SiEn Qingdao · 芯恩(青岛)集成电路
SiEn (Qingdao) Integrated Circuit Co., Ltd. | Fab
China’s first ‘CIDM’ (collaborative IDM) project — pooling IC-design firms, end-application companies, and the manufacturer as joint investors — founded by Richard Chang (Zhang Rujing), who also founded SMIC. Domestic reporting in 2026 describes Zhang as having since departed the company he founded, citing difficulty retaining talent — a leadership change this tracker has not independently corroborated beyond that single report. By 2026, reported capacity stood at roughly 60,000 wafers/month (8-inch line) and 40,000 wafers/month (12-inch line), with an annual output value around ¥4.6 billion at full capacity. SiEn was added to the US Commerce Department’s Entity List on December 2, 2024, as part of the 140-entity semiconductor package — one of only a handful of wafer fabs directly listed in that round.
Chinese name: 芯恩(青岛)集成电路 (Xīn’ēn (Qīngdǎo) Jíchéng Diànlù)
What does this facility make?
Logic/foundry, analog/power, and RF/wireless chips at 28nm and 40nm on both 200mm and 300mm wafers.
Why does it matter?
A structurally different ownership model (collaborative IDM, not a pure foundry or a single-owner state fab) from every other entry in this tracker, and notable for its founder’s direct SMIC lineage. In September 2026 it opened a separate ‘Industry Innovation Center’ — five R&D buildings on a 30,154 sq m site, explicitly a research/innovation facility rather than a new wafer production line — framed domestically as a shift from ‘scale manufacturing to innovation creation.’
Key Facts
| Company | SiEn (Qingdao) Integrated Circuit Co., Ltd. |
| Type | Fab |
| Category | State-Backed |
| Capability | 8-inch (200mm) and 12-inch (300mm) wafer fab, IDM model, 28-40nm logic/foundry, analog/power, RF |
| Status | Operational |
| Capacity | Not yet recorded |
| Investment | ¥218亿元 |
| Funding Source | Local Govt |
| Location | Qingdao, Shandong |
| Current Node | Not yet researched |
| Entity List | Yes — US Commerce BIS (02 Dec 2024) |
| Equipment Origin | Not yet assessed |
| Last Verified | Not recorded (newest source dated Sep 2026) |
Technical Complexity
2.5/5
Technology Node Trajectory
Node history not yet researched.
Project Timeline
- Apr 2018 — SiEn (Qingdao) established in the Qingdao West Coast New Area (Huangdao)
- Jan 2021 — Production commences on the first-phase lines
- Sep 2026 — Breaks ground on the SiEn Industry Innovation Center, a five-building R&D complex (not a new fab line) in the Qingdao Free Trade Zone IC industrial park
Sources
- Chinese IC company Sien IDM receives new funding in Qingdao City (28 Sep 2026)
- SiEn (Qingdao) Integrated Circuits - Phase 1 fab profile (28 Sep 2026)
- 芯恩落子青岛’芯’项目! (同花顺) (23 Sep 2026)
- 张汝京离开自己创办的青岛芯恩,慨叹人才难得 (EDN电子技术设计) (28 Sep 2026)