XMC Wuhan (Wuhan Xinxin) · 武汉新芯集成电路股份有限公司

Wuhan Xinxin Semiconductor Manufacturing Co. (XMC) | Memory

Founded 2006 (managed early on by SMIC) as mainland’s second-constructed 12-inch fab, then the seed plant from which YMTC’s 3D NAND business was spun out i…
Published

October 11, 2026

TipWhy This Matters

Founded 2006 (managed early on by SMIC) as mainland’s second-constructed 12-inch fab, then the seed plant from which YMTC’s 3D NAND business was spun out in 2016; the two remain siblings under CCSH Corporation (长控集团). XMC is the mainland’s largest NOR flash fab (~41% of estimated domestic NOR fab demand in 2023) and the only scaled domestic supplier of wafer-level 3D integration services (TSV/hybrid bonding) — capacity across its two fabs was 531,100 wafers in 2023 and 2024 revenue was ¥4.258 billion (¥42.58亿) per industry coverage.

Chinese name: 武汉新芯集成电路股份有限公司 (Wǔhàn Xīnxīn Jíchéng Diànlù Gǔfèn Yǒuxiàn Gōngsī)

What does this facility make?

NOR flash and MCU wafers, CIS and RF-SOI mixed-signal wafers, and 3D-integration (wafer-stacking/HBM-adjacent) foundry services; March 2024 reports describe an HBM development project (reported, not verified).

Why does it matter?

Added to the US Entity List in the December 2, 2024 package alongside equipment makers — BIS named ‘Wuhan Xinxin Semiconductor Manufacturing’ explicitly. A STAR IPO (¥4.8 billion raise for Fab 3) was accepted September 2024 but formally withdrawn May 2026 the same day YMTC group began IPO tutoring, widely read as clearing the group listing path; its Fab 3 (reported ~¥28 billion project, 50,000 wafers/month) continues construction independent of the IPO, with first structural steel lifted April 2026.

Key Facts

Company Wuhan Xinxin Semiconductor Manufacturing Co. (XMC)
Type Memory
Category State-Backed
Capability 12-inch specialty foundry — NOR flash (mainland’s largest NOR fab), CIS/RF-SOI mixed-signal, and 3D integration (TSV, hybrid bonding, S-stacking/M-stacking wafer-level stacking)
Status Operational
Capacity Not yet recorded
Investment Not disclosed
Funding Source Local Govt
Location Wuhan, Hubei
Current Node NOR flash at 55/65nm class in mass production; 45nm ramping
Entity List Yes — US Commerce BIS (02 Dec 2024)
Equipment Origin Not yet assessed
Last Verified Not recorded (newest source dated Oct 2026)

Technical Complexity

3.5/5

Technology Node Trajectory

  • 2024: NOR flash at 55/65nm class in mass production; 45nm ramping

Project Timeline

  • Aug 2018 — Fab 2 expansion breaks ground (reported ¥13.57 billion)
  • Sep 2024 — STAR Market IPO accepted — ¥4.8 billion raise, ¥4.3 billion earmarked to Fab 3
  • Dec 2024 — Added to the US Commerce Department’s Entity List (140-entity semiconductor round)
  • Apr 2026 — Fab 3 main structure first steel lift
  • May 2026 — IPO withdrawn/terminated by SSE at company request, the same day YMTC group filed IPO tutoring

Sources

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