Intel Chengdu · 英特尔产品（成都）有限公司
Intel Corporation | Assembly & Packaging
Intel’s remaining manufacturing presence in China, after fully divesting its only China wafer fab (the Dalian NAND plant) to SK Hynix. Chengdu is an assembly-and-test (ATP) site, not a fab — it packages and tests chips rather than fabricating wafers. Intel had invested $600 million in the site by December 2014, when it announced a further $1.6 billion over 15 years; in 2024 it added $300 million in registered capital to expand server-chip packaging and test.
Chinese name: 英特尔产品（成都）有限公司 (Yīngtè’ěr Chǎnpǐn (Chéngdū) Yǒuxiàn Gōngsī)
What does this facility make?
Chip assembly and test services for Intel products — the step between finished wafers and sellable packaged chips, not wafer fabrication.
Why does it matter?
With Dalian fully transferred to SK Hynix, Chengdu’s ATP operation is the clearest marker of what ‘Intel in China’ now means: assembly and test only, no fab. Included here to avoid the common misconception (prompted by Intel’s historical Dalian fab) that Intel still operates a wafer fab in China.
Key Facts
| Company | Intel Corporation |
| Type | Assembly & Packaging |
| Category | Foreign-Invested |
| Capability | Chip assembly and test (ATP) — not a wafer fab |
| Status | Operational |
| Capacity | Not yet recorded |
| Investment | $600M |
| Funding Source | Foreign |
| Location | Chengdu, Sichuan |
| Current Node | Not applicable (assembly & test) |
| Entity List | No |
| Equipment Origin | Not yet assessed |
| Last Verified | Not recorded (newest source dated Sep 2026) |
Technical Complexity
1.5/5
Packaging Technology Trajectory
- 2005: Assembly & test (client CPUs) begins operation
- 2016: Intel Advanced Test Technology in mass production (planned H2 2016)
- 2024: Server-chip packaging & test added (announced; US$300M capital increase)
- 2026: Wafer pre-processing + advanced packaging + test (stated, as of)
Project Timeline
- Sep 2026 — Becomes Intel’s sole remaining manufacturing site in China once the Dalian fab’s transfer to SK Hynix is finalized
Sources
- Intel’s old NAND plant in China is now officially registered as SK hynix after US imposes new sanctions that limit fab upgrades in China (Tom’s Hardware) (28 Sep 2026)
- Intel to invest $1.6 billion in China plant to push mobile chip development (04 Dec 2014)
- 世界500强企业宣布扩容成都封装测试基地 (28 Oct 2024)
- 英特尔中国区董事长王稚聪：正依托成都工厂建设先进制造人工智能实践中心 (21 Jul 2026)
- 英特尔成都封装测试基地扩容 (IT之家) (28 Oct 2024)