CanSemi (Guangzhou) · 粤芯半导体技术股份有限公司

CanSemi Technology Inc. | Fab

Guangdong province’s first and only scaled 12-inch wafer fab — the province that consumes an estimated ~40% of China’s chips had no domestic 12-inch mass p…
Published

October 11, 2026

TipWhy This Matters

Guangdong province’s first and only scaled 12-inch wafer fab — the province that consumes an estimated ~40% of China’s chips had no domestic 12-inch mass production before CanSemi. Phases 1–3 are in production at ~63,300 wafers/month realized versus 80,000 planned (end-2025), with a third fab (Phase 3, ¥16.25 billion) online since December 2024 and a ¥25.2 billion Phase 4 (third site, 480,000 wafers/year mixed-signal) started January 2026.

Chinese name: 粤芯半导体技术股份有限公司 (Yuèxīn Bàndǎotǐ)

What does this facility make?

Analog/power-management, fingerprint-sensor, display-driver, CIS and power chips on 12-inch wafers — plus, uniquely among mainland foundries, mass-production 12-inch silicon-photonics wafers (90nm platform feeding 400G/800G/1.6T optical modules).

Why does it matter?

Its IPO cleared the ChiNext listing committee in June 2026 as the board’s first pre-profit wafer-fab listing under Standard 3, with CSRC registration approved 28 August 2026 — a template for funding loss-making specialty fabs with public markets. Prospectus coverage shows revenues of ¥1.044/1.681/2.582 billion (2023-2025) against net losses of ¥1.917/2.253/2.346 billion, with earliest guided profitability in 2029 — how capital-hungry the model is.

Key Facts

Company CanSemi Technology Inc.
Type Fab
Category State-Backed
Capability 12-inch (300mm) specialty analog/mixed-signal foundry, 180nm–55nm; PMIC, fingerprint, display driver, CIS, power, and silicon-photonics platforms
Status Operational
Capacity Not yet recorded
Investment Not disclosed
Funding Source Local Govt
Location Guangzhou, Guangdong
Current Node Not yet researched
Entity List No
Equipment Origin Not yet assessed
Last Verified Not recorded (newest source dated Aug 2026)

Technical Complexity

3.9/5

Technology Node Trajectory

Node history not yet researched.

Project Timeline

  • Sep 2019 — Phase 1 enters production, ~18 months after groundbreaking
  • Dec 2024 — Phase 3 (second fab, ¥16.25 billion, +40,000 wafers/month) line activated
  • Jan 2026 — Phase 4 (¥25.2 billion, 480,000 wafers/year mixed-signal, nodes roadmap to 65-22nm) formally started
  • Jun 2026 — ChiNext IPO approved by listing committee — first pre-profit wafer fab on the board
  • Aug 2026 — CSRC registration approval received for the IPO (planned raise ¥7.5 billion)

Sources

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