Biren Technology · 上海壁仞智能科技有限公司
Fabless
Chinese name: 上海壁仞智能科技有限公司 (Shànghǎi Bìrèn Zhìnéng Kējì Yǒuxiàn Gōngsī)
Founded September 2019 by former SenseTime president Zhang Wen and former Huawei engineer Jiao Guofang; one of two Chinese GPU startups (with Moore Threads) directly named in the US Commerce Department’s October 17, 2023 Entity List action targeting AI chip designers with a Foreign Direct Product Rule designation, the most restrictive tier. Listed on the Hong Kong Stock Exchange’s main board on January 2, 2026 (06082.HK) — the first new HK listing of the year and, at the time, the largest IPO under HKEX’s 18C mechanism — issuing about 248 million shares at HK$19.60, with the stock closing up ~94.6% on debut. It has since raised twice more: ~HK$7.04 billion net in a July 2026 placing at HK$46.20, and a second placing announced 8 October 2026 (130 million shares at HK$31.08, HK$4.04 billion gross, ~70% earmarked for supply-chain procurement), taking 2026 capital raised past HK$17 billion; the shares fell ~12% on the October announcement to a market cap around HK$78.9 billion.
What does this firm design?
General-purpose GPUs for AI compute, led by the BR100 series, competing directly in the segment most exposed to Nvidia export restrictions. H1 2026 revenue (formal filing, 28 August) was ¥1.236 billion, up ~2,000% year-on-year, with net loss narrowing to ¥377 million and R&D at ¥804 million; stock-plus-prepayment rose 230% to ¥1.534 billion. The next-generation BR20X has been successfully lit up and is in post-tapeout validation, with reported performance benchmarked against Nvidia’s H200 class and launch slated within 2026; at WAIC (July 2026) Biren demonstrated a BLink 2.0 optical-interconnect supernode scaling to 1,024 cards.
Key Facts
| Category | Fabless |
| Founded | 2019 |
| Location | Shanghai, Shanghai Municipality |
| Product Focus | General-purpose GPUs for AI training and inference (BR100 series) |
| Node Sophistication | Designed for leading-edge nodes; fabrication access constrained by its Entity List status |
| Entity List | Yes — US Commerce BIS (Footnote 4 Foreign Direct Product Rule) |
| Last Verified | Newest source dated 09 Oct 2026 (4 sources) |
Design Score
4/5
Sources
- Biren Technology (Wikipedia) (28 Sep 2026)
- ’港股GPU第一股’壁仞科技大涨94.59% 2026科技企业IPO潮加速来袭 (财联社) (02 Jan 2026)
- 壁仞科技2026年中期业绩公告 (HKEXnews) (28 Aug 2026)
- 壁仞科技拟配股融资逾40亿港元 新一代产品已进入流片后验证阶段 (证券时报) (09 Oct 2026)