SMIC South (SPCL) Shanghai — Zhangjiang SN1/SN2 · 中芯南方集成电路制造有限公司

SMIC | Fab

The facility this tracker’s own About page flagged as its highest-priority missing entry: SMIC’s primary advanced-node fab in Zhangjiang — the JV (establis…
Published

October 11, 2026

TipWhy This Matters

The facility this tracker’s own About page flagged as its highest-priority missing entry: SMIC’s primary advanced-node fab in Zhangjiang — the JV (established 1 December 2016, SMIC holding 41.56% after the December 2025 capital increase took registered capital from $6.5B to $10.077B) that operates SN1, the only confirmed 7nm-class (N+2/N+3) production line in China and the fab behind the Kirin 9000S/9030 story. Unlike the 28nm-era JVs in this tracker, its exposure is not mature-node competition with the West but the export-control frontier itself: EUV is banned, and it produces leading-edge-adjacent logic on DUV multi-patterning.

Chinese name: 中芯南方集成电路制造有限公司 (Zhōngxīn Nánfāng Jíchéng Diànlù Zhìzào Yǒuxiàn Gōngsī)

What does this facility make?

12-inch FinFET wafers at 14nm and below for Huawei (Kirin SoCs) and, per unverified self-media claims only, other domestic advanced customers; SN2 doubles as an equipment/tool-verification line for domestic toolmakers.

Why does it matter?

Capacity figures here are the most contested numbers in the tracker: official filings give registered capital but not output, and media claims of ~35k wafers/month N+2 rising to ~70k in 2026 (and Huawei taking a fixed share) come from self-media sources and are explicitly NOT verified by this tracker. What is confirmed by primary/research sources: the December 2025 capital increase with Big Fund III taking an 8.361% stake, and TechInsights’ confirmation of N+3 production in the Kirin 9030 (December 2025).

Key Facts

Company SMIC
Type Fab
Category JV
Capability 12-inch (300mm) FinFET — SN1 line at 14nm and N+1/N+2/N+3 (7nm-class, unconfirmed officially); SN2 equipment-verification and advanced R&D line; Fab8-P1a legacy 300mm converted to photomask production
Status Operational
Capacity Not yet recorded
Investment Not disclosed
Funding Source Big Fund I
Location Shanghai, Shanghai Municipality
Current Node N+3 — Kirin 9030 class (TechInsights, Dec 2025)
Entity List Yes — US Commerce BIS (18 Dec 2020)
Equipment Origin Not yet assessed
Last Verified Not recorded (newest source dated Jan 2026)

Technical Complexity

5/5

Technology Node Trajectory

  • 2020: 14nm FinFET (SN1)
  • 2023: N+2 — Kirin 9000S class (TechInsights teardown)
  • 2025: N+3 — Kirin 9030 class (TechInsights, Dec 2025)

Project Timeline

  • Dec 2016 — SMIC South (中芯南方) established as SMIC–Big Fund–Shanghai fund JV in Zhangjiang
  • Sep 2019 — First FinFET lithography tool installed; SN1 targeted at 35,000 wafers/month
  • Dec 2025 — Capital increase completed: registered capital $6.5B → $10.077B; Big Fund III appears as 8.361% shareholder; SMIC retains control at 41.56%

Sources

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