Nexchip Hefei Phase 4 · 晶合集成四期

Nexchip Semiconductor Corporation | Fab

Tracked separately from the main nexchip-hefei entry (which covers existing operational capacity) because this fourth phase is a distinct, large, separat…
Published

October 11, 2026

TipWhy This Matters

Tracked separately from the main nexchip-hefei entry (which covers existing operational capacity) because this fourth phase is a distinct, large, separately-financed expansion — ¥35.5 billion for a new 55,000 wafer/month line — launched in January 2026.

Chinese name: 晶合集成四期 (Jīnghé Jíchéng Sìqī)

What does this facility make?

Additional 12-inch (300mm) wafer foundry capacity once complete.

Why does it matter?

Full capacity is targeted for end of 2028, a multi-year construction horizon typical of the current wave of China fab expansions — a reminder that ‘under construction’ projects in this sector often run 2-3 years from groundbreaking to full ramp, not months.

Key Facts

Company Nexchip Semiconductor Corporation
Type Fab
Category JV
Capability 12-inch (300mm) wafer foundry — fourth-phase expansion
Status Under Construction
Capacity Not yet recorded
Investment ¥355亿元
Funding Source Local Govt
Location Hefei, Anhui
Current Node Not yet researched
Entity List No
Equipment Origin Not yet assessed
Last Verified Not recorded (newest source dated Sep 2026)

Technical Complexity

2.9/5

Technology Node Trajectory

Node history not yet researched.

Project Timeline

  • Jan 2026 — Phase 4 launched: ¥35.5 billion investment in a new 55,000 wafer/month 12-inch line

Sources

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