Black Sesame Technologies · 黑芝麻智能科技有限公司

Fabless

Founded July 2016, also Hong Kong Stock Exchange-listed alongside Horizon Robotics, its closest domestic competitor in automotive AI chips.
Published

October 11, 2026

Chinese name: 黑芝麻智能科技有限公司 (Hēizhīma Zhìnéng Kējì Yǒuxiàn Gōngsī)

TipWhy This Matters

Founded July 2016, also Hong Kong Stock Exchange-listed alongside Horizon Robotics, its closest domestic competitor in automotive AI chips. H1 2026 revenue reached ¥458 million (+81.3% YoY, its fourth consecutive year of high YoY growth) with gross margin nearly doubling to 49.5% (gross profit +261.9% YoY) and chip shipments of more than 6 million units in the half — but net loss still widened slightly to ¥770 million, underscoring that revenue growth has not yet translated into profitability.

What does this firm design?

AI chips for self-driving cars and advanced driver assistance systems (ADAS), including image processing and perception algorithms. The 7nm, 250+ TOPS A2000 entered mass production in H2 2026 with first scale-order deliveries from September (design wins at Dongfeng, Yutong, Chery), positioned against the 1 July 2027 mandatory national ADAS standard; the Wudang C1200 cockpit-driving fusion chip is in production on Dongfeng’s Tianyuan platform. A 60% acquisition of edge-SoC maker 亿智电子 (Yizhi, standalone H1 2026 revenue ¥164.5 million, profitable) completed in September 2026 adds 0.5–2 TOPS low-power parts and a second curve in embodied AI (H1 embodied-AI revenue ¥47.2 million).

Key Facts

Category Fabless
Founded 2016
Location Wuhan, Hubei
Product Focus Automotive AI computing chips for self-driving and ADAS
Node Sophistication Not disclosed
Entity List No
Last Verified Newest source dated 03 Sep 2026 (4 sources)

Design Score

4/5

Sources

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