Nexchip Hefei · 晶合集成

Nexchip Semiconductor Corporation | Fab

Mainland China’s third-largest foundry by revenue after SMIC and Hua Hong — a Taiwan (Powerchip)-mainland joint venture, a structure now rare given cross-s…
Published

October 11, 2026

TipWhy This Matters

Mainland China’s third-largest foundry by revenue after SMIC and Hua Hong — a Taiwan (Powerchip)-mainland joint venture, a structure now rare given cross-strait tensions. Analyst consensus as of April 2026 projected ¥1.11 billion net profit for the full year (+57.7% YoY), continuing 2025’s roughly 24% growth.

Chinese name: 晶合集成 (Jīnghé Jíchéng)

What does this facility make?

Display driver ICs (DDIC) and CMOS image sensors (CIS) on 12-inch wafers — a foundry niche distinct from SMIC/Hua Hong’s broader logic focus.

Why does it matter?

Shows Taiwanese foundry know-how transferring into a mainland-listed, mainland-controlled entity through a JV structure, ahead of any Taiwan-specific tracker this project might build later. This entry covers existing operational capacity; the January 2026 fourth-phase expansion (¥35.5 billion, a new 55,000 wafer/month line) is tracked as its own entry, nexchip-phase4, since it is actively under construction rather than operational.

Key Facts

Company Nexchip Semiconductor Corporation
Type Fab
Category JV
Capability 12-inch (300mm) wafer foundry, display driver ICs and CIS
Status Operational
Capacity 137,900 wafers/month (300mm), as of 2025-12 — designed capacity; actual output 139.0K (100.8% utilisation). Phase IV (55,000/month, 40/28nm) not included
Investment Not disclosed
Funding Source Local Govt
Location Hefei, Anhui
Current Node 40nm high-voltage OLED DDIC (mass production)
Entity List No
Equipment Origin Not yet assessed
Last Verified Not recorded (newest source dated Sep 2026)

Technical Complexity

2.5/5

Technology Node Trajectory

  • 2017: 110nm DDIC (A1 fab production start)
  • 2020: 150nm/110nm/90nm all in volume (90nm = 53% of 2020 revenue)
  • 2022: 55nm DDIC (mass production start)
  • 2025: 40nm high-voltage OLED DDIC (mass production)

Project Timeline

  • May 2015 — Founded as a joint venture between PSMC (Powerchip) and Hefei City Construction and Investment Holding Group
  • Jan 2026 — Launches Phase 4: ¥35.5 billion investment in a new 55,000 wafer/month 12-inch line, full capacity targeted end of 2028

Sources

Back to Map