Texas Instruments Chengdu · 德州仪器半导体制造（成都）有限公司
Texas Instruments | Fab
A Wikipedia cross-check correction: TI Chengdu is NOT a 300mm fab (that common claim conflates the 2017 300mm bumping line). It is TI’s 200mm analog fab, bought in October 2010 from Cension — which SMIC had been operating — plus back-end sites, under a 15-year strategy worth up to $1.69 billion; CDAT2 assembly/test entered production after November 2022.
Chinese name: 德州仪器半导体制造（成都）有限公司 (Dézhōu Yíqì Chéngdū)
What does this facility make?
Analog and power management chips for industrial/automotive markets; packaging and test for TI products.
Why does it matter?
The main foreign-owned wafer fab in western China and the clearest counter-example to the ‘foreign majors are exiting China’ narrative in 2025-26: while TI closes 150mm fabs in the US/Europe, its Chengdu integrated site stays in production, and the tracker’s Chengdu cluster (Intel ATP + TI fab) now matches what actually exists.
Key Facts
| Company | Texas Instruments |
| Type | Fab |
| Category | Foreign-Invested |
| Capability | 200mm analog/power wafer fab (acquired from Cension, formerly SMIC-operated, 2010) + wafer test, assembly/test (CDAT/CDAT2) and a 300mm wafer-bumping line — TI’s first fully-integrated site outside the United States |
| Status | Operational |
| Capacity | Not yet recorded |
| Investment | $1,690M |
| Funding Source | Foreign |
| Location | Chengdu, Sichuan |
| Current Node | Not yet researched |
| Entity List | No |
| Equipment Origin | Not yet assessed |
| Last Verified | Not recorded (newest source dated Nov 2022) |
Technical Complexity
2.5/5
Technology Node Trajectory
Node history not yet researched.
Project Timeline
- Oct 2010 — TI opens its first China manufacturing plant — 200mm fab acquired from Cension (ex-SMIC-operated)
- Apr 2017 — 300mm wafer-bumping (not a wafer fab) facility announced
- Nov 2022 — CDAT2 assembly/test site announced entering production; second A/T building completed 2021-08
Sources
- TI Opens First Semiconductor Manufacturing Plant in China (TI Newsroom) (14 Oct 2010)
- TI buys former SMIC-operated fab in Chengdu (EDN) (15 Oct 2010)
- 进博会：德州仪器成都第二封装测试厂即将投产 (界面新闻) (07 Nov 2022)