Tongfu Microelectronics Nantong · 通富微电
Tongfu Microelectronics Co., Ltd. | Assembly & Packaging
Traces to the state-owned Nantong Transistor Factory; its largest shareholder is the state-linked Nantong Huada Microelectronics Group (18.80% as of June 2026). The Big Fund, which once held as much as 21.72%, has been selling down since 2020 and held 5.00% by June 2026. In 2016, Tongfu and the Big Fund jointly paid $371 million for 85% stakes in AMD’s Suzhou and Penang assembly and test facilities — a rare case of a Chinese OSAT firm acquiring a Western chipmaker’s own packaging plants outright. H1 2026 revenue reached ¥16 billion (+23% YoY) with net profit up 317% YoY to ¥1.72 billion; Q2 2026 net profit alone was ¥1.39 billion, up 346.9% year-on-year.
Chinese name: 通富微电 (Tōngfù Wēidiàn)
What does this facility make?
At Nantong: flip-chip (FC) and system-in-package (SiP) packaging for high-performance computing and communications chips at the Sutong plant, and 8/12-inch wafer-level packaging (copper pillar, solder bump, WLCSP) at the Chongchuan headquarters. Tongfu’s most advanced work, 7nm/5nm FCBGA and chiplet integration for AMD, is done at its Suzhou and Penang subsidiaries (TF-AMD), not in Nantong, according to the company’s 2026 prospectus.
Why does it matter?
One of two mainland Chinese firms in the world’s top five OSAT companies by revenue (JCET is the other) — reporting describes Tongfu as one of three Chinese firms that have begun HBM packaging, a capability central to AI-accelerator supply chains. Tongfu also handles over 80% of AMD’s global CPU/GPU packaging and test orders, with AMD alone accounting for about 52.3% of Tongfu’s total revenue. That dependence cuts both ways: it is the clearest evidence of a Chinese OSAT firm embedded deep in the global AI-memory supply chain, and a concentration risk if AMD diversifies.
Key Facts
| Company | Tongfu Microelectronics Co., Ltd. |
| Type | Assembly & Packaging |
| Category | State-Backed |
| Capability | OSAT — Nantong sites: FC/SiP high-performance packaging and 8/12-inch wafer-level packaging (company-wide: chiplet, HBM) |
| Status | Operational |
| Capacity | 116,700,000 units/month, as of 2025 — theoretical capacity of the HPC/communications packaging business run by 南通通富 (Sutong plant): ~14亿块/yr / 12 = ~116.7M units/month; 2025 utilisation 78.88%. Not total Nantong capacity |
| Investment | $371M |
| Funding Source | Big Fund I |
| Location | Nantong, Jiangsu |
| Current Node | Not applicable (assembly & test) |
| Entity List | No |
| Equipment Origin | Not yet assessed |
| Last Verified | Not recorded (newest source dated Sep 2026) |
Technical Complexity
2.5/5
Packaging Technology Trajectory
- 2025: Nantong Sutong plant: FC/SiP HPC packaging line (2022 issue) built out
- 2026: Nantong Chongchuan HQ: 8/12in wafer-level (Cu pillar, bump, WLCSP), as of
Project Timeline
- Jan 2016 — Tongfu and the Big Fund jointly acquire 85% equity stakes in AMD’s Suzhou and Penang assembly and test facilities for $371 million
- Jul 2026 — Reports H1 2026 revenue of ¥16 billion (+23% YoY) and net profit of ¥1.72 billion (+317% YoY), crediting HBM and AMD-related advanced packaging volume
Sources
- 通富微电石明达：让中国半导体拥有与世界对话的底气 (上海证券报) (25 Feb 2026)
- Tongfu Microelectronics Chairman’s Letter of Gratitude to All Sectors for Completing the Acquisition of 85% Equity in Two AMD Packaging and Testing Facilities (28 Sep 2026)
- 通富微电：上半年归母净利润17.2亿元，同比上升316.8% (东方财富) (28 Aug 2026)
- 通富微电获42.2亿定增 (新浪财经) — AMD/Samsung HBM supply-chain detail (28 Sep 2026)
- 通富微电子股份有限公司2026年度向特定对象发行A股股票募集说明书（注册稿） (03 Jul 2026)
- 从11.72%到5%，大基金逐步退出通富微电，股价不跌反涨创出历史新高 (东方财富) (25 Jun 2026)