Hua Hong Wuxi Phase 3 · 华虹无锡三期

Hua Hong Semiconductor | Fab

Tracked separately from huahong-wuxi-fab9 (Fab9/Phase II, now operational) because this third phase (Fab 9B) is a distinct, separately-announced US$6.95 …
Published

October 11, 2026

TipWhy This Matters

Tracked separately from huahong-wuxi-fab9 (Fab9/Phase II, now operational) because this third phase (Fab 9B) is a distinct, separately-announced US$6.95 billion investment (of which Hua Hong group’s share is about $2.127 billion) with construction having started in March 2026 — Hua Hong’s expansion in Wuxi is an open-ended, multi-phase programme rather than a single project.

Chinese name: 华虹无锡三期 (Huáhóng Wúxī Sānqī)

What does this facility make?

Additional 12-inch (300mm) wafer capacity at mature specialty nodes, once complete.

Why does it matter?

Alongside Nexchip Phase 4 and SMIC Lingang Phase 2, this is one of several concurrent ‘next phase’ projects at sites this tracker had already marked Operational based on an earlier phase — the clearest illustration of why a single facility-level status field needs per-phase entries to stay accurate.

Key Facts

Company Hua Hong Semiconductor
Type Fab
Category State-Backed
Capability 12-inch (300mm) wafer foundry — third Wuxi phase
Status Under Construction
Capacity Planned: 55,000 wafers/month (300mm), as of 2027-12 — planned; line to be built and in production by Dec 2027 (company target)
Investment $6,950M
Funding Source Local Govt
Location Wuxi, Jiangsu
Current Node Not yet researched
Entity List No
Equipment Origin Not yet assessed
Last Verified Not recorded (newest source dated Sep 2026)

Technical Complexity

2.9/5

Technology Node Trajectory

Node history not yet researched.

Project Timeline

  • Mar 2026 — Construction begins on a third Wuxi phase
  • Sep 2026 — Hua Hong Semiconductor formally announces the Wuxi Phase 3 joint venture: US$6.95 billion total (US$4.17B equity, US$2.78B debt), group share about US$2.127 billion, 55,000 wafers/month

Sources

Back to Map