CR Micro Shenzhen (Runpeng 12-inch Analog Line) · 润鹏半导体(深圳)有限公司

CR Microelectronics Ltd. (STAR: 688396) | Fab

Shenzhen’s second 12-inch wafer fab (after SMIC Shenzhen), part of Guangdong’s push to give the province a ‘third pole’ of chip manufacturing; ¥22 billion …
Published

October 11, 2026

TipWhy This Matters

Shenzhen’s second 12-inch wafer fab (after SMIC Shenzhen), part of Guangdong’s push to give the province a ‘third pole’ of chip manufacturing; ¥22 billion phase-1 total, with CR Micro contributing ¥2.475 billion cash into the ¥15 billion-capital Runpeng JV.

Chinese name: 润鹏半导体(深圳)有限公司 (Rùn Péng Bàndǎotǐ (Shēnzhèn))

What does this facility make?

12-inch analog/mixed-signal specialty wafers (power management, BCD, RF) for consumer, industrial and automotive customers.

Why does it matter?

Line activated 31 December 2024 and was reported at ~15,000 wafers/month by Q1 2026, targeting full 40,000/month by 2027 — a real-time case study of how long (2-3 years) a greenfield specialty 12-inch line actually takes to ramp.

Key Facts

Company CR Microelectronics Ltd. (STAR: 688396)
Type Fab
Category State-Backed
Capability 12-inch analog/mixed-signal specialty (BCD, high-voltage, RF, Flash), ≥40nm-class; 40,000 wafers/month planned
Status Operational
Capacity Not yet recorded
Investment ¥220亿元
Funding Source Local Govt
Location Shenzhen, Guangdong
Current Node Not yet researched
Entity List No
Equipment Origin Not yet assessed
Last Verified Not recorded (newest source dated Apr 2026)

Technical Complexity

2.9/5

Technology Node Trajectory

Node history not yet researched.

Project Timeline

  • Oct 2022 — Runpeng 12-inch line breaks ground in Bao’an ‘湾区芯城’ (¥22 billion phase 1)
  • Dec 2024 — Line activated (通线 ceremony)
  • Apr 2026 — Reported at ~15,000 wafers/month; 40,000/month targeted 2027

Sources


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