UMC Xiamen (United Semiconductor) · 联芯集成电路制造(厦门)有限公司

United Microelectronics Corporation (UMC) | Fab

Southern China’s first 12-inch foundry fab, a UMC joint-venture entity branded United Semiconductor; began volume production in 2016.
Published

October 11, 2026

TipWhy This Matters

Southern China’s first 12-inch foundry fab, a UMC joint-venture entity branded United Semiconductor; began volume production in 2016.

Chinese name: 联芯集成电路制造(厦门)有限公司 (Liánxīn Jíchéng Diànlù Zhìzào (Xiàmén) Yǒuxiàn Gōngsī)

What does this facility make?

12-inch (300mm) wafers at mature/legacy process nodes for foundry customers.

Why does it matter?

A second Taiwanese foundry major (alongside TSMC) with an operating mainland China fab, reinforcing that cross-strait manufacturing links persist in mature-node foundry work even as the leading-edge relationship (TSMC’s most advanced nodes, UMC’s own frontier R&D) stays firmly based in Taiwan.

Key Facts

Company United Microelectronics Corporation (UMC)
Type Fab
Category Foreign-Invested
Capability 12-inch (300mm) wafer foundry, mature/legacy nodes
Status Operational
Capacity Not yet recorded
Investment ¥35亿元
Funding Source Foreign
Location Xiamen, Fujian
Current Node Not yet researched
Entity List No
Equipment Origin Not yet assessed
Last Verified Not recorded (newest source dated Sep 2026)

Technical Complexity

2.5/5

Technology Node Trajectory

Node history not yet researched.

Project Timeline

  • Jan 2016 — Begins volume production as southern China’s first 12-inch foundry fab

Sources


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