Hejian Chip Manufacturing Suzhou (UMC 8N) · 和舰芯片制造（苏州）股份有限公司
Hejian Technology (Suzhou) Co., Ltd. | Fab
UMC’s mainland 200mm fab (Fab 8N) — established 2001-11, production since May 2003, controlled by UMC since March 2013; a rare Taiwan-controlled fab operating on mainland soil, and still running at high utilization per UMC’s mid-2025 statements, raising prices with the 8-inch cycle in 2026. A planned STAR IPO (filed March 2019) was withdrawn July 2019 over control-chain questions; a frequently repeated ‘sold to a local group in 2018’ claim found NO supporting source and is not adopted here.
Chinese name: 和舰芯片制造（苏州）股份有限公司 (Héjiàn Xīnpiàn Zhìzào (Sūzhōu))
What does this facility make?
Mature-node analog/power/flash wafers on 200mm for UMC’s customer base from mainland China.
Why does it matter?
One of the few cross-strait manufacturing assets still intact as of 2026 — alongside UMC Xiamen (联芯) — its continued high utilization and 10-15% 2026 price actions show Taiwan’s mature-node operations remain commercially embedded in the mainland cluster.
Key Facts
| Company | Hejian Technology (Suzhou) Co., Ltd. |
| Type | Fab |
| Category | Foreign-Invested |
| Capability | 8-inch (200mm) foundry — 0.5µm–0.11µm (eFlash, BCD, CIS, high-voltage platforms); capacity ~64,000/month end-2018, 77,000/month planning basis |
| Status | Operational |
| Capacity | Not yet recorded |
| Investment | Not disclosed |
| Funding Source | Foreign |
| Location | Suzhou, Jiangsu |
| Current Node | Not yet researched |
| Entity List | No |
| Equipment Origin | Not yet assessed |
| Last Verified | Not recorded (newest source dated Jun 2025) |
Technical Complexity
2/5
Technology Node Trajectory
Node history not yet researched.
Project Timeline
- May 2003 — Suzhou Industrial Park 8-inch fab begins production
- Mar 2013 — UMC completes takeover of controlling stake in Hejian
- Jul 2019 — STAR Market IPO application withdrawn
Sources
- 和舰芯片科创板招股说明书（股权/制程/产能） (东方财富) (22 Mar 2019)
- 联电：和舰、联芯厂区保持高稼动 (新浪财经转全球半导体观察) (02 Jun 2025)