JHICC (Fujian Jinhua) · 晋华集成电路
Fujian Jinhua Integrated Circuit Co., Ltd. (JHICC) | Memory
The starkest case of a US export-control action landing directly on a named facility: added to the Entity List in October 2018 amid a Micron trade-secret theft dispute involving JHICC and Taiwan’s UMC, just as its DRAM line was nearing production.
Chinese name: 晋华集成电路 (Jìnhuá Jíchéng Diànlù)
What does this facility make?
DRAM chips on 12-inch (300mm) wafers, planned capacity of 60,000 wafers/month.
Why does it matter?
Widely reported as crippled by the 2018 ban in the years immediately after — a criminal case against JHICC and UMC followed, later resolved without a conviction against JHICC. 2026 Chinese-language industry coverage reconciles the earlier conflicting reports: the fab survived and stabilized at roughly 40,000 wafers/month with an expansion toward 60,000/month underway in 2026, but the five-year setback cost it competitive position — domestic rankings place it around 5th among Chinese memory makers, and coverage describes it as having fallen out of the global DRAM core supply chain entirely. Survival without competitiveness is the more precise read than either the original ‘crippled’ framing or an assumption of a clean recovery.
Key Facts
| Company | Fujian Jinhua Integrated Circuit Co., Ltd. (JHICC) |
| Type | Memory |
| Category | State-Backed |
| Capability | DRAM, 12-inch (300mm) wafers |
| Status | Operational |
| Capacity | 50,000 wafers/month (300mm), as of 2026-07 — installed (current), per 財訊快報 via TechNews; site plan expandable to 100,000 |
| Investment | ¥370亿元 |
| Funding Source | Local Govt |
| Location | Jinjiang, Fujian |
| Current Node | 25nm DDR4 8Gb (in shipping product; teardown date, not mass-prod start) |
| Entity List | Yes — US Commerce BIS (30 Oct 2018) |
| Equipment Origin | Not yet assessed |
| Last Verified | Not recorded (newest source dated Sep 2026) |
Technical Complexity
3.5/5
Technology Node Trajectory
- 2025: 25nm DDR4 8Gb (in shipping product; teardown date, not mass-prod start)
Project Timeline
- Oct 2018 — Added to the US Commerce Department’s Entity List amid Micron trade-secret allegations
- Nov 2018 — US Attorney’s Office files criminal complaint against JHICC and UMC for conspiracy to steal Micron trade secrets
- Jan 2026 — Capacity expansion toward 60,000 wafers/month underway, per 2026 domestic industry coverage
Sources
- Addition of Fujian Jinhua Integrated Circuit Company, Ltd (Jinhua) to the Entity List — US Department of Commerce (30 Oct 2018)
- 370亿建厂，量产前夜被美国’锁死’：福建晋华的血泪十年，给国产芯片留下了什么？ (Zhihu) (28 Sep 2026)
- Fujian Jinhua Integrated Circuit (Wikipedia) (28 Sep 2026)
- 華為跨足 DRAM 製造！借力福建晉華技術，攜昇維旭、地方政府拚供應鏈自主 (14 Jul 2026)
- JHICC CA4S8G16V 25nm 8Gb DDR4 DRAM Array Process Analysis (25 Nov 2025)