhan", "province": "Hubei", "lat": 30.47, "lon": 114.4 }, "type": "Research Fab", "category": "State-Backed", "capability": "III-V (InP/GaAs) optoelectronic process platform + silicon photonics; Nov 2025: China's first fully-domesticated 12-inch 40nm CMOS-based SiPh PDK/TDK/ADK tape-out platform (MPW shuttles)", "investment": { "total_rmb_100m": null, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "A national manufacturing-innovation center approved by MIIT (October 2017), led by Accelink under CICT; its 12-inch silicon-photonics tape-out platform commissioned in Optics Valley in November 2025 — running on a fully domestic toolset (announced September 2025) with a commercial-grade 40nm PDK — makes it the only national-level platform for domesticized optoelectronic chip wafer R&D.", "what_it_makes": "Optical-communication and opto-AI chips on 200/300mm wafers: demo silicon-photonic interconnect chips (1.6T, 2T chiplet), 170GHz thin-film-lithium-niobate modulator (March 2026), MPW shuttle services for 300+ organizations.", "why_it_matters": "Silicon photonics is China's most credible 'bypass' strategy for AI-interconnect bottlenecks; Hubei's stated 2030 target is a global-top-3 12-inch SiPh specialty line. This platform de-risks that flow from overseas fabs." }, "milestones": [ { "date": "2017-10-31", "event": "MIIT approves the national manufacturing innovation center (挂牌 April 2018)" }, { "date": "2025-09-29", "event": "First fully-domesticized silicon-photonics 'toolkit' (PDK/TDK/ADK) released" }, { "date": "2025-11-11", "event": "12-inch SiPh tape-out platform commissioned in Optics Valley" }, { "date": "2026-05-26", "event": "Selected into MIIT's second-batch national key pilot-platform list" } ], "complexity": { "technology_difficulty": 4, "foreign_dependence": 3, "capital_intensity": 3 }, "dates": { "announced": "2017-10-31", "approved": "2017-10-31", "construction_start": null, "original_expected_completion": null, "date_completion": "2025-11-11" }, "sources": [ { "url": "https://zrzyhgh.wuhan.gov.cn/dhxjskfqfj/dhxjskfqfj_xwdt/dhxjskfqfj_gzdt/202601/t20260109_2708914.shtml", "title": "光谷12寸硅光芯片流片平台投用 (中国光谷)", "date": "2025-11-11" }, { "url": "http://jxt.hubei.gov.cn/bmdt/rdjj/202509/t20250929_5782308.shtml", "title": "首套全国产化硅光芯片'工具箱'发布 (湖北省经信厅)", "date": "2025-09-29" } ] }, { "id": "smic-spcl-shanghai", "name_en": "SMIC South (SPCL) Shanghai — Zhangjiang SN1/SN2", "name_zh": "中芯南方集成电路制造有限公司", "name_pinyin": "Zhōngxīn Nánfāng Jíchéng Diànlù Zhìzào Yǒuxiàn Gōngsī", "company_en": "SMIC", "company_zh": "中芯南方集成电路制造有限公司", "company_pinyin": "Zhōngxīn Nánfāng Jíchéng Diànlù Zhìzào Yǒuxiàn Gōngsī", "partners": ["Big Fund I/II/III", "Shanghai Integrated Circuit Industry Fund"], "location": { "city": "Shanghai", "province": "Shanghai Municipality", "lat": 31.21, "lon": 121.61 }, "type": "Fab", "category": "JV", "capability": "12-inch (300mm) FinFET — SN1 line at 14nm and N+1/N+2/N+3 (7nm-class, unconfirmed officially); SN2 equipment-verification and advanced R&D line; Fab8-P1a legacy 300mm converted to photomask production", "investment": { "total_usd_million": null, "source": "Big Fund I" }, "status": "Operational", "entity_list": { "status": true, "date_added": "2020-12-18", "list": "US Commerce BIS" }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [ { "year": 2020, "node": "14nm FinFET (SN1)" }, { "year": 2023, "node": "N+2 — Kirin 9000S class (TechInsights teardown)" }, { "year": 2025, "node": "N+3 — Kirin 9030 class (TechInsights, Dec 2025)" } ], "narrative": { "significance": "The facility this tracker's own About page flagged as its highest-priority missing entry: SMIC's primary advanced-node fab in Zhangjiang — the JV (established 1 December 2016, SMIC holding 41.56% after the December 2025 capital increase took registered capital from $6.5B to $10.077B) that operates SN1, the only confirmed 7nm-class (N+2/N+3) production line in China and the fab behind the Kirin 9000S/9030 story. Unlike the 28nm-era JVs in this tracker, its exposure is not mature-node competition with the West but the export-control frontier itself: EUV is banned, and it produces leading-edge-adjacent logic on DUV multi-patterning.", "what_it_makes": "12-inch FinFET wafers at 14nm and below for Huawei (Kirin SoCs) and, per unverified self-media claims only, other domestic advanced customers; SN2 doubles as an equipment/tool-verification line for domestic toolmakers.", "why_it_matters": "Capacity figures here are the most contested numbers in the tracker: official filings give registered capital but not output, and media claims of ~35k wafers/month N+2 rising to ~70k in 2026 (and Huawei taking a fixed share) come from self-media sources and are explicitly NOT verified by this tracker. What is confirmed by primary/research sources: the December 2025 capital increase with Big Fund III taking an 8.361% stake, and TechInsights' confirmation of N+3 production in the Kirin 9030 (December 2025)." }, "milestones": [ { "date": "2016-12-01", "event": "SMIC South (中芯南方) established as SMIC–Big Fund–Shanghai fund JV in Zhangjiang" }, { "date": "2019-09-01", "event": "First FinFET lithography tool installed; SN1 targeted at 35,000 wafers/month" }, { "date": "2025-12-29", "event": "Capital increase completed: registered capital $6.5B → $10.077B; Big Fund III appears as 8.361% shareholder; SMIC retains control at 41.56%" } ], "complexity": { "technology_difficulty": 5, "foreign_dependence": 5, "capital_intensity": 5 }, "dates": { "announced": "2016-12-01", "approved": null, "construction_start": "2017-01-01", "original_expected_completion": null, "date_completion": "2020-04-01" }, "sources": [ { "url": "https://www.eefocus.com/article/1833533.html", "title": "中芯南方 Fab8 P1/P2/P3 = SN1/SN2 产线梳理 (是说芯语/EEFocus)", "date": "2025-04-27" }, { "url": "https://www.chnfund.com/article/AR550085e5-8164-cf1a-401f-3a1e90be8dde", "title": "大基金三期新进中芯南方股东，注册资本增至100.77亿美元 (中国基金报)", "date": "2026-01-02" }, { "url": "https://www.seccw.com/document/detail/id/39438.html", "title": "TechInsights：麒麟9030采用中芯N+3工艺", "date": "2025-12-20" } ] }, { "id": "smic-nor-beijing", "name_en": "SMIC Beijing NORIC (B1/B2A, Yizhuang)", "name_zh": "中芯国际集成电路制造（北京）有限公司 / 中芯北方集成电路制造（北京）有限公司", "name_pinyin": "Zhōngxīn Běijīng / Zhōngxīn Běifāng", "company_en": "SMIC", "company_zh": "中芯北方集成电路制造（北京）有限公司", "company_pinyin": "Zhōngxīn Běifāng Jíchéng Diànlù Zhìzào (Běijīng) Yǒuxiàn Gōngsī", "partners": ["Big Fund I", "Beijing Integrated Circuit Industry Center", "E-Town Guotou"], "location": { "city": "Beijing", "province": "Beijing Municipality", "lat": 39.79, "lon": 116.51 }, "type": "Fab", "category": "JV", "capability": "12-inch (300mm) mature-node foundry — two 35,000 wafers/month lines (L1: 40/28nm; L2: 28nm HKMG), 65–28nm logic/RF/eNVM/CIS; reached 75,000 wafers/month full design capacity in 2022", "investment": { "total_usd_million": 3590, "source": "Big Fund I" }, "status": "Operational", "entity_list": { "status": true, "date_added": "2020-12-18", "list": "US Commerce BIS" }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [ { "year": 2005, "node": "90nm (B1/中芯北京 300mm; 0.15–0.09µm range, commercial prod. Mar 2005)" }, { "year": 2009, "node": "65nm (B1/中芯北京 300mm)" }, { "year": 2012, "node": "55nm (B1/中芯北京 300mm, most advanced in volume production)" }, { "year": 2015, "node": "28nm (NORIC/中芯北方 B2 300mm; mass production Q4 2015)" } ], "capacity": { "basis": "installed", "wafers_per_month": 75000, "wafer_size": "300mm", "as_of": "2026-05", "note": "NORIC (中芯北方) only, installed; design target reached 2022. Excludes B1 (中芯北京): 42,000/mo end-2018 (94,500 8-inch-eq ÷ 2.25, FY2018 20-F)" }, "narrative": { "significance": "SMIC's original Beijing campus — 中芯北京 (registered July 2002, its first 12-inch site) and 中芯北方 (NORIC, established July 2013 with a $3.59 billion initial investment) — the mature-node workhorse the tracker had missed while covering the newer 中芯京城 JV: NORIC ran at 100.76% utilization in Jan–Aug 2025 and earned ¥11.58 billion net in 2024, SMIC's 'cash cow'.", "what_it_makes": "28nm-and-above logic, RF, embedded memory and CIS wafers on two 300mm lines.", "why_it_matters": "September 2025: SMIC announced it would buy out NORIC's remaining 49% (¥40.601 billion, share-and-cash at ¥74.20/share, valuing NORIC well above the ¥37.4 billion transaction basis); approved by the SSE M&A committee 11 May 2026 — the largest STAR-market M&A — and completed via HKEX disclosure 24 June 2026. Consolidating the mature-node cash cow inside the listed company shows how central 28nm economics have become to China's foundry champion." }, "milestones": [ { "date": "2013-07-12", "event": "中芯北方 (NORIC) established; initial total investment $3.59 billion" }, { "date": "2016-06-01", "event": "First NORIC line (L1, 40/28nm) reaches production" }, { "date": "2022-01-01", "event": "Both lines combined reach 75,000 wafers/month design capacity" }, { "date": "2026-06-24", "event": "SMIC's ¥40.6 billion buyout of the remaining 49% completed — NORIC now wholly owned" } ], "complexity": { "technology_difficulty": 3, "foreign_dependence": 4, "capital_intensity": 5 }, "dates": { "announced": "2013-07-12", "approved": null, "construction_start": "2013-12-01", "original_expected_completion": null, "date_completion": "2016-06-01" }, "sources": [ { "url": "https://www.nbd.com.cn/articles/2025-09-08/4053282.html", "title": "406亿吞下中芯北方：SMIC北京三厂版图（北京/北方/京城） (每日经济新闻)", "date": "2025-09-08" }, { "url": "https://news.qq.com/rain/a/20260511A07YLO00", "title": "科创板最大并购过会：中芯国际406亿元收购中芯北方49%股权 (21世纪经济报道)", "date": "2026-05-11" }, { "url": "https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0624/2026062401102_c.pdf", "title": "中芯国际：完成收购中芯北方少数股权 通函 (HKEXnews)", "date": "2026-06-24" }, { "url": "https://www.sec.gov/Archives/edgar/data/1267482/000119312506138713/d20f.htm", "title": "SMIC Form 20-F for fiscal year 2005", "date": "2006-06-29" }, { "url": "https://www.sec.gov/Archives/edgar/data/1267482/000135994810000026/smic_20f.htm", "title": "SMIC Form 20-F for fiscal year 2009", "date": "2010-06-29" }, { "url": "https://www.sec.gov/Archives/edgar/data/1267482/000110465913029353/a13-10017_120f.htm", "title": "SMIC Form 20-F for fiscal year 2012", "date": "2013-04-15" }, { "url": "https://www.sec.gov/Archives/edgar/data/1267482/000155837019003539/smi-20181231x20f.htm", "title": "SMIC Form 20-F for fiscal year 2018 (fab table and per-fab capacity 2016–2018)", "date": "2019-04-30" }, { "url": "https://www.stcn.com/article/detail/3906248.html", "title": "406亿整合敲定：中芯国际收编“现金奶牛” 核心资产全盘纳入 (证券时报/21世纪经济报道)", "date": "2026-05-13" } ] }, { "id": "smic-zhangjiang-s1", "name_en": "SMIC Shanghai (Zhangjiang S1, 200mm)", "name_zh": "中芯国际集成电路制造（上海）有限公司", "name_pinyin": "Zhōngxīn Shànghǎi (Zhāngjiāng)", "company_en": "SMIC", "company_zh": "中芯国际集成电路制造（上海）有限公司", "company_pinyin": "Zhōngxīn Guójì Jíchéng Diànlù Zhìzào (Shànghǎi) Yǒuxiàn Gōngsī", "partners": [], "location": { "city": "Shanghai", "province": "Shanghai Municipality", "lat": 31.2, "lon": 121.6 }, "type": "Fab", "category": "State-Backed", "capability": "8-inch (200mm) wafer fab — 0.35µm–90nm (BCD, eNVM, power); S1 campus ~115,000 wafers/month 8-inch-equivalent planning basis (2019 prospectus)", "investment": { "total_usd_million": null, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": true, "date_added": "2020-12-18", "list": "US Commerce BIS" }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "SMIC's founding fab (entity registered 21 December 2000, 张江路18号) — the 8-inch campus the tracker's SMIC coverage omitted while following the new mega-JVs. It remains the backbone of SMIC's 200mm base (~355,000 wafers/month group 8-inch across Shanghai/Tianjin/Shenzhen, running at ~96% utilization in 2025 Q3, with BCD prices raised ~10% from December 2025 as global 8-inch supply tightened).", "what_it_makes": "Mature-node 200mm logic, analog/power (BCD), and embedded-nonvolatile wafers.", "why_it_matters": "The 8-inch legacy fabs are where the 2025-26 mature-node price cycle actually bites — SMIC's >95% utilization on these lines, not the headline 28nm JVs, is the volume story of China's foundry expansion." }, "milestones": [ { "date": "2000-12-21", "event": "SMIC Shanghai entity registered; Zhangjiang 8-inch fab production 2001" }, { "date": "2025-12-01", "event": "Group 8-inch lines at ~96% utilization; BCD platform pricing raised ~10%" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 3, "capital_intensity": 2 }, "dates": { "announced": "2000-12-21", "approved": null, "construction_start": null, "original_expected_completion": null, "date_completion": "2001-09-01" }, "sources": [ { "url": "https://top.qcc.com/tc/54890d4e86f7.html", "title": "中芯国际四大制造主体注册信息（上海/北京/天津/深圳） (企查查)", "date": "2026-10-01" }, { "url": "https://pdf.dfcfw.com/pdf/H3_AP202509031738421581_1.pdf", "title": "中芯国际8英寸产能与利用率（2025Q3 约96%，BCD提价） (东吴证券)", "date": "2025-09-03" } ] }, { "id": "smic-tianjin-legacy", "name_en": "SMIC Tianjin (former Motorola 8-inch)", "name_zh": "中芯国际集成电路制造（天津）有限公司", "name_pinyin": "Zhōngxīn Tiānjīn", "company_en": "SMIC", "company_zh": "中芯国际集成电路制造（天津）有限公司", "company_pinyin": "Zhōngxīn Guójì Jíchéng Diànlù Zhìzào (Tiānjīn) Yǒuxiàn Gōngsī", "partners": [], "location": { "city": "Tianjin", "province": "Tianjin Municipality", "lat": 39.14, "lon": 117.01 }, "type": "Fab", "category": "State-Backed", "capability": "8-inch (200mm) wafer fab — 0.35µm–90nm; installed ~45,000 wafers/month after Phase-2 expansion, ~60,000 reported at full ramp", "investment": { "total_usd_million": null, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": true, "date_added": "2020-12-18", "list": "US Commerce BIS" }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "SMIC acquired Motorola's Tianjin fab in 2003 (entity registered 3 November 2003) — one of the earliest foreign fab assets absorbed into China's domestic foundry base, and the mature-node counterpart to the new 中芯西青 12-inch JV in the same municipality.", "what_it_makes": "200mm mature logic/power wafers, 0.35µm–90nm, incl. the 2018 Phase-2 capacity expansion.", "why_it_matters": "Together with Zhangjiang S1 and Shenzhen's 8-inch line (Dec 2014), this is the SMIC legacy-8-inch layer the tracker had entirely missed — a reminder that China's wafer capacity sits at least as much in 20-year-old fabs as in the headline mega-JVs." }, "milestones": [ { "date": "2003-11-03", "event": "Entity established on the acquired former Motorola Tianjin fab" }, { "date": "2018-07-01", "event": "Phase-2 expansion first new process equipment moves in (~45k→~60k wafers/month)" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 3, "capital_intensity": 2 }, "dates": { "announced": "2003-11-03", "approved": null, "construction_start": null, "original_expected_completion": null, "date_completion": "2004-01-01" }, "sources": [ { "url": "https://pdf.dfcfw.com/pdf/H3_AP202509031738421581_1.pdf", "title": "中芯天津：2003年收购摩托罗拉天津厂沿革 (东吴证券研报)", "date": "2025-09-03" }, { "url": "https://top.qcc.com/tc/54890d4e86f7.html", "title": "中芯国际集成电路制造（天津）有限公司工商信息 (企查查)", "date": "2026-10-01" } ] }, { "id": "huahong-wuxi-fab7", "name_en": "Hua Hong Wuxi (Fab 7, 12-inch specialty)", "name_zh": "华虹半导体（无锡）有限公司", "name_pinyin": "Huáhóng Bàndǎotǐ (Wúxī)", "company_en": "Hua Hong Semiconductor", "company_zh": "华虹半导体（无锡）有限公司", "company_pinyin": "Huáhóng Bàndǎotǐ (Wúxī) Yǒuxiàn Gōngsī", "partners": ["Wuxi Xihong Lianxin (local state)", "Big Fund"], "location": { "city": "Wuxi", "province": "Jiangsu", "lat": 31.57, "lon": 120.3 }, "type": "Fab", "category": "JV", "capability": "12-inch specialty power — 90nm/65/55nm IGBT, MOSFET, BCD, eNVM; world's first 12-inch power-device pure-foundry line; design 40,000 wafers/month, installed ~95,000/month, monthly input >100,000-equivalent reported 2025", "investment": { "total_rmb_100m": null, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [ { "year": 2019, "node": "90nm–65/55nm specialty (production start Q4 2019)" } ], "capacity": { "basis": "installed", "wafers_per_month": 94500, "wafer_size": "300mm", "as_of": "2024-06", "note": "installed capacity, company-stated; later releases stop giving a per-fab figure" }, "narrative": { "significance": "Hua Hong's FIRST Wuxi 12-inch fab — the line that broke ground 2 March 2018 and took its first wafers 17 September 2019 — which this tracker had missed entirely while covering the newer Fab 9 (Phase II) and Phase 3. This is also a naming correction: Wikipedia and secondary sources label the Wuxi site 'Fab 7'; the $6.7B Phase-II fab is Fab 9. Design capacity grew from the original 40,000/month (phase 1, $2.5B of a ~10-year $10B site plan) to ~95,000/month installed, running above 100% utilization through 2025.", "what_it_makes": "12-inch power semiconductors for EVs, PV, and industrial applications — IGBTs, MOSFETs, BCD analog — plus eNVM and RF platforms.", "why_it_matters": "Fab 7 is where China's 12-inch power-semiconductor migration started; its >100% utilization and the group-wide 2026 8-inch price hikes (>10%) define the supply picture for domestic EV power electronics. The Wuxi campus's three-way split (Fab7 / Fab9 / Phase3) is why this tracker keeps per-phase entries." }, "milestones": [ { "date": "2018-03-02", "event": "Wuxi 12-inch specialty fab (Fab 7 / 一期) breaks ground — $2.5B phase 1 of ~$10B site plan" }, { "date": "2019-09-17", "event": "First wafers out (55nm power products); world's first 12-inch pure power-device foundry line" }, { "date": "2021-05-01", "event": "Phase 1 reaches its 40,000 wafers/month design capacity ahead of schedule" }, { "date": "2025-12-01", "event": "Installed capacity ~95,000 wafers/month; group utilization >100% (106.1% FY2025)" } ], "complexity": { "technology_difficulty": 3, "foreign_dependence": 3, "capital_intensity": 4 }, "dates": { "announced": "2017-09-01", "approved": null, "construction_start": "2018-03-02", "original_expected_completion": null, "date_completion": "2019-09-17" }, "sources": [ { "url": "https://www.huahong.com.cn/?id=9&m=channel", "title": "华虹半导体（无锡）有限公司 — 华虹七厂（官方）", "date": "2026-10-01" }, { "url": "https://greenmicro.net/article/hyzx/2014.html", "title": "华虹无锡项目大事记：2018开工、2019投片、2021达产 (格林微)", "date": "2026-06-01" }, { "url": "https://business.cctv.com/2026/05/22/ARTIg1aTwIezWj9GZzPPsZCs260522.shtml", "title": "华虹无锡：二期2024年12月投产、三期启动招标 (央视)", "date": "2026-05-22" }, { "url": "https://www1.hkexnews.hk/listedco/listconews/sehk/2024/0808/2024080800257.pdf", "title": "Hua Hong Semiconductor Limited Reports 2024 Second Quarter Results", "date": "2024-08-08" }, { "url": "https://www.acnnewswire.com/press-release/english/67033/hua-hong-semiconductor-achieved-mass-production-of-12''-90nm-bcd", "title": "Hua Hong Semiconductor Achieved Mass Production of 12'' 90nm BCD", "date": "2021-06-03" }, { "url": "https://static.cninfo.com.cn/finalpage/2023-07-31/1217423536.PDF", "title": "华虹公司首次公开发行股票并在科创板上市招股说明书", "date": "2023-07-31" } ] }, { "id": "huahong-shanghai-fab123", "name_en": "Hua Hong Shanghai (Fab 1/2/3, 200mm)", "name_zh": "上海华虹宏力半导体制造有限公司", "name_pinyin": "Shànghǎi Huáhóng Hónglì Bàndǎotǐ Zhìzào Yǒuxiàn Gōngsī", "company_en": "Hua Hong Semiconductor", "company_zh": "上海华虹宏力半导体制造有限公司", "company_pinyin": "Shànghǎi Huáhóng Hónglì Bàndǎotǐ Zhìzào Yǒuxiàn Gōngsī", "partners": "Shanghai SASAC (via 华虹集团)", "location": { "city": "Shanghai", "province": "Shanghai Municipality", "lat": 31.25, "lon": 121.59 }, "type": "Fab", "category": "State-Backed", "capability": "Three 8-inch (200mm) fabs — Jinqiao (Fab1, 9091-project heritage) and two Zhangjiang lines (Fab2/3 from the 2009 Hongli/Grace consolidation); ~180,000–190,000 wafers/month total; 1µm–90nm eNVM, power, BCD, RF", "investment": { "total_rmb_100m": null, "source": "Local Govt" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "Hua Hong's original Shanghai 200mm base — the three fabs the tracker missed while following the Wuxi 12-inch expansion; combined capacity ~180,000 wafers/month puts them among the largest 8-inch clusters in China. The listed A-share entity was renamed 华虹宏力 on 8 June 2026, and a formal '8-inch fab optimization & upgrade' program (2023 raise) is expanding rather than winding them down.", "what_it_makes": "Mature specialty wafers — embedded non-volatile memory, power discretes, BCD analog, RF — for automotive, industrial and consumer customers.", "why_it_matters": "With TSMC and Samsung shrinking global 8-inch capacity from 2025, these fabs ran above 100% utilization through 2025 with >10% price hikes in 2026 — China's legacy-node base is now the world's marginal supplier of mature wafers, which is the strategic argument for the 2026 export-control debates over 'legacy chip' security." }, "milestones": [ { "date": "2009-06-01", "event": "Hua Hong merges Honghai/Hongli/Huali design+fab assets into 华虹宏力, consolidating the Zhangjiang 8-inch fabs" }, { "date": "2026-06-08", "event": "STAR-listed entity renamed 华虹宏力; 8-inch upgrade program running; utilization >100%" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 2, "capital_intensity": 3 }, "dates": { "announced": "2009-06-01", "approved": null, "construction_start": null, "original_expected_completion": null, "date_completion": null }, "sources": [ { "url": "https://www.huahonggrace.com/s/about_milestone.php", "title": "华虹宏力里程碑（金桥/张江8英寸厂沿革）", "date": "2026-10-01" }, { "url": "https://www.infoobs.com/article/20260122/70699.html", "title": "华虹8英寸：产能约19万片/月、提价10%+ (讯石光通讯/芯闻)", "date": "2026-01-22" } ] }, { "id": "ti-chengdu", "name_en": "Texas Instruments Chengdu", "name_zh": "德州仪器半导体制造（成都）有限公司", "name_pinyin": "Dézhōu Yíqì Chéngdū", "company_en": "Texas Instruments", "company_zh": "德州仪器半导体制造（成都）有限公司", "company_pinyin": "Dézhōu Yíqì Bàndǎotǐ Zhìzào (Chéngdū) Yǒuxiàn Gōngsī", "partners": [], "location": { "city": "Chengdu", "province": "Sichuan", "lat": 30.55, "lon": 103.95 }, "type": "Fab", "category": "Foreign-Invested", "capability": "200mm analog/power wafer fab (acquired from Cension, formerly SMIC-operated, 2010) + wafer test, assembly/test (CDAT/CDAT2) and a 300mm wafer-bumping line — TI's first fully-integrated site outside the United States", "investment": { "total_usd_million": 1690, "source": "Foreign" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "A Wikipedia cross-check correction: TI Chengdu is NOT a 300mm fab (that common claim conflates the 2017 300mm bumping line). It is TI's 200mm analog fab, bought in October 2010 from Cension — which SMIC had been operating — plus back-end sites, under a 15-year strategy worth up to $1.69 billion; CDAT2 assembly/test entered production after November 2022.", "what_it_makes": "Analog and power management chips for industrial/automotive markets; packaging and test for TI products.", "why_it_matters": "The main foreign-owned wafer fab in western China and the clearest counter-example to the 'foreign majors are exiting China' narrative in 2025-26: while TI closes 150mm fabs in the US/Europe, its Chengdu integrated site stays in production, and the tracker's Chengdu cluster (Intel ATP + TI fab) now matches what actually exists." }, "milestones": [ { "date": "2010-10-14", "event": "TI opens its first China manufacturing plant — 200mm fab acquired from Cension (ex-SMIC-operated)" }, { "date": "2017-04-01", "event": "300mm wafer-bumping (not a wafer fab) facility announced" }, { "date": "2022-11-01", "event": "CDAT2 assembly/test site announced entering production; second A/T building completed 2021-08" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 1, "capital_intensity": 3 }, "dates": { "announced": "2009-09-01", "approved": null, "construction_start": null, "original_expected_completion": null, "date_completion": "2010-10-14" }, "sources": [ { "url": "https://www.ti.com/about-ti/newsroom/news-releases/2010/2010-10-14-texas-instruments-opens-the-company-s-first-semiconductor-manufacturing-plant-in-china.html", "title": "TI Opens First Semiconductor Manufacturing Plant in China (TI Newsroom)", "date": "2010-10-14" }, { "url": "https://www.edn.com/ti-buys-former-smic-fab-in-chengdu", "title": "TI buys former SMIC-operated fab in Chengdu (EDN)", "date": "2010-10-15" }, { "url": "https://www.jiemian.com/article/8352881.html", "title": "进博会：德州仪器成都第二封装测试厂即将投产 (界面新闻)", "date": "2022-11-07" } ] }, { "id": "hejian-suzhou", "name_en": "Hejian Chip Manufacturing Suzhou (UMC 8N)", "name_zh": "和舰芯片制造（苏州）股份有限公司", "name_pinyin": "Héjiàn Xīnpiàn Zhìzào (Sūzhōu)", "company_en": "Hejian Technology (Suzhou) Co., Ltd.", "company_zh": "和舰芯片制造（苏州）股份有限公司", "company_pinyin": "Héjiàn Xīnpiàn Zhìzào (Sūzhōu) Gǔfèn Yǒuxiàn Gōngsī", "partners": "UMC (via Oakwood Associates, 98.14% at IPO docs)", "location": { "city": "Suzhou", "province": "Jiangsu", "lat": 31.32, "lon": 120.71 }, "type": "Fab", "category": "Foreign-Invested", "capability": "8-inch (200mm) foundry — 0.5µm–0.11µm (eFlash, BCD, CIS, high-voltage platforms); capacity ~64,000/month end-2018, 77,000/month planning basis", "investment": { "total_usd_million": null, "source": "Foreign" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "UMC's mainland 200mm fab (Fab 8N) — established 2001-11, production since May 2003, controlled by UMC since March 2013; a rare Taiwan-controlled fab operating on mainland soil, and still running at high utilization per UMC's mid-2025 statements, raising prices with the 8-inch cycle in 2026. A planned STAR IPO (filed March 2019) was withdrawn July 2019 over control-chain questions; a frequently repeated 'sold to a local group in 2018' claim found NO supporting source and is not adopted here.", "what_it_makes": "Mature-node analog/power/flash wafers on 200mm for UMC's customer base from mainland China.", "why_it_matters": "One of the few cross-strait manufacturing assets still intact as of 2026 — alongside UMC Xiamen (联芯) — its continued high utilization and 10-15% 2026 price actions show Taiwan's mature-node operations remain commercially embedded in the mainland cluster." }, "milestones": [ { "date": "2003-05-01", "event": "Suzhou Industrial Park 8-inch fab begins production" }, { "date": "2013-03-01", "event": "UMC completes takeover of controlling stake in Hejian" }, { "date": "2019-07-21", "event": "STAR Market IPO application withdrawn" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 2, "capital_intensity": 2 }, "dates": { "announced": "2001-11-01", "approved": null, "construction_start": null, "original_expected_completion": null, "date_completion": "2003-05-01" }, "sources": [ { "url": "https://pdf.dfcfw.com/pdf/H2_AN201903221308711323_1.pdf", "title": "和舰芯片科创板招股说明书（股权/制程/产能） (东方财富)", "date": "2019-03-22" }, { "url": "https://finance.sina.com.cn/stock/relnews/cn/2025-06-02/doc-ineyskrx9483691.shtml", "title": "联电：和舰、联芯厂区保持高稼动 (新浪财经转全球半导体观察)", "date": "2025-06-02" } ] }, { "id": "worlds-chongqing", "name_en": "Worlds (Chongqing) Semiconductor", "name_zh": "重庆万国半导体科技有限公司", "name_pinyin": "Chóngqìng Wànguó Bàndǎotǐ Kējì Yǒuxiàn Gōngsī", "company_en": "Worlds (Chongqing) Semiconductor Technology Co., Ltd.", "company_zh": "重庆万国半导体科技有限公司", "company_pinyin": "Chóngqìng Wànguó Bàndǎotǐ Kējì Yǒuxiàn Gōngsī", "partners": ["Alpha & Omega Semiconductor (US)", "Chongqing Liangjiang新区 state funds"], "location": { "city": "Chongqing", "province": "Chongqing Municipality", "lat": 29.65, "lon": 106.5 }, "type": "Fab", "category": "JV", "capability": "12-inch power semiconductors (MOSFET/analog) + on-site assembly/test — marketed at launch as China's first integrated 12-inch power-device fab; phase-1 20,000 wafers/month (mass production from July–September 2019, per AOS), phase-2 target 50,000/month", "investment": { "total_usd_million": 379, "source": "Foreign" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "The AOS–Chongqing JV (registered April 2016; AOS reported initial capitalisation of $330M and total capitalisation of $379M by November 2019, split 51% AOS / 49% Chongqing funds at formation) that the Wikipedia fab list shows as 'under construction'. It has in fact been in 12-inch mass production since mid-2019. In July 2025 AOS agreed to sell about 20.3% of the JV for $150M to SIMIC Holdings Co., Ltd. (reportedly Shanghai Xinwei Technology Group); the sale completed in May 2026, moving the fab toward Chinese control.", "what_it_makes": "12-inch MOSFET/analog power devices and modules for consumer, industrial and EV-adjacent applications.", "why_it_matters": "A case study in how a US-designed power-semi fab in inland China changes hands without ever closing — the stake sale to a Shanghai tech-asset group mirrors the broader pattern of foreign-origin fabs being absorbed into domestic capital structures." }, "milestones": [ { "date": "2016-04-22", "event": "Company registered in Chongqing Liangjiang New Area (AOS + local state funds)" }, { "date": "2018-06-01", "event": "Phase-1 fab + assembly/test trial production (20,000 wafers/month)" }, { "date": "2019-07-01", "event": "12-inch Phase 1 mass production begins (AOS fiscal Q1 2020, July–September 2019); marketed as China's first integrated 12-inch power fab (company claim)" }, { "date": "2025-07-01", "event": "AOS agrees to sell 20.3% of the JV (about half its 39.2% stake) for ~$150M to SIMIC Holdings Co., Ltd. (reportedly Shanghai Xinwei); sale completed May 2026" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 3, "capital_intensity": 3 }, "dates": { "announced": "2015-04-01", "approved": null, "construction_start": "2016-08-01", "original_expected_completion": null, "date_completion": "2019-07-01" }, "sources": [ { "url": "https://investor.aosmd.com/press-releases/press-release-details/2025/AOS-Announced-150-Million-Sale-of-a-Portion-of-its-Equity-Interest-in-CQJV/default.aspx", "title": "AOS Announced $150 Million Sale of a Portion of its Equity Interest in CQJV", "date": "2025-07-14" }, { "url": "https://finance.yahoo.com/markets/stocks/articles/alpha-omega-semiconductors-aosl-completes-191619240.html", "title": "Alpha & Omega Semiconductors (AOSL) Completes Sale of Interests in China-based Joint Venture", "date": "2026-05-12" }, { "url": "https://s22.q4cdn.com/656605939/files/doc_presentations/2019/11/26/AOSL_November-2019-IR-Presentation.pdf", "title": "AOSL November 2019 IR Presentation", "date": "2019-11-26" }, { "url": "https://investor.aosmd.com/press-releases/press-release-details/2016/Alpha-and-Omega-Semiconductor-Limited-Announces-Joint-Venture-Agreement-in-China/default.aspx", "title": "Alpha and Omega Semiconductor Limited Announces Joint Venture Agreement in China", "date": "2016-03-29" } ] }, { "id": "skhynix-chongqing-atp", "name_en": "SK Hynix Chongqing (Assembly & Test)", "name_zh": "爱思开海力士半导体（重庆）有限公司", "name_pinyin": "Àisīkāi Hǎilìshì Bàndǎotǐ (Chóngqìng)", "company_en": "SK Hynix", "company_zh": "SK海力士半导体（重庆）有限公司", "company_pinyin": "SK Hǎilìshì Bàndǎotǐ (Chóngqìng) Yǒuxiàn Gōngsī", "partners": [], "location": { "city": "Chongqing", "province": "Chongqing Municipality", "lat": 29.6, "lon": 106.32 }, "type": "Assembly & Packaging", "category": "Foreign-Invested", "capability": "NAND flash package-and-test — ~80 million units/month at the 2014 launch", "investment": { "total_usd_million": 1200, "source": "Foreign" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "packaging_trajectory": [ { "year": 2014, "technology": "NAND flash package & test (16GB mobile NAND from Cheongju) in volume" }, { "year": 2019, "technology": "Phase 2 dedicated packaging plant; phase 1 becomes test-only (planned)" } ], "capacity": { "basis": "planned", "units_per_month": 167000000, "as_of": "2019", "note": "planned post-phase-2 capacity: '接近20亿只'/yr / 12 = ~167M units/month; phase 1 alone was ~9.6亿只/yr (~80M/month, matching the 2014 figure)" }, "narrative": { "significance": "SK Hynix's Chongqing back-end (2013 agreement, mass production 2014, phase-2 2019, ~$1.2B cumulative) — the assembly/test counterpart to its Wuxi DRAM and Dalian NAND fabs, and the reason the Korean memory maker's China exposure is not only about wafer fabs.", "what_it_makes": "Packaging and test of NAND flash modules/SSD components.", "why_it_matters": "As of August 2026 SK Hynix is reportedly weighing options incl. selling a stake (~$3B valuation, possible Chinese fund buyers) while keeping the site running — the first major case of a Korean memory back-end in China facing a divest-or-double-down decision under tool-control pressure." }, "milestones": [ { "date": "2013-07-01", "event": "Site founded and breaks ground (2013-05 agreement)" }, { "date": "2014-09-01", "event": "Mass production begins (~$250-300M phase 1)" }, { "date": "2019-09-01", "event": "Phase-2 completed; cumulative investment ~$1.2B" }, { "date": "2026-08-01", "event": "Stake-sale options reported (~$3B valuation); no decision confirmed" } ], "complexity": { "technology_difficulty": 2, "foreign_dependence": 1, "capital_intensity": 3 }, "dates": { "announced": "2013-05-01", "approved": null, "construction_start": "2013-07-01", "original_expected_completion": null, "date_completion": "2014-09-01" }, "sources": [ { "url": "https://www.koreaherald.com/article/3824990", "title": "SK hynix weighs options for Chongqing plant (~$3B) (Korea Herald)", "date": "2026-08-15" }, { "url": "https://en.edaily.co.kr/news/eda202608095040", "title": "SK hynix Considers Selling Stake in Chongqing Plant in China, Among Other Options (EDAILY)", "date": "2026-08-09" }, { "url": "https://technews.tw/2014/09/29/sk-hynix-chongqinggo-into-operation/", "title": "SK 海力士重慶封測廠投產、估明年銷售上看 6 億美元", "date": "2014-09-29" }, { "url": "https://chinaflashmarket.com/a/167031", "title": "SK海力士重庆二期设备搬入，主攻封装，预计9月投产", "date": "2019-07-15" } ] }, { "id": "sanan-ic-xiamen", "name_en": "Sanan IC (Xiamen / Quanzhou compound fabs)", "name_zh": "厦门市三安集成电路有限公司 / 泉州市三安集成电路有限公司", "name_pinyin": "Sān'ān Jíchéng Diànlù", "company_en": "Sanan IC (Sanan Optoelectronics foundry arm)", "company_zh": "厦门市三安集成电路有限公司", "company_pinyin": "Shàménn Shì Sān'ān Jíchéng Diànlù Yǒuxiàn Gōngsī", "partners": "三安光电 (600703.SH)", "location": { "city": "Xiamen", "province": "Fujian", "lat": 24.62, "lon": 118.12 }, "type": "Compound Semiconductor", "category": "Private", "capability": "China's first 6-inch compound-semiconductor foundry (est. 2014): GaAs RF HBT/pHEMT, GaN-on-SiC RF PA (5G base stations), GaN power, InP optical; Quanzhou line: SAW/TC-SAW filters (~150M die/month), IATF16949-certified 2022", "investment": { "total_rmb_100m": null, "source": "Private" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "The foundry arm of Sanan Optoelectronics (separate from the Changsha SiC IDM and the Jinan ST JV this tracker already carries) — 三安集成's Xiamen 6-inch line was China's first compound foundry, and its GaN RF PA work won a National Science & Technology Progress first prize (2023). 2025 IC-segment revenue ¥29.16亿 (+2.1%), with filter capacity at 150 million die/month. Quanzhou campus plan reported at ~$4.6B in Wikipedia-era coverage; treat as site-plan not verified total.", "what_it_makes": "GaAs/GaN RF, SiC and InP optoelectronic wafers as a foundry; SAW filters for mobile.", "why_it_matters": "RF front-end localization (GaAs/GaN PA + domestic SAW) is a direct answer to the Qualcomm/Skyworks chokepoint; governance flag: from June 2026 creditors petitioned to restructure the holding companies 厦门三安电子/三安集团 (real controllers' 留置 episode May-Oct 2026) — fabs operating, ownership under restructuring review." }, "milestones": [ { "date": "2014-01-01", "event": "三安集成 established — China's first 6-inch compound-semiconductor foundry line" }, { "date": "2017-01-01", "event": "Quanzhou compound fab line enters operation (SAW/RF)" }, { "date": "2026-06-01", "event": "Creditor restructuring petition filed against Sanan holding entities; fabs continue production" } ], "complexity": { "technology_difficulty": 4, "foreign_dependence": 2, "capital_intensity": 3 }, "dates": { "announced": "2014-01-01", "approved": null, "construction_start": "2014-01-01", "original_expected_completion": null, "date_completion": "2017-01-01" }, "sources": [ { "url": "http://static.cninfo.com.cn/finalpage/2025-08-28/1224589218.PDF", "title": "三安光电2025年半年度报告（三安集成营收/产线） (巨潮资讯)", "date": "2025-08-28" }, { "url": "https://www.jiemian.com/article/14576535.html", "title": "三安集团债务重整申请：化合物半导体产线现状 (界面新闻)", "date": "2026-06-20" }, { "url": "https://www.sanan-ic.com/en/news-23", "title": "Sanan IC — foundry platform page (GaAs/GaN/SiC/InP/SAW)", "date": "2026-10-01" } ] }, { "id": "hanking-mems-fushun", "name_en": "Hanking MEMS (Liaoning)", "name_zh": "罕王微电子（辽宁）有限公司", "name_pinyin": "Hǎnwáng Wēidiànzǐ (Liáoníng)", "company_en": "Hanking Microelectronics (Liaoning) Co., Ltd.", "company_zh": "罕王微电子（辽宁）有限公司", "company_pinyin": "Hǎnwáng Wēidiànzǐ (Liáoníng) Yǒuxiàn Gōngsī", "partners": "Hanking Group (罕王集团, listed iron-ore origin)", "location": { "city": "Fushun", "province": "Liaoning", "lat": 41.85, "lon": 123.85 }, "type": "Fab", "category": "Private", "capability": "China's first dedicated 8-inch pure-MEMS production line (est. 2011, Shenfu New Area); pressure/inertial/gas MEMS IDM + foundry; phase-1 ~10,000 wafers/month (marketed to 30k incl. WLP)", "investment": { "total_rmb_100m": null, "source": "Private" }, "status": "Operational", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "A Wikipedia-dump survivor check: the 'Hanking Electronics, Fushun' row is real but obscure — 罕王微电子 is not the same company as Suzhou Hanking (a fabless SAW designer, whose separate Changshu line 臻芯微 went live 2022-10). Listed on MIIT's official IC-producer roster and a 2017 'Made in China 2025' showcase line.", "what_it_makes": "MEMS sensors (pressure, inertial, gas) on 200mm, IDM + MUMPs-style foundry services.", "why_it_matters": "Included with an explicit low-confidence flag: the site is live and the company still exists, but there is no independent 2025-26 news flow confirming utilization or viability — a candidate for the 'operational-but-quiet' grey zone that this tracker marks as not verified rather than dropping." }, "milestones": [ { "date": "2011-05-01", "event": "Company established in Shenfu New Area" }, { "date": "2017-04-01", "event": "8-inch MEMS line showcased in MIIT Made-in-China-2025 materials; on official IC-producer list" } ], "complexity": { "technology_difficulty": 3, "foreign_dependence": 3, "capital_intensity": 2 }, "dates": { "announced": "2011-05-01", "approved": null, "construction_start": null, "original_expected_completion": null, "date_completion": "2017-04-01" }, "sources": [ { "url": "https://hankingmems.cn/", "title": "罕王微电子（辽宁）有限公司官网（8英寸MEMS产线）", "date": "2026-10-01" }, { "url": "https://www.semi.org.cn/site/semi/article/f37dee0e2d1c42a99efed8927977d6bb.html", "title": "国内首条8英寸MEMS专线：罕王微电子 (国家半导体产业网)", "date": "2025-06-01" } ] }, { "id": "hsmc-wuhan", "name_en": "HSMC Wuhan (Hongxin Semiconductor — cancelled)", "name_zh": "武汉弘芯半导体制造有限公司", "name_pinyin": "Wǔhàn Hóngxīn Bàndǎotǐ", "company_en": "Wuhan Hongxin Semiconductor Manufacturing Co. (HSMC)", "company_zh": "武汉弘芯半导体制造有限公司", "company_pinyin": "Wǔhàn Hóngxīn Bàndǎotǐ Zhìzào Yǒuxiàn Gōngsī", "partners": ["Dongxihu district SOE (10%)", "Beijing Guangliang Lantu shell vehicle (90%, zero paid-in)"], "location": { "city": "Wuhan", "province": "Hubei", "lat": 30.62, "lon": 114.13 }, "type": "Fab", "category": "Private", "capability": "Never produced — planned 14nm/7nm logic fab + advanced packaging (claimed ~¥128B); ~300 of 3,560 planned tools ever received", "investment": { "total_rmb_100m": null, "source": "Local Govt" }, "status": "Cancelled", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "The emblematic China fab-boom failure and this tracker's first explicit Cancelled entry (the schema always had the status): a 90%-shell-owned '128-billion-yuan 14nm' project that spent ~¥15.3 billion by end-2019, staged a fake production line for investors, took delivery of an ASML NXT:1980Di DUV scanner (repeatedly misreported in Chinese media as 'EUV') in Dec 2019, and mortgaged it for ¥580 million in Jan 2020.", "what_it_makes": "Nothing — unfinished shells and two vacant dormitory towers; state takeover Nov 2020, staff cut Feb 2021, renamed 武汉新工现代制造 and deregistered 29 June 2021.", "why_it_matters": "HSMC triggered the 2020-21 central-level cleanup of rogue semiconductor pledges and the 'new-type举国体制' debate over local-government fab financing; site reuse as of 2025-26 is not verified. Keeping cancelled projects in the tracker matters: the denominator of announced Chinese fabs is as analytically important as the operational numerator." }, "milestones": [ { "date": "2017-11-01", "event": "Registered in Wuhan Linkonggang (Dongxihu) with claimed ¥128B plan" }, { "date": "2019-12-01", "event": "ASML NXT:1980Di DUV tool arrives — the only major tool ever delivered" }, { "date": "2020-11-01", "event": "State takes over; company deregistered 29 June 2021" } ], "complexity": { "technology_difficulty": 4, "foreign_dependence": 5, "capital_intensity": 5 }, "dates": { "announced": "2017-11-01", "approved": null, "construction_start": "2018-01-01", "original_expected_completion": "2020-12-31", "date_completion": null }, "sources": [ { "url": "https://zh.wikipedia.org/zh-hans/%E6%AD%A6%E6%BC%A2%E5%BC%98%E8%8A%AF", "title": "武汉弘芯（维基百科条目，含ASML/DUV误报澄清）", "date": "2026-09-30" }, { "url": "https://www.nbd.com.cn/rss/zaker/articles/1499833.html", "title": "弘芯破产调查：注册资本20亿实缴2亿 (每日经济新闻)", "date": "2024-05-22" }, { "url": "https://www.eet-china.com/mp/a197317.html", "title": "复盘武汉弘芯：3560台设备只到了300台 (电子工程专辑)", "date": "2024-06-10" } ] }, { "id": "dehuai-huainan", "name_en": "Decoma/Tacoma CIS Fabs (Huai'an & Nanjing — cancelled)", "name_zh": "江苏德淮半导体有限公司（前身淮安德科码）", "name_pinyin": "Jiāngsū Déhuái Bàndǎotǐ", "company_en": "Jiangsu Decoma Semiconductor Technology Co., Ltd.", "company_zh": "江苏德淮半导体有限公司", "company_pinyin": "Jiāngsū Déhuái Bàndǎotǐ Kējì Yǒuxiàn Gōngsī", "partners": ["Huai'an municipal government (post-2017 takeover)", "promoter Li Ruiwei (Decoma/Tacoma chain)"], "location": { "city": "Huai'an", "province": "Jiangsu", "lat": 33.58, "lon": 119.03 }, "type": "Fab", "category": "State-Backed", "capability": "Never produced — claimed ¥45B 12-inch CIS fab (phase 1 ¥12B, 240,000 wafers/year); ~90% of shell built, 57 of 211 tool sets arrived, zero CIS output", "investment": { "total_rmb_100m": null, "source": "Local Govt" }, "status": "Cancelled", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "The two half-built CIS-fab scams of the same promoter — Huai'an (德科码 → renamed 德淮 after litigation) and Nanjing (Tacoma (Nanjing) Semiconductor 南京德科码, a 2017 TowerJazz-licensed CIS/RF-SOI paper JV that built nothing and was declared bankrupt 22 June 2020; the Wikipedia 'Tower Tacoma Nanjing' row) — resolved as one tracker entry since the Wikipedia dump splits them.", "what_it_makes": "Nothing: bankrupt, assets auctioned — Huai'an's 62 tool sets (AMAT/Nikon/KLA/TEL/LAM), 19 buildings and 171,000 m² land appraised ¥2.38B for JD auction from ¥1.666B (Aug 2021; result not verified).", "why_it_matters": "Shows the Decoma/Tacoma chain (Shenzhen Sile, Wuhan Xiaoxin, Changshu Zhongwei also surfaced in the same 2021 OFweek exposé) exploiting the 2016-2018 CIS investment wave with tool-count theatre; the government-takeover-then-auction sequence is the standard lifecycle of the cancelled-fab cohort this entry and HSMC document." }, "milestones": [ { "date": "2016-01-01", "event": "Huai'an Deco Code registered; groundbreaking March 2016 (claimed ¥45B, phase 1 ¥12B)" }, { "date": "2017-08-01", "event": "Nanjing Tacoma — TowerJazz signs CIS/RF-SOI tech-license JV; nothing built" }, { "date": "2020-06-22", "event": "Tacoma (Nanjing) declared bankrupt by Nanjing Intermediate Court" }, { "date": "2021-08-06", "event": "Dehuai assets (¥2.38B appraised) listed for bankruptcy auction" } ], "complexity": { "technology_difficulty": 3, "foreign_dependence": 4, "capital_intensity": 4 }, "dates": { "announced": "2016-01-01", "approved": null, "construction_start": "2016-03-01", "original_expected_completion": null, "date_completion": null }, "sources": [ { "url": "https://ee.ofweek.com/2021-07/ART-8120-2816-30508868.html", "title": "德科码系骗局全复盘：淮安45亿、南京破产 (OFweek电子工程)", "date": "2021-07-20" } ] }, { "id": "gf-chengdu", "name_en": "GlobalFoundries Chengdu (cancelled)", "name_zh": "格芯（成都）集成电路制造有限公司（未建成）", "name_pinyin": "Géxīn (Chéngdū)", "company_en": "GlobalFoundries", "company_zh": "格芯（成都）集成电路制造有限公司", "company_pinyin": "Géxīn (Chéngdū) Jíchéng Diànlù Zhìzào Yǒuxiàn Gōngsī", "partners": "Chengdu municipal government (fab shell built for ~¥7B)", "location": { "city": "Chengdu", "province": "Sichuan", "lat": 30.68, "lon": 103.99 }, "type": "Fab", "category": "Foreign-Invested", "capability": "Never produced — announced Feb 2017, ~$10B 12-inch JV fab (22FDX FD-SOI + legacy nodes, 20k wpm planned, 85k at full build)", "investment": { "total_usd_million": 10000, "source": "Foreign" }, "status": "Cancelled", "entity_list": { "status": false, "date_added": null, "list": null }, "equipment_origin": { "domestic_pct": null, "key_foreign_tools": [], "smuggled_flagged": false }, "node_trajectory": [], "narrative": { "significance": "The $10 billion fab that started China's 12-inch era paper boom and ended it: GF halted funding Oct 2018 amid its own IPO delay; the government-built shell stood empty; formal closure with severance for the last 74 employees May 2020; a reported revival by Intel was shelved Nov 2021; a 2020 claim that ex-SK Hynix VP Choi Jin-seok's 成都高真科技 would take the shell for DRAM is not verified as ever materializing.", "what_it_makes": "Nothing — the site never brought production tools in; it was sealed January 2019.", "why_it_matters": "This tracker previously only footnoted GF Chengdu's absence in About; it is now a proper Cancelled entry — the closure of GF Chengdu is the pivot point after which every surviving 12-inch project became state-financed, and the empty shell became the cautionary reference in every subsequent local-government fab pitch." }, "milestones": [ { "date": "2017-02-28", "event": "GF-Chengdu JV announced — at the time the largest planned 12-inch logic fab in mainland China" }, { "date": "2018-10-01", "event": "GF cancels remaining investment; tools removed early 2019, site sealed" }, { "date": "2021-11-01", "event": "SCMP: Intel shelts takeover of the abandoned plant" } ], "complexity": { "technology_difficulty": 3, "foreign_dependence": 2, "capital_intensity": 4 }, "dates": { "announced": "2017-02-28", "approved": null, "construction_start": "2017-10-01", "original_expected_completion": "2020-12-31", "date_completion": null }, "sources": [ { "url": "https://www.eetimes.com/globalfoundries-abandons-chengdu-wafer-fab", "title": "GlobalFoundries Abandons Chengdu Wafer Fab (EE Times)", "date": "2018-10-04" }, { "url": "https://www.scmp.com/tech/tech-war/article/3156519/intel-shelves-plan-take-over-globalfoundries-abandoned-chip-plant", "title": "Intel shelves plan to take over GF's abandoned Chengdu plant (SCMP)", "date": "2021-11-28" } ] } ] }