Project Timeline

Milestones and expected completion dates for China’s semiconductor facilities

Milestones and expected completion dates for China’s semiconductor facilities, from announcement to line-out.
Published

October 11, 2026

Facility Timelines

Each row represents a facility. Bars show the span from construction start (or announcement, if construction hasn’t begun) to expected or actual completion. For cancelled projects, the bar is faded and ends at the last recorded event (abandonment, takeover, or bankruptcy), not today. Diamond markers (◆) mark the announcement date. The dashed line marks today.

Recent Milestones

  • Dec 2027 — Target date for the Xiqing fab to reach full planned capacity (100,000 wafers/month) (SMIC Tianjin (Xiqing))
  • Dec 2026 — Targeted completion of an 8-inch GaN capacity expansion from 13,000 to 20,000 wafers/month (Innoscience Suzhou)
  • Sep 2026 — CXMT announces it will deploy ¥18 billion of IPO over-subscription proceeds toward DRAM R&D and a Phase 2 back-end (wafer test) base, part of a combined ¥34.9 billion in related investment (CXMT Shanghai (Pudong DRAM ‘Super Factory’))
  • Sep 2026 — Breaks ground on the SiEn Industry Innovation Center, a five-building R&D complex (not a new fab line) in the Qingdao Free Trade Zone IC industrial park (SiEn Qingdao)
  • Sep 2026 — Fifth-generation (G5) DRAM platform declared in production — ~12nm-class half-pitch on ArF immersion multi-patterning — followed by an October 2026 statement that G5/LPDDR6 are in mass production (CXMT Hefei)
  • Sep 2026 — Reuters, via Chinese reprints, reports CXMT is preparing to enter NAND flash with an R&D pilot line inside the planned Beijing fab (CXMT Hefei)
  • Sep 2026 — Share transfer completed — Fab 5 becomes wholly within the listed Hua Hong company (HLMC (Shanghai Huali, Fab 5 & Fab 6))
  • Sep 2026 — Hua Hong Semiconductor formally announces the Wuxi Phase 3 joint venture: US$6.95 billion total (US$4.17B equity, US$2.78B debt), group share about US$2.127 billion, 55,000 wafers/month (Hua Hong Wuxi (Fab9, Phase II))
  • Sep 2026 — Entity formally renamed to reflect full SK Hynix ownership, ending Intel’s fab presence in China (SK Hynix Dalian (former Intel fab))
  • Sep 2026 — Becomes Intel’s sole remaining manufacturing site in China once the Dalian fab’s transfer to SK Hynix is finalized (Intel Chengdu)