Yandong Micro / Beidian Integration (Beijing Yizhuang) · 北京燕东微电子股份有限公司 / 北京电控集成电路制造有限公司

Beijing Yandong Microelectronics (STAR: 688172) | Fab

Beijing’s flagship effort (under the ‘芯屏’ strategy, pairing with BOE display demand) to backfill its weak manufacturing base: the Yandong listed company ru…
Published

October 11, 2026

TipWhy This Matters

Beijing’s flagship effort (under the ‘芯屏’ strategy, pairing with BOE display demand) to backfill its weak manufacturing base: the Yandong listed company runs Beijing’s first 8-inch volume line and a ¥7.5 billion ‘domestic-toolset’ 65nm 12-inch specialty line (first wafer April 2023, mass production end-2024); the bigger Beidian Integration (北电集成) 28nm 12-inch fab — ¥33 billion total, ¥20 billion capital — broke ground December 2024, topped out 2025, and took delivery of first equipment 10 December 2025, with company-targeted production start H2 2026.

Chinese name: 北京燕东微电子股份有限公司 / 北京电控集成电路制造有限公司 (Běijīng Yàndōng Wēidiànzǐ)

What does this facility make?

Power/analog/silicon-photonics wafers on 8-inch and 65nm 12-inch; planned 28nm DDIC/mixed-signal/MCU wafers on the Beidian line.

Why does it matter?

One of the most domestic-equipment-heavy 300mm projects in China (NAURA is the headquartered-next-door tool supplier) — a live test of how far a Chinese fab can go on a partially domestic toolset at 28nm.

Key Facts

Company Beijing Yandong Microelectronics (STAR: 688172)
Type Fab
Category State-Backed
Capability 8-inch power/analog line (60,000+ wafers/month, IGBT/MOS/BCD/silicon-photonics) + 65nm 12-inch specialty line (¥7.5 billion, >20,000 wafers/month phase 1) + Beidian Integration 28nm 12-inch line under construction (¥33 billion, 50,000 wafers/month planned)
Status Under Construction
Capacity Not yet recorded
Investment ¥330亿元
Funding Source Local Govt
Location Beijing, Beijing Municipality
Current Node Not yet researched
Entity List No
Equipment Origin Not yet assessed
Last Verified Not recorded (newest source dated Apr 2026)

Technical Complexity

3.9/5

Technology Node Trajectory

Node history not yet researched.

Project Timeline

  • Apr 2023 — 65nm 12-inch specialty line produces first wafer (SBD power device)
  • Dec 2024 — Beidian Integration ¥33 billion 28nm 12-inch line breaks ground in Yizhuang
  • Dec 2025 — First equipment move-in at the Beidian fab; company targets production in H2 2026

Sources


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