NOEIC — National Optoelectronics Information Innovation Center · 武汉光谷信息光电子创新中心有限公司（国家信息光电子创新中心）
National Optoelectronics Information Innovation Center (Wuhan) | Research Fab
A national manufacturing-innovation center approved by MIIT (October 2017), led by Accelink under CICT; its 12-inch silicon-photonics tape-out platform commissioned in Optics Valley in November 2025 — running on a fully domestic toolset (announced September 2025) with a commercial-grade 40nm PDK — makes it the only national-level platform for domesticized optoelectronic chip wafer R&D.
Chinese name: 武汉光谷信息光电子创新中心有限公司（国家信息光电子创新中心） (Guójiā Xìnxī Guāngdiànzǐ Chuàngxīn Zhōngxīn)
What does this facility make?
Optical-communication and opto-AI chips on 200/300mm wafers: demo silicon-photonic interconnect chips (1.6T, 2T chiplet), 170GHz thin-film-lithium-niobate modulator (March 2026), MPW shuttle services for 300+ organizations.
Why does it matter?
Silicon photonics is China’s most credible ‘bypass’ strategy for AI-interconnect bottlenecks; Hubei’s stated 2030 target is a global-top-3 12-inch SiPh specialty line. This platform de-risks that flow from overseas fabs.
Key Facts
| Company | National Optoelectronics Information Innovation Center (Wuhan) |
| Type | Research Fab |
| Category | State-Backed |
| Capability | III-V (InP/GaAs) optoelectronic process platform + silicon photonics; Nov 2025: China’s first fully-domesticated 12-inch 40nm CMOS-based SiPh PDK/TDK/ADK tape-out platform (MPW shuttles) |
| Status | Operational |
| Capacity | Not yet recorded |
| Investment | Not disclosed |
| Funding Source | Local Govt |
| Location | Wuhan, Hubei |
| Current Node | Not yet researched |
| Entity List | No |
| Equipment Origin | Not yet assessed |
| Last Verified | Not recorded (newest source dated Nov 2025) |
Technical Complexity
3.6/5
Technology Node Trajectory
Node history not yet researched.
Project Timeline
- Oct 2017 — MIIT approves the national manufacturing innovation center (挂牌 April 2018)
- Sep 2025 — First fully-domesticized silicon-photonics ‘toolkit’ (PDK/TDK/ADK) released
- Nov 2025 — 12-inch SiPh tape-out platform commissioned in Optics Valley
- May 2026 — Selected into MIIT’s second-batch national key pilot-platform list
Sources
- 光谷12寸硅光芯片流片平台投用 (中国光谷) (11 Nov 2025)
- 首套全国产化硅光芯片’工具箱’发布 (湖北省经信厅) (29 Sep 2025)