SMIC Tianjin (former Motorola 8-inch) · 中芯国际集成电路制造（天津）有限公司

SMIC | Fab

SMIC acquired Motorola’s Tianjin fab in 2003 (entity registered 3 November 2003) — one of the earliest foreign fab assets absorbed into China’s domestic fo…
Published

October 11, 2026

TipWhy This Matters

SMIC acquired Motorola’s Tianjin fab in 2003 (entity registered 3 November 2003) — one of the earliest foreign fab assets absorbed into China’s domestic foundry base, and the mature-node counterpart to the new 中芯西青 12-inch JV in the same municipality.

Chinese name: 中芯国际集成电路制造（天津）有限公司 (Zhōngxīn Tiānjīn)

What does this facility make?

200mm mature logic/power wafers, 0.35µm–90nm, incl. the 2018 Phase-2 capacity expansion.

Why does it matter?

Together with Zhangjiang S1 and Shenzhen’s 8-inch line (Dec 2014), this is the SMIC legacy-8-inch layer the tracker had entirely missed — a reminder that China’s wafer capacity sits at least as much in 20-year-old fabs as in the headline mega-JVs.

Key Facts

Company SMIC
Type Fab
Category State-Backed
Capability 8-inch (200mm) wafer fab — 0.35µm–90nm; installed ~45,000 wafers/month after Phase-2 expansion, ~60,000 reported at full ramp
Status Operational
Capacity Not yet recorded
Investment Not disclosed
Funding Source Local Govt
Location Tianjin, Tianjin Municipality
Current Node Not yet researched
Entity List Yes — US Commerce BIS (18 Dec 2020)
Equipment Origin Not yet assessed
Last Verified Not recorded (newest source dated Oct 2026)

Technical Complexity

2/5

Technology Node Trajectory

Node history not yet researched.

Project Timeline

  • Nov 2003 — Entity established on the acquired former Motorola Tianjin fab
  • Jul 2018 — Phase-2 expansion first new process equipment moves in (45k→60k wafers/month)

Sources

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