AMEC (Advanced Micro-Fabrication Equipment) · 中微半导体设备(上海)股份有限公司
Etch, Deposition (MOCVD)
Chinese name: 中微半导体设备(上海)股份有限公司 (Zhōngwēi Bàndǎotǐ Shèbèi (Shànghǎi) Gǔfèn Yǒuxiàn Gōngsī)
Founded by veteran semiconductor engineer Dr. Gerald Yin (尹志尧) in May 2004 — not on the US Entity List as of the sources checked for this tracker, notable given how central etch tools are to advanced-node manufacturing. H1 2026 revenue reached ¥6.691 billion (+34.9% year-on-year) with net profit of ¥2.825 billion, up roughly 300% year-on-year; the company reported several key etch processes for advanced logic and memory devices reaching mass production during the half, and a second Lingang, Shanghai facility was reportedly being planned.
What does this firm supply?
Plasma etching systems (Capacitively Coupled Plasma and Inductively Coupled Plasma, under the Primo brand) and MOCVD deposition tools used in compound semiconductor and LED manufacturing.
Key Facts
| Category | Equipment |
| Segment | Etch, Deposition (MOCVD) |
| Node Capability | Plasma etch tools (Primo CCP/ICP series) in use down to 5nm at some customers, per company statements |
| Founded | 2004 |
| HQ | Shanghai |
| Capacity | Not yet recorded |
| Entity List | No |
| Last Verified | Not recorded (newest source dated Sep 2026) |
Capability Trajectory
- 2021: Etch tools on tier-1 lines 65nm to 5nm; 12-inch etch used for key 5nm/sub-5nm steps
- 2021: 1,500th CCP etch reaction chamber shipped; products used at 5nm and below
- 2025: Advanced-logic MOL etch and memory ultra-high-aspect-ratio etch in volume; >6,800 etch chambers shipped
- 2025: LPCVD cumulative shipments pass 300 chambers; RP-epi tools at customers for qualification
- 2026: >8,800 reaction chambers in volume production on 220+ lines (all tool types)
Manufacturing Sites in China
- AMEC Lingang industrialisation base (phase I) (Shanghai (Lingang New Area)) — Plasma etch and thin-film deposition tools; ~157 mu, ~180,000 m2; opened Aug 2024
- AMEC Lingang industrialisation base (phase II, planned) (Shanghai (Lingang New Area)) — Etch, metrology/inspection and thin-film deposition tools; RMB 3.5bn planned investment; ~RMB 3bn annual revenue at full output
- AMEC Nanchang production and R&D base (Nanchang) — IC and broader semiconductor equipment production (products not specified); 140,000 m2, in use from July 2023
- AMEC Jinqiao (HQ) R&D and production base (Shanghai (Jinqiao, Pudong)) — R&D and production (products not specified)
- AMEC Chengdu R&D and production base (under construction) (Chengdu (High-tech Zone)) — Thin-film deposition (CVD, ALD) equipment; phase I ~70,000 m2; production planned 2027
- AMEC Guangzhou base (under construction) (Guangzhou) — R&D and production (details not disclosed)
Sources
- 中微公司荣获“杰出半导体设备奖” (科技日报) (30 Mar 2026)
- China’s Amec setting industry standard for chipmaking tech, founder says (28 Sep 2026)
- 中微公司上半年归母净利增长3倍 刻蚀设备新品取得重复订单 临港二期项目拟投建 (财联社) (28 Sep 2026)
- [News] China’s AMEC Reportedly Saw Plasma Etching Grow at 50% CAGR, Backs 5nm Without EUV (03 Jun 2025)
- 中微公司:公司 12 英寸高端刻蚀设备已应用于 5nm 芯片生产线 (06 Apr 2021)
- 中微公司:第 1500 个 CCP 刻蚀设备反应台顺利付运 (03 Nov 2021)
- 中微公司2025年营收123亿元创新高,净利润同增30.69%,薄膜设备成新增长点 | 财报见闻 (27 Feb 2026)
- 中微公司董事长尹志尧:已开发出 54 种高端半导体设备,刻蚀和薄膜设备的加工的精度已经达到了原子级水平 (02 Aug 2026)
- 中微临港产业化基地正式启用:到2035年要成第一流半导体设备公司 (02 Aug 2024)
- 中微公司上半年营收同比增长34.89%,净利润增300.22%,斥资35亿扩产能 | 财报见闻 (19 Aug 2026)
- 中微公司董事长尹志尧:到 2035 年在规模、产品竞争力上成为全球第一梯队的半导体设备公司 (01 Aug 2026)
- 中微公司成都研发及生产基地 暨西南总部项目正式开工 (17 Oct 2025)
- Federal Register Vol. 89 No. 234, Additions to the Entity List (2024-28267) (05 Dec 2024)
- 钛媒体 (林志佳) (19 Apr 2025)