Hunan Sanan Semiconductor (Changsha SiC IDM) · 湖南三安半导体有限责任公司

Sanan Optoelectronics Co., Ltd. (600703.SH) | Compound Semiconductor

China’s first vertically integrated SiC production chain (first line lit June 2021) and the country’s largest self-contained SiC IDM platform, at ¥16 billi…
Published

October 11, 2026

TipWhy This Matters

China’s first vertically integrated SiC production chain (first line lit June 2021) and the country’s largest self-contained SiC IDM platform, at ¥16 billion planned; by the May 2026 shareholders meeting the 6-inch line was running 16,000 wafers/month at ~85% yield with high utilization, and the in-house 8-inch SiC chip line — line-out August 2025, built in under a year — was reported fully activated.

Chinese name: 湖南三安半导体有限责任公司 (Húnán Sān’ān Bàndǎotǐ)

What does this facility make?

6/8-inch SiC MOSFET/SBD devices and modules for EVs, PV and storage (customers include Sungrow and major OEMs), plus GaN-on-Si power wafers.

Why does it matter?

Parent Sanan Optoelectronics posted its first annual loss for 2025 with SiC depreciation as a named drag while pushing for SiC profitability in 2026 — the clearest single-company view of China’s painful SiC cost-down race. Governance flag: GM Lin Kechuang (also chairman of the ST JV 安意法) was reported detained May 2026 and released around October 2026.

Key Facts

Company Sanan Optoelectronics Co., Ltd. (600703.SH)
Type Compound Semiconductor
Category Private
Capability Full-chain SiC IDM (substrate→epi→device→module), 6-inch at 16,000 wafers/month + 8-inch SiC chip line (fully activated 2025-2026); GaN-on-Si 2,000 wafers/month
Status Operational
Capacity Not yet recorded
Investment ¥160亿元
Funding Source Private
Location Changsha, Hunan
Current Node Not yet researched
Entity List No
Equipment Origin Not yet assessed
Last Verified Not recorded (newest source dated May 2026)

Technical Complexity

4/5

Technology Node Trajectory

Node history not yet researched.

Project Timeline

  • Jun 2021 — First SiC line lit — billed as China’s first vertically integrated SiC chain (plan 30,000 6-inch wafers/month)
  • Nov 2022 — ¥3.8 billion multi-year supply agreement with an EV OEM (行家说 coverage)
  • Aug 2025 — Own 8-inch SiC chip line announced line-out (通线)
  • May 2026 — Annual meeting: 6-inch at 16,000 wafers/month, 8-inch line fully activated; SiC profitability targeted for 2026

Sources

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