GTA Semiconductor (Shanghai Lingang) · 上海积塔半导体有限公司

Shanghai Jita Integrated Technology Service Co., Ltd. (GTA Semi) | Fab

CEC’s (China Electronics Corporation) manufacturing anchor and China’s flagship state-owned car-grade specialty foundry — a ¥35.9 billion Lingang complex (…
Published

October 11, 2026

TipWhy This Matters

CEC’s (China Electronics Corporation) manufacturing anchor and China’s flagship state-owned car-grade specialty foundry — a ¥35.9 billion Lingang complex (groundbreaking August 2018) merged with the legacy Shanghai Advanced (SAS) semiconductor plant, plus an ¥8 billion November 2021 strategic round featuring automaker (SAIC), industrial (Inovance) and Xiaomi supply-chain investors.

Chinese name: 上海积塔半导体有限公司 (Shànghǎi Jītǎ Bàndǎotǐ Yǒuxiàn Gōngsī)

What does this facility make?

Automotive/industrial MCU, BCD analog/PMIC, IGBT/MOSFET and sensor wafers; company capacity pages report 8-inch output above 1.3 million wafers/year, with the 12-inch line (planned ~500,000 wafers/year at full capacity) still marked under construction/ramping.

Why does it matter?

One of the very few dedicated car-grade 12-inch lines in China and one of the few domestic SiC (6-inch) and FeRAM/eNVM capability holders — a key supply node if China’s domestic car-MCU push continues; still private (named a national ‘unicorn’ in 2026); no verified IPO filing as of this pass.

Key Facts

Company Shanghai Jita Integrated Technology Service Co., Ltd. (GTA Semi)
Type Fab
Category State-Backed
Capability Car-grade specialty foundry — 8-inch (IGBT, MOSFET, BCD, eNVM/MCU), 12-inch (90-40nm auto MCU/analog/PMIC, line activated 2023, ramping), 6-inch SiC, plus legacy 5/6-inch lines
Status Operational
Capacity Not yet recorded
Investment ¥359亿元
Funding Source Local Govt
Location Shanghai, Shanghai Municipality
Current Node Not yet researched
Entity List No
Equipment Origin Not yet assessed
Last Verified Not recorded (newest source dated Oct 2026)

Technical Complexity

3.9/5

Technology Node Trajectory

Node history not yet researched.

Project Timeline

  • Aug 2018 — ¥35.9 billion Lingang specialty-process line breaks ground; merger with legacy Shanghai Advanced Semiconductor agreed
  • Nov 2021 — ¥8 billion strategic financing completed, led by Huada Semiconductor (CEC)
  • Jun 2023 — 12-inch line activated (tool line-out)
  • Dec 2025 — Wins ‘Influential SiC Wafer Manufacturing Service’ at the行家极光 awards

Sources


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