Maxscend Microelectronics · 江苏卓胜微电子股份有限公司

Fabless

The boldest bet by a Chinese design house to conquer RF filters — the last big chokepoint held by Broadcom/Murata/Skyworks — and the financially punish-ing…
Published

October 11, 2026

Chinese name: 江苏卓胜微电子股份有限公司 (Zhuóshèngwēi)

TipWhy This Matters

The boldest bet by a Chinese design house to conquer RF filters — the last big chokepoint held by Broadcom/Murata/Skyworks — and the financially punish-ing one: FY2025 revenue ¥37.26亿 (-17.0%) with the company’s first-ever annual loss (¥-2.93亿), deepening to ¥-3.71亿 in H1 2026 (interim 25 Aug, on revenue +6.2%) as fab depreciation hit. The industrial payoff is arriving even as P&L suffers: the 6-inch SAW line runs at 15,000 wafers/month, the 12-inch RF platform at ~9,000 wafers/month SOI capacity (expandable within existing cleanroom), yield ‘first-tier’ per management, and the fully-domestic-supply-chain L-PAMiD entered large-scale batch shipment at multiple flagship-brand customers in H2 2026 — so much so that L-PAMiD shipment growth is the core KPI of the company’s 2026–28 equity incentive.

What does this firm design?

RF front-end chips and modules for smartphones/IoT, WiFi-7 and NTN satellite front-ends, plus 6G-stage research.

Key Facts

Category Fabless
Founded 2012
Location Wuxi, Jiangsu
Product Focus Smartphone RF front-end: switches, LNAs, DiFEM/L-DiFEM modules, SAW/MAX-SAW filters, L-PAMiD, WiFi/BLE, satellite NTN front-ends
Node Sophistication 12-inch silicon-based RF platform (switch/LNA, second-gen in volume); 6-inch TCSAW/MAX-SAW filter process; fully domestic-supply-chain L-PAMiD transmit module shipping to top brands — a Chinese first
Entity List No
Last Verified Newest source dated 26 Aug 2026 (2 sources)

Design Score

4.2/5

Sources

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