SMIC Shanghai (Lingang) Phase 2 · 中芯临港二期

SMIC | Fab

Tracked as a separate entry from smic-lingang (which covers the operational Phase 1, 20,000 wafers/month) because Phase 2 is a distinct, actively-under-c…
Published

October 11, 2026

TipWhy This Matters

Tracked as a separate entry from smic-lingang (which covers the operational Phase 1, 20,000 wafers/month) because Phase 2 is a distinct, actively-under-construction expansion with its own timeline — collapsing both into a single ‘Operational’ status would have hidden the fact that this site is still a live construction project, not a finished one.

Chinese name: 中芯临港二期 (Zhōngxīn Língǎng Èrqī)

What does this facility make?

Additional 12-inch (300mm) wafer capacity at 28nm and below, once complete.

Why does it matter?

One of several cases in this tracker where a facility’s original phase is producing chips today while a large, separately-timed expansion is simultaneously under construction at the same site — a pattern that a single facility-level status field tends to obscure unless each phase gets its own entry.

Key Facts

Company SMIC
Type Fab
Category JV
Capability 12-inch (300mm) wafer foundry, 28nm and below — second-phase expansion of the Lingang site
Status Under Construction
Capacity Not yet recorded
Investment Not disclosed
Funding Source Local Govt
Location Shanghai, Shanghai Municipality
Current Node Not yet researched
Entity List Yes — US Commerce BIS (18 Dec 2020)
Equipment Origin Not yet assessed
Last Verified Not recorded (newest source dated Jul 2026)

Technical Complexity

3.9/5

Technology Node Trajectory

Node history not yet researched.

Project Timeline

  • Jul 2026 — China Construction Eighth Engineering Bureau wins the general contract for the Fab9-P3 building and Fab9-P4 foundation works
  • Sep 2026 — Construction of Phase 2 reported as formally starting, targeting delivery by end of 2027

Sources

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