UNISOC · 紫光展锐（上海）科技有限公司

Fabless

Part of Tsinghua Unigroup (the same state-linked group behind YMTC), formed from the 2018 merger of Spreadtrum Communications (founded 2001) and RDA Microe…
Published

October 11, 2026

Chinese name: 紫光展锐（上海）科技有限公司 (Zǐguāng Zhǎnruì (Shànghǎi) Kējì Yǒuxiàn Gōngsī)

TipWhy This Matters

Part of Tsinghua Unigroup (the same state-linked group behind YMTC), formed from the 2018 merger of Spreadtrum Communications (founded 2001) and RDA Microelectronics — one of the highest-volume mobile chipset vendors globally by unit shipments, concentrated in the mass market rather than flagship tier. The fourth-largest smartphone SoC vendor worldwide per Counterpoint, behind MediaTek, Qualcomm and Apple, with 12.1% share for full-year 2025 and 14% in Q1 2026; FY2025 revenue was ~¥20 billion (first time above that mark, up from ¥14.5 billion in 2024). IPO: sponsors 国泰海通+中信建投 filed the third tutoring-progress report in April 2026 (prospectus framework and filing drafts reportedly assembled), but as of 11 October 2026 no SSE acceptance or published prospectus had occurred.

What does this firm design?

Mobile SoCs and baseband chipsets for entry-level and mid-range smartphones, plus IoT and automotive chip lines — a global top-two player in sub-$99 smartphone silicon, with Transsion its largest customer. The 6nm T8300 (launched March 2025, benchmarking >510k) was its first SoC integrating 5G NR NTN satellite communications, first shipped in nubia’s Neo 3 gaming phones; 5G handsets on UNISOC silicon ship to 76+ countries.

Key Facts

Category Fabless
Founded 2001
Location Shanghai, Shanghai Municipality
Product Focus Mobile communication chipsets (mid-range and entry-level), IoT chipsets, automotive chipsets
Node Sophistication Mid-range mobile nodes; not confirmed at the most advanced nodes
Entity List No
Last Verified Newest source dated 10 Jun 2026 (5 sources)

Design Score

4/5

Sources

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