Ingenic Semiconductor · 北京君正集成电路股份有限公司

Fabless

The closest thing China has to a global automotive/industrial memory design house — 82.7% of revenue is overseas and ISSI qualifies with world carmakers, p…
Published

October 11, 2026

Chinese name: 北京君正集成电路股份有限公司 (Běijīng Jūnzhèng)

TipWhy This Matters

The closest thing China has to a global automotive/industrial memory design house — 82.7% of revenue is overseas and ISSI qualifies with world carmakers, precisely the niche US Dec-2024 rules tried to fence. The DRAM supercycle fully monetized in H1 2026 (interim, 28 August): revenue ¥39.57亿 (+76.0%) and net profit ¥11.98亿 (+489.6%), Q2 ¥23.97亿/¥8.79亿; storage line +90.1% to ¥26.32亿, compute +72.7%, gross margin 51.8%. DRAM contract re-pricing began Q1 and continued after July, with the company expecting tight supply until H2 2027 — but the 3D DRAM AI-bandwidth tape-out has slipped on the very capacity crunch it profits from. An A+H route opened: H-share application refiled 26 May 2026 with CSRC overseas-listing备案 received 24 June. FY2025 ¥47.41亿 (+12.5%).

What does this firm design?

Car-grade SRAM/DRAM/NOR/eMMC, RISC/MIPS AIoT-video SoCs, automotive LED drivers and LIN/CAN transceivers.

Key Facts

Category Fabless
Founded 2005
Location Beijing, Beijing Municipality
Product Focus Automotive/industrial memory via ISSI (¥29.11亿 of 2025 sales: SRAM world #2, niche DRAM, NOR/eMMC), MIPS/RISC-V AIoT & video SoCs, analog & car interconnect (LIN/CAN)
Node Sophistication DRAM ramping 20nm→18nm→16nm; LPDDR5 in development; 3D DRAM targeting 2026 tape-out; SoCs ~22nm-class
Entity List No
Last Verified Newest source dated 28 Aug 2026 (3 sources)

Design Score

4.5/5

Sources

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