SemiDrive Technology · 南京芯驰半导体科技有限公司

Fabless

China’s most credible NXP/Renesas challenger — the only domestic firm with cockpit+gateway+ADAS SoC+ASIL-D MCU all in production — now #1 domestic cockpit-…
Published

October 11, 2026

Chinese name: 南京芯驰半导体科技有限公司 (Xīnchí Kējì)

TipWhy This Matters

China’s most credible NXP/Renesas challenger — the only domestic firm with cockpit+gateway+ADAS SoC+ASIL-D MCU all in production — now #1 domestic cockpit-SoC vendor (5th overall, 3.77%, ahead of HiSilicon per GGII 2025), with 12–14M+ units shipped and 2026 ‘Strategy 2.0’ extending automotive safety silicon to robots: at the September 2026 服贸会 forum it detailed the full stack — R1 ‘cerebrum’ SoC (ARMv9.2 + new NPU for on-device MLLM/VLA), D9-Max ‘cerebellum’ (EtherCAT ±5μs, dev kit shipping) and E3-R joint-control MCUs — claiming to be the only domestic vendor covering brain + small-brain + all motor-control MCU.

What does this firm design?

Cockpit/gateway/ADAS automotive SoCs (X9/G9/V9, X10 AI-cockpit at 80 TOPS with BAIC leading adoption), ASIL-D safety MCUs, robotics compute and motion-control chips.

Key Facts

Category Fabless
Founded 2018
Location Nanjing, Jiangsu
Product Focus Automotive compute across the E/E architecture: X9/X10 smart-cockpit SoCs, G9 central gateway (first ChinaSecurity-certified), V9 ADAS SoCs, E3-series ASIL-D MCUs (E3650 on 22nm)
Node Sophistication First 16nm automotive SoC in China; E3650 22nm in volume; X10 AI-cockpit node undisclosed
Entity List No
Last Verified Newest source dated 21 Sep 2026 (3 sources)

Design Score

4.5/5

Sources

Back to Design Tracker