YOFC Advanced Semiconductor (Wuhan SiC IDM) · 长飞先进半导体（武汉）有限公司
YOFC Advanced Semiconductor | Compound Semiconductor
The big new 2025 entrant in Chinese SiC: a ¥20 billion Wuhan Optics Valley IDM base (contracted August 2023) that broke ground within two months and produced its first 6-inch automotive-grade SiC wafer on 28 May 2025 — 21 months, billed as China’s largest SiC device fab, ~30% of domestic wafer capacity at full rate. First-product yield was reported at 97%; ramp to 3,500 wafers/month was the stated end-2025 target.
Chinese name: 长飞先进半导体（武汉）有限公司 (Chángfēi Xiānjìn Bàndǎotǐ (Wǔhàn))
What does this facility make?
SiC MOSFET wafers (fully automated plant, ~80 line operators on four-shift rotation) and power modules for EV main drives — plus the Wuhu base’s 60,000 wafers/year.
Why does it matter?
A telecom-fiber company’s pivot (长飞光纤) into power semis via acquisition and greenfield scale — and after a >¥1 billion A+ round (February 2026, Jiangcheng Fund/Changjiang Industrial lead), management expects its SiC chips in customer vehicles from H2 2026 — the newest test of whether a late entrant can beat the SiC glut narrative.
Key Facts
| Company | YOFC Advanced Semiconductor |
| Type | Compound Semiconductor |
| Category | Private |
| Capability | 6-inch SiC IDM — full-line smart fab: 360,000 wafers/year + 360,000 epi + 61 million modules/year at phase-1 full ramp (with legacy Wuhu base: combined 420,000 wafers/year) |
| Status | Operational |
| Capacity | Not yet recorded |
| Investment | ¥200亿元 |
| Funding Source | Local Govt |
| Location | Wuhan, Hubei |
| Current Node | Not yet researched |
| Entity List | No |
| Equipment Origin | Not yet assessed |
| Last Verified | Not recorded (newest source dated Apr 2026) |
Technical Complexity
4/5
Technology Node Trajectory
Node history not yet researched.
Project Timeline
- Aug 2023 — Wuhan base project signed (total >¥20 billion, 498 mu)
- May 2025 — First 6-inch SiC wafer off the line — fab in mass-production line-out (量产通线)
- Feb 2026 — >¥1 billion A+ financing round completed; combined Wuhu+Wuhan capacity stated at 420,000 wafers/year
Sources
- 总投资200亿元！长飞先进碳化硅晶圆量产通线 (财联社/新浪财经) (29 May 2025)
- 长飞先进：获得超10亿融资，SiC产能达42万片/年 (行家说三代半) (23 Apr 2026)