Huatian Technology Tianshui · 华天科技
Tianshui Huatian Technology Co., Ltd. | Assembly & Packaging
One of China’s three major OSAT firms alongside JCET and Tongfu, founded December 2003 with roots in a state-owned enterprise; its largest shareholder, Tianshui Huatian Electronic Group (天水华天电子集团), held 22.34% as of September 2025. Earnings accelerated sharply in 2026: H1 net profit came in at ¥813 million (+259% year-on-year) on revenue of ¥10.51 billion, which the company credited to advanced-packaging mix shift and M&A integration.
Chinese name: 华天科技 (Huátiān Kējì)
What does this facility make?
The Tianshui base mainly packages leadframe products (driver ICs, power management, Bluetooth, MCU, NOR flash), with a multi-chip (MCM/MCP) expansion completed at end-2024. Huatian’s company-wide portfolio is broader (SiP, flip-chip, TSV, bumping, fan-out, wafer/panel-level packaging, 2.5D/3D), but its wafer-level and TSV work is done at its Kunshan and Jiangsu sites, not Tianshui, according to an April 2026 investor-relations record.
Why does it matter?
Based in Gansu province — a notable geographic outlier among China’s semiconductor firms, most of which cluster in the Yangtze River Delta (Jiangsu/Shanghai) or Pearl River Delta (Guangdong) regions. Its 2026 earnings jump, alongside JCET’s and Tongfu’s, points to a sector-wide advanced-packaging upcycle among China’s three major OSATs rather than a single-company story.
Key Facts
| Company | Tianshui Huatian Technology Co., Ltd. |
| Type | Assembly & Packaging |
| Category | State-Backed |
| Capability | OSAT — Tianshui base: mainly leadframe packaging, plus MCM/MCP multi-chip lines (wafer-level work is at Kunshan/Jiangsu) |
| Status | Operational |
| Capacity | 150,000,000 units/month, as of 2024-12 — design capacity ADDED by the Tianshui MCM(MCP) project only (18亿只/yr / 12 = 150M units/month), completed end-2024; not total Tianshui site output |
| Investment | Not disclosed |
| Funding Source | Not disclosed |
| Location | Tianshui, Gansu |
| Current Node | Not applicable (assembly & test) |
| Entity List | No |
| Equipment Origin | Not yet assessed |
| Last Verified | Not recorded (newest source dated Aug 2026) |
Technical Complexity
2.5/5
Packaging Technology Trajectory
- 2024: Tianshui: MCM/MCP multi-chip packaging expansion completed (18亿只/yr design)
Project Timeline
- Dec 2003 — Founded as Tianshui Huatian Technology Co., Ltd.
- Jul 2026 — Guides H1 2026 net profit to ¥750-850 million, up 231-275% year-on-year
Sources
- 天水华天科技股份有限公司关于本次交易停牌前一个交易日前十大股东和前十大流通股股东持股情况的公告 (17 Oct 2025)
- 华天科技：预计上半年净利润同比增长231%-275% (财联社) (13 Jul 2026)
- 天水华天科技股份有限公司非公开发行A股股票募集资金运用的可行性报告 (20 Jan 2021)
- 天风证券关于天水华天科技股份有限公司2024年度募集资金存放与使用情况的核查意见 (01 Apr 2025)
- 华天科技：4月10日接受机构调研，中粮资本参与 (10 Apr 2026)
- 华天科技:上半年净利润同比增长259% 存储器封装等业务规模扩大 (同花顺/财闻) (21 Aug 2026)