SMIC Shanghai (Lingang) · 中芯临港

SMIC | Fab

SMIC’s largest single fab commitment — a $8.87B (reported domestically as over ¥50 billion total investment), 100,000 wafer/month 28nm-and-below joint vent…
Published

October 11, 2026

TipWhy This Matters

SMIC’s largest single fab commitment — a $8.87B (reported domestically as over ¥50 billion total investment), 100,000 wafer/month 28nm-and-below joint venture with the Shanghai municipal government in the Lingang Special Area, formally incorporated as Zhongxin Dongfang Integrated Circuit Manufacturing Co. (中芯东方集成电路制造有限公司).

Chinese name: 中芯临港 (Zhōngxīn Língǎng)

What does this facility make?

12-inch (300mm) wafers at 28nm and more mature process nodes for foundry customers.

Why does it matter?

Part of SMIC’s 2020-2022 wave of four mega-fab JVs (Shanghai, Beijing, Tianjin, Shenzhen) aimed at building mature-node capacity for domestic demand, launched in the same window SMIC itself was added to the US Entity List. This entry covers the operational Phase 1 (20,000 wafers/month, running since late 2024) specifically — the site’s actively-under-construction Phase 2 expansion is tracked as its own entry, smic-lingang-phase2, so this one’s ‘Operational’ status isn’t read as covering the whole site.

Key Facts

Company SMIC
Type Fab
Category JV
Capability 12-inch (300mm) wafer foundry, 28nm and above (per SMIC filings: 28纳米及以上)
Status Operational
Capacity Planned: 100,000 wafers/month (300mm), as of 2021-09 — planned full build per JV framework agreement; not installed; no installed figure disclosed
Investment ¥500亿元 / $8,870M
Funding Source Local Govt
Location Shanghai, Shanghai Municipality
Current Node Not yet researched
Entity List Yes — US Commerce BIS (18 Dec 2020)
Equipment Origin Not yet assessed
Last Verified Not recorded (newest source dated Sep 2026)

Technical Complexity

3.9/5

Technology Node Trajectory

Node history not yet researched.

Project Timeline

  • Sep 2021 — SMIC signs cooperation agreement with the Shanghai Lingang Management Committee for a $8.87 billion, 100,000 wafer/month 12-inch fab; registered capital $5.5 billion, SMIC holding no less than 51%
  • Nov 2021 — Joint venture formally incorporated as Zhongxin Dongfang Integrated Circuit Manufacturing Co. (中芯东方集成电路制造有限公司)
  • Dec 2024 — Phase 1 (20,000 wafers/month) reaches production
  • Jul 2026 — China Construction Eighth Engineering Bureau (中建八局) wins the Phase 2 general contract for the Fab9-P3 building and Fab9-P4 foundation works in the project’s northern district

Sources

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