SwaySure (Shenzhen DRAM/Novel Memory Fab) · 深圳市昇维旭技术有限公司
SwaySure Technology Co., Ltd. | Memory
Shenzhen-state-backed memory venture founded March 2022 (registered capital ¥5 billion), led by CEO Liu Xiaoqiang (ex-TSMC fab manager) and initially by CSO Sakamoto Yukio (ex-Elpida CEO); the widely quoted ‘¥300 billion ambition / 140,000 wafers/month’ plan is aspirational and unverified. Its ‘novel memory production line project’ (新型存储器产线) heads Shenzhen’s 2025 major-industrial-project list, and 2025-2026 municipal water-use notices for wet-etch/CMP indicate process equipment is operating at plant level.
Chinese name: 深圳市昇维旭技术有限公司 (Shēnzhèn Shì Shēngwéixù Jìshù Yǒuxiàn Gōngsī)
What does this facility make?
No verified product output yet; reported to target DRAM from 28nm-class nodes and new memory types.
Why does it matter?
Added to the Entity List in the December 2, 2024 round; July 2026 reporting (via FT and reprints) describes it as one of the Huawei-linked ‘Guanlan’-family Shenzhen sites and part of a government-SwaySure-Huawei triangle building 12-inch DRAM capacity — i.e., a key piece of China’s most opaque memory push, with essentially no independently verified output.
Key Facts
| Company | SwaySure Technology Co., Ltd. |
| Type | Memory |
| Category | State-Backed |
| Capability | 12-inch DRAM/novel memory fab, 28nm starting node, long-term plan reported at 140,000 wafers/month |
| Status | Under Construction |
| Capacity | Not yet recorded |
| Investment | Not disclosed |
| Funding Source | Local Govt |
| Location | Shenzhen, Guangdong |
| Current Node | Not yet researched |
| Entity List | Yes — US Commerce BIS (02 Dec 2024) |
| Equipment Origin | Not yet assessed |
| Last Verified | Not recorded (newest source dated Oct 2026) |
Technical Complexity
4.4/5
Technology Node Trajectory
Node history not yet researched.
Project Timeline
- Mar 2022 — Company founded, funded entirely by Shenzhen Industrial Investment Group
- Dec 2024 — Added to the US Commerce Department’s Entity List (SwaySure Technology Co., Ltd.)
- Sep 2025 — Shenzhen lists its novel-memory line among top major industrial projects; process water permits confirm fab-level operations
- Jul 2026 — Reports describe Huawei co-developing the 12-inch DRAM fab (140,000 wafers/month long-term plan, unverified)
Sources
- 昇维旭官网（深圳国资背景，存储芯片研发设计生产） (10 Oct 2026)
- 美国正式将140家中国半导体公司列入实体清单（含SwaySure/昇维旭全名单） (OFweek) (03 Dec 2024)
- 深圳又一座晶圆厂：昇维旭DRAM项目，原Elpida CEO坂本幸雄加盟 (电子工程专辑) (23 Jun 2022)