Hua Hong Wuxi (Fab9, Phase II) · 华虹无锡二期（Fab 9）

Hua Hong Semiconductor | Fab

Hua Hong’s second 12-inch fab in Wuxi, financed with the largest single Big Fund-backed deal since the October 2022 US export control tightening — $4.02B n…
Published

October 11, 2026

TipWhy This Matters

Hua Hong’s second 12-inch fab in Wuxi, financed with the largest single Big Fund-backed deal since the October 2022 US export control tightening — $4.02B new equity (Hua Hong Group, the Big Fund, and a Wuxi entity) plus $2.68B in debt. Began risk production at end-2024 and passed 40,000 wafers of single-month input in December 2025, per Hua Hong’s 2025 annual report; tools for the full 83,000 wafers/month design capacity were moved in by end of June 2026, with that capacity targeted for the end of Q3 2026.

Chinese name: 华虹无锡二期（Fab 9） (Huáhóng Wúxī Èrqī)

What does this facility make?

12-inch (300mm) wafers at mature specialty nodes (65nm, 55nm, 40nm) — power management, automotive, and analog chips, not leading-edge logic.

Why does it matter?

Illustrates China’s mature-node strategy: rather than chase export-controlled advanced lithography, state capital doubles down on nodes where China already has working equipment access. Hua Hong announced a THIRD Wuxi phase in September 2026 — a separate US$6.95 billion project (Hua Hong group’s own share about $2.127 billion), with construction having started in March 2026 — now tracked as its own entry, huahong-wuxi-phase3, signaling this is an open-ended expansion programme rather than a one-off Phase 2 project.

Key Facts

Company Hua Hong Semiconductor
Type Fab
Category State-Backed
Capability 12-inch (300mm) wafer foundry, specialty/mature nodes (65nm, 55nm, 40nm)
Status Operational
Capacity Planned: 83,000 wafers/month (300mm), as of 2026-09 — planned full capacity; all tools for 83K moved in by end-Jun 2026, target reached by end Q3 2026. Actual Dec 2025 single-month input was >40,000
Investment $6,700M
Funding Source Big Fund II
Location Wuxi, Jiangsu
Current Node Not yet researched
Entity List No
Equipment Origin Not yet assessed
Last Verified Not recorded (newest source dated Sep 2026)

Technical Complexity

2.9/5

Technology Node Trajectory

Node history not yet researched.

Project Timeline

  • Jan 2023 — Hua Hong Semiconductor, the Big Fund, and a Wuxi entity sign agreement for a $6.7 billion second 12-inch Wuxi fab (Fab9)
  • Jun 2023 — Construction of Fab9 begins
  • Sep 2023 — Fab9’s main building topped out roughly 100 days ahead of schedule
  • Dec 2024 — Hua Hong Manufacturing (Wuxi) Fab9 enters risk production (designed for 83,000 wafers/month at full build)
  • Mar 2026 — Construction begins on a separate Wuxi Phase 3 project (US$6.95 billion total)
  • Jun 2026 — Fab9 process-equipment move-in completed; full-capacity ramp targeted for end of Q3 2026
  • Sep 2026 — Hua Hong Semiconductor formally announces the Wuxi Phase 3 joint venture: US$6.95 billion total (US$4.17B equity, US$2.78B debt), group share about US$2.127 billion, 55,000 wafers/month

Sources

Back to Map