JCET Jiangyin · 长电科技
JCET Group | Assembly & Packaging
China’s largest OSAT (Outsourced Semiconductor Assembly and Test) company and the world’s third-largest — founded in 1972, and controlled since November 2024 by China Resources (Holdings), which holds a 22.53% stake through its subsidiary Panshi Runqi and controls a board majority. Not found on the US Entity List in the sources checked for this tracker, despite advanced packaging increasingly being discussed as a future export-control target. H1 2026 non-GAAP net profit grew 84.7% year-on-year as advanced-packaging orders accelerated.
Chinese name: 长电科技 (Chángdiàn Kējì)
What does this facility make?
Chip assembly, test, and advanced packaging services — not a fab, but the step between a finished wafer and a sellable chip. Demonstrated high-volume packaging of 4nm-class chips using chiplet technology.
Why does it matter?
Advanced packaging (chiplets, heterogeneous integration) is one of the segments China’s Big Fund III and its OSAT majors are explicitly pivoting toward, since it offers a path to competitive chip performance without needing export-controlled leading-edge lithography. By 2026 the company says its entire production line has moved upmarket to five top-tier processes: XDFOI multi-dimensional heterogeneous integration, 1.5-micron ultra-fine hybrid bonding, 3D logic folding, HBM (high-bandwidth memory) packaging, and CPO (co-packaged optics).
Key Facts
| Company | JCET Group |
| Type | Assembly & Packaging |
| Category | State-Backed |
| Capability | OSAT (assembly, test, and advanced packaging) — flip-chip, SiP, and chiplet-based heterogeneous integration; high-volume 4nm-class chiplet packaging demonstrated |
| Status | Operational |
| Capacity | Not yet recorded |
| Investment | Not disclosed |
| Funding Source | Not disclosed |
| Location | Jiangyin, Jiangsu |
| Current Node | Not applicable (assembly & test) |
| Entity List | No |
| Equipment Origin | Not yet assessed |
| Last Verified | Not recorded (newest source dated Sep 2026) |
Technical Complexity
2.5/5
Packaging Technology Trajectory
- 2013: company-wide: Bumping (8-12in), WLCSP, FCBGA/FCLGA flip-chip in volume
- 2016: Jiangyin (JCET Advanced Packaging): Bumping and WLCSP at global scale
- 2023: company-wide: XDFOI chiplet (2.5D/3D fan-out) stable volume; 4nm MCM ship
Project Timeline
- Aug 2015 — Acquires Singapore’s STATS ChipPAC, becoming one of the world’s top-three OSAT firms by revenue
- Jul 2026 — Reports H1 2026 non-GAAP net profit up 84.7% year-on-year, crediting advanced-packaging (chiplet, HBM, CPO) order growth
Sources
- 2025年度江苏长电科技股份有限公司信用评级报告 (中诚信国际) (20 Aug 2025)
- China’s leading OSAT company JCET Group achieves high-volume packaging of 4-nanometer chips by leveraging Chiplet technology (28 Sep 2026)
- A股封测龙头长电科技上半年盈利增速远超收入 头部厂商扩产提速|财报解读 (财联社) (21 Aug 2026)
- 江苏长电科技股份有限公司2013年度非公开发行A股股票募集资金使用的可行性分析报告 (27 Nov 2013)
- 江苏长电科技股份有限公司2017年度非公开发行A股股票募集资金使用可行性分析报告（二次修订稿） (13 Mar 2018)
- Chinese leading packaging company JCET starts mass production of its unique XDFOI Chiplet series (09 Jan 2023)