National Silicon Industry Group (NSIG) · 沪硅产业集团股份有限公司

Wafers

China’s largest domestic semiconductor silicon wafer producer, founded December 2015 — announced a ¥13.2 billion ($1.82B) investment in 2024 to expand 300m…
Published

October 11, 2026

Chinese name: 沪硅产业集团股份有限公司 (Hù Guī Chǎnyè Jítuán Gǔfèn Yǒuxiàn Gōngsī)

TipWhy This Matters

China’s largest domestic semiconductor silicon wafer producer, founded December 2015 — announced a ¥13.2 billion ($1.82B) investment in 2024 to expand 300mm wafer capacity toward 1.2 million wafers per month, from 450,000/month at end-2023 (650,000 at end-2024, 850,000 at end-2025, per company filings). The expansion is ahead of its original pace: H1 2026 revenue grew 36.5% year-on-year with 300mm wafer shipment volume up over 90%, and combined Shanghai + Taiyuan 300mm capacity had already reached roughly 1 million wafers/month, with 1.2 million/month now targeted by end of 2026 rather than as a multi-year goal.

What does this firm supply?

300mm (12-inch) semiconductor-grade silicon wafers and SOI (silicon-on-insulator) substrates — the base material every fab in this tracker depends on, regardless of the fab’s own ownership category or node.

Key Facts

Category Wafer/Substrate
Segment Wafers
Node Capability 300mm silicon wafers; not applicable in the process-node sense used for logic fabs
Founded 2015
HQ Shanghai
Capacity 1,000,000 300mm wafers/month, as of 2026-06 — installed, Shanghai + Taiyuan combined; company targets 1.2m/month by end-2026
Entity List No
Last Verified Not recorded (newest source dated Aug 2026)

Capability Trajectory

  • 2018: Shanghai Xinsheng reaches volume production of 300mm wafers (first 300mm ingot pulled 2016)
  • 2023: 300mm wafer capacity reaches 450k wafers/month
  • 2024: 300mm wafer capacity 650k/month; 300mm SOI 80k wafers/year
  • 2025: 300mm wafer capacity 850k/month; 300mm SOI 160k wafers/year
  • 2026: Shanghai+Taiyuan 300mm capacity 1.0m/month; Taiyuan in bulk prime-wafer sales; SOI pilot line ~300k/yr

Manufacturing Sites in China

  • Shanghai Xinsheng (上海新昇) 300mm wafer fab (Shanghai) — 300mm polished/epi wafers; 2024 plan adds 400k/month slicing-grinding-polishing capacity (RMB 4.1bn)
  • Taiyuan Jinke (太原) 300mm wafer base (Taiyuan, Shanxi) — 300mm crystal pulling 600k/month and slicing-grinding-polishing 200k/month (incl. heavily doped), RMB 9.1bn; in customer qualification/ramp, bulk prime sales started
  • Simgui / Xin’ao (新傲) SOI and epi lines (Shanghai) — 200mm-and-below epi wafers, SOI; 300mm SOI pilot line (~300k/yr via 新傲芯翼)

Sources


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