United Nova Technology (Shaoxing) · 芯联集成电路制造股份有限公司
United Nova Technology Co., Ltd. (STAR: 688469) | Fab
Grew out of the 2018 SMIC–Shaoxing JV (中芯绍兴/中芯集成, renamed 芯联集成 on its 2022 STAR listing); today China’s leading automotive power-semiconductor foundry — #1 Chinese SiC device maker by 2025 Yole ranking, in the global top-5 MEMS foundries — with 2025 output of 2.51 million 8-inch-equivalent wafers (+24.7%). Phase 3 (12-inch mixed-signal, ¥22.2 billion total, 100,000 wafers/month planned) is ramping from ~30,000/month; Phase 4 (¥20 billion, 50,000 wafers/month for 40/28nm MCU, 90/55nm BCD/DrMOS and 55nm silicon photonics) was announced June 2026.
Chinese name: 芯联集成电路制造股份有限公司 (Xīnlián Jíchéng Diànlù Zhìzào Gǔfèn Yǒuxiàn Gōngsī)
What does this facility make?
Car-grade IGBT/MOSFET and SiC MOSFET chips, MEMS sensors, analog/BCD and mixed-signal chips for EVs, industrial, renewables and AI-server power/optical I/O.
Why does it matter?
Its 8-inch SiC line was China’s first (engineering wafers April 2024, mass production confirmed August 2025) — SiC vehicle main-drive modules are the single highest-value target of China’s power-semi push, and UnitedNova operates the scaled foundry slot for it. No controlling shareholder: largest holders Yuecheng Fund (local state) 13.74% and SMIC Holdings 11.85%.
Key Facts
| Company | United Nova Technology Co., Ltd. (STAR: 688469) |
| Type | Fab |
| Category | State-Backed |
| Capability | 8-inch silicon power (IGBT/MOSFET), MEMS (largest Chinese MEMS wafer foundry), 6/8-inch SiC, and 12-inch mixed-signal/analog — automotive-grade focus |
| Status | Operational |
| Capacity | Not yet recorded |
| Investment | Not disclosed |
| Funding Source | Local Govt |
| Location | Shaoxing, Zhejiang |
| Current Node | Not yet researched |
| Entity List | No |
| Equipment Origin | Not yet assessed |
| Last Verified | Not recorded (newest source dated Jun 2026) |
Technical Complexity
3.9/5
Technology Node Trajectory
Node history not yet researched.
Project Timeline
- Dec 2018 — Founded as the SMIC–Shaoxing joint venture (中芯绍兴)
- Apr 2024 — China’s first 8-inch SiC line produces engineering wafers
- Aug 2025 — 8-inch SiC confirmed in mass production; Phase 3 12-inch line at ~30,000 wafers/month of planned 100,000
- Jun 2026 — ¥20 billion Phase 4 JV announced — 50,000 wafers/month 12-inch for 40/28nm MCU, BCD/DrMOS and 55nm silicon photonics
Sources
- 200亿！芯联集成拟扩产+布局光互连 (财联社) (11 Jun 2026)
- 芯联集成2025年年度报告 (新浪财经公告) (30 Apr 2026)
- 功率半导体代工龙头芯联集成启动200亿元四期项目 (每日经济新闻) (12 Jun 2026)