Silan Microelectronics Xiamen Cluster (Jike/Mingjia) · 厦门士兰集科微电子有限公司 / 厦门士兰明镓化合物半导体有限公司

Hangzhou Silan Microelectronics Co., Ltd. (600460.SH) | Fab

The Xiamen campus of Silan — China’s flagship private power-semi IDM — stacks a 12-inch silicon power fab (¥7 billion first line, in production since Decem…
Published

October 11, 2026

TipWhy This Matters

The Xiamen campus of Silan — China’s flagship private power-semi IDM — stacks a 12-inch silicon power fab (¥7 billion first line, in production since December 2020, 2025 output 637,400 wafers) alongside a 6-inch SiC line; two further lines are now in motion at the same campus: the ¥12 billion 8-inch SiC fab (士兰集宏) and ¥20 billion 12-inch high-end analog fab (士兰集华). Investment figure tracked here is the Jike 12-inch project total (¥7bn phase 1 + ¥5bn/¥2bn expansions ≈¥15bn of the ¥17bn two-line plan); the newer phases are covered in milestones.

Chinese name: 厦门士兰集科微电子有限公司 / 厦门士兰明镓化合物半导体有限公司 (Shìmén Shìlán Jíkē / Míngjiā)

What does this facility make?

IGBT/MOSFET power chips for EV main drives, PV and industrial IPM modules; SiC devices; MEMS sensors.

Why does it matter?

IPM modules exceeding 250 million units shipped in 2025 (+47%) show a Chinese IDM supplying white goods and cars from wafer up; the January 2026 dual event (集宏 8-inch SiC line-out ceremony + 集华 12-inch analog groundbreaking, reported as China’s first fully self-IP 8-inch SiC power line) extends the same campus into the two most strategic specialty segments.

Key Facts

Company Hangzhou Silan Microelectronics Co., Ltd. (600460.SH)
Type Fab
Category JV
Capability 12-inch power/IGBT/MEMS line (士兰集科, 90nm, design 80,000 wafers/month across two phases) + 6-inch SiC/compound line (士兰明镓, 10,000 wafers/month)
Status Operational
Capacity Not yet recorded
Investment ¥150亿元
Funding Source Local Govt
Location Xiamen, Fujian
Current Node Not yet researched
Entity List No
Equipment Origin Not yet assessed
Last Verified Not recorded (newest source dated Jan 2026)

Technical Complexity

2.9/5

Technology Node Trajectory

Node history not yet researched.

Project Timeline

  • Dec 2020 — Jike 12-inch power line formally enters production (90nm, phase 1 40,000 wafers/month)
  • May 2024 — ¥12 billion 8-inch SiC project (士兰集宏) signed with Xiamen city
  • Oct 2025 — ¥20 billion 12-inch high-end analog project (士兰集华) signed (phase 1 ¥10 billion, 45,000 wafers/month planned)
  • Jan 2026 — 集宏 8-inch SiC line-out ceremony (trial production since Nov 2025) + 集华 12-inch groundbreaking, same day

Sources

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