HLMC (Shanghai Huali, Fab 5 & Fab 6) · 上海华力微电子有限公司 / 上海华力集成电路制造有限公司

Hua Hong Semiconductor Group (HLMC) | Fab

Mainland China’s first fully-automated 12-inch fab (Fab 5, first wafers April 2011, built under the ‘Project 909’ upgrade lineage) and one of very few dome…
Published

October 11, 2026

TipWhy This Matters

Mainland China’s first fully-automated 12-inch fab (Fab 5, first wafers April 2011, built under the ‘Project 909’ upgrade lineage) and one of very few domestic 28/22nm logic sites (Fab 6, wafers since October 2018). In September 2026 Fab 5 formally merged into the listed Hua Hong entity (688347/1347.HK) via an ¥8.268 billion share deal — resolving the group’s long-standing IPO-era same-competition commitment; Fab 5 contributed ~¥5 billion revenue and >¥500 million net profit in 2024.

Chinese name: 上海华力微电子有限公司 / 上海华力集成电路制造有限公司 (Shànghǎi Huálì Wēidiànzǐ)

What does this facility make?

12-inch foundry wafers at 65/55/40nm (Fab 5, incl. NOR/eNVM, RF, BSI plans) and 28/22nm (Fab 6, still outside the listed company under group ownership).

Why does it matter?

Consolidates China’s #2 foundry group’s 12-inch base at ~a sixth of national 12-inch capacity, and keeps one of the few domestic 28nm logic lines — the node where export controls bite hardest — inside a state-owned structure. The follow-on ¥7.556 billion placement funds a ¥2.53 billion BSI and ¥562 million BCD program.

Key Facts

Company Hua Hong Semiconductor Group (HLMC)
Type Fab
Category State-Backed
Capability Fab 5 (Zhangjiang): 12-inch, 65/55nm and 40nm logic/NOR/RF, 38,000 wafers/month. Fab 6 (Kangqiao): 12-inch, 28/22nm, capacity not sourced. Hua Hong’s 2026 acquisition covers Fab 5 only
Status Operational
Capacity 38,000 wafers/month (300mm), as of 2026-05 — Fab 5 (华力微, Zhangjiang) design capacity only; Fab 6 (华力集成) has no sourced figure
Investment Not disclosed
Funding Source Local Govt
Location Shanghai, Shanghai Municipality
Current Node 28nm HKC+ (mass production start; Fab 6 is the 28nm fab)
Entity List No
Equipment Origin Not yet assessed
Last Verified Not recorded (newest source dated Sep 2026)

Technical Complexity

4.4/5

Technology Node Trajectory

  • 2014: 55nm (CIS phone products in volume, Fab 5)
  • 2017: 55nm SONOS embedded memory in volume (Fab 5)
  • 2019: 28nm HKC+ (mass production start; Fab 6 is the 28nm fab)

Project Timeline

  • Apr 2011 — Fab 5 (Huali 1) first wafers — mainland’s first automated 12-inch fab
  • Oct 2018 — Fab 6 (Huali 2, 28/22nm, Kangqiao) first wafers
  • Aug 2025 — Hua Hong announces acquisition of controlling stake in Huali Micro (Fab 5), fulfilling IPO commitment
  • Sep 2026 — Share transfer completed — Fab 5 becomes wholly within the listed Hua Hong company

Sources

Back to Map